JP6938468B2 - グラフェンベースの層転写のためのシステム及び方法 - Google Patents
グラフェンベースの層転写のためのシステム及び方法 Download PDFInfo
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- JP6938468B2 JP6938468B2 JP2018512205A JP2018512205A JP6938468B2 JP 6938468 B2 JP6938468 B2 JP 6938468B2 JP 2018512205 A JP2018512205 A JP 2018512205A JP 2018512205 A JP2018512205 A JP 2018512205A JP 6938468 B2 JP6938468 B2 JP 6938468B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02441—Group 14 semiconducting materials
- H01L21/02444—Carbon, e.g. diamond-like carbon
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02378—Silicon carbide
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02425—Conductive materials, e.g. metallic silicides
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02598—Microstructure monocrystalline
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
- H01L21/02642—Mask materials other than SiO2 or SiN
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02647—Lateral overgrowth
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Nanotechnology (AREA)
- Recrystallisation Techniques (AREA)
- Carbon And Carbon Compounds (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Thin Film Transistor (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562215223P | 2015-09-08 | 2015-09-08 | |
| US62/215,223 | 2015-09-08 | ||
| US201662335784P | 2016-05-13 | 2016-05-13 | |
| US62/335,784 | 2016-05-13 | ||
| US201662361717P | 2016-07-13 | 2016-07-13 | |
| US62/361,717 | 2016-07-13 | ||
| PCT/US2016/050701 WO2017044577A1 (en) | 2015-09-08 | 2016-09-08 | Systems and methods for graphene based layer transfer |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018535536A JP2018535536A (ja) | 2018-11-29 |
| JP2018535536A5 JP2018535536A5 (enExample) | 2019-11-21 |
| JP6938468B2 true JP6938468B2 (ja) | 2021-09-22 |
Family
ID=58240052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018512205A Active JP6938468B2 (ja) | 2015-09-08 | 2016-09-08 | グラフェンベースの層転写のためのシステム及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10770289B2 (enExample) |
| EP (2) | EP4105966A3 (enExample) |
| JP (1) | JP6938468B2 (enExample) |
| KR (2) | KR102809444B1 (enExample) |
| CN (2) | CN119349566A (enExample) |
| WO (1) | WO2017044577A1 (enExample) |
Families Citing this family (51)
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| WO2018089444A1 (en) | 2016-11-08 | 2018-05-17 | Massachusetts Institute Of Technology | Systems and methods of dislocation filtering for layer transfer |
| WO2018156877A1 (en) | 2017-02-24 | 2018-08-30 | Massachusetts Institute Of Technology | Apparatus and methods for curved focal plane array |
| WO2018156876A1 (en) | 2017-02-24 | 2018-08-30 | Kim, Jeehwan | Methods and apparatus for vertically stacked multicolor light-emitting diode (led) display |
| US20200043790A1 (en) * | 2017-04-18 | 2020-02-06 | Massachusetts Institute Of Technology | Systems and methods for fabricating semiconductor devices via remote epitaxy |
| WO2018195412A1 (en) * | 2017-04-21 | 2018-10-25 | Massachusetts Institute Of Technology | Systems and methods for fabricating photovoltaic devices via remote epitaxy |
| WO2019099461A1 (en) * | 2017-11-14 | 2019-05-23 | Massachusetts Institute Of Technology | Epitaxial growth and transfer via patterned two-dimensional (2d) layers |
| CN108517555B (zh) * | 2017-12-29 | 2020-08-04 | 西安电子科技大学 | 基于范德华外延获得大面积高质量柔性自支撑单晶氧化物薄膜的方法 |
| CN108767659A (zh) * | 2018-06-04 | 2018-11-06 | 清华大学 | 一种利用二维材料隔层外延生长激光器的方法 |
| US20210125826A1 (en) * | 2018-06-22 | 2021-04-29 | Massachusetts Institute Of Technology | Systems and methods for growth of silicon carbide over a layer comprising graphene and/or hexagonal boron nitride and related articles |
| CN109166881B (zh) * | 2018-07-25 | 2020-09-29 | 深圳市华星光电半导体显示技术有限公司 | 柔性显示装置及其制备方法 |
| CN109166790B (zh) * | 2018-07-28 | 2022-04-22 | 西安交通大学 | 一种利用金属应力层剥离石墨烯上钙钛矿氧化物压电薄膜的方法 |
| US11355393B2 (en) | 2018-08-23 | 2022-06-07 | Massachusetts Institute Of Technology | Atomic precision control of wafer-scale two-dimensional materials |
| CN112740359B (zh) * | 2018-10-02 | 2022-07-12 | 株式会社菲尔尼克斯 | 半导体元件的制造方法及半导体基板 |
| WO2020072867A1 (en) * | 2018-10-05 | 2020-04-09 | Massachusetts Institute Of Technology | Methods, apparatus, and systems for remote epitaxy using stitched graphene |
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| US20180197736A1 (en) | 2018-07-12 |
| JP2018535536A (ja) | 2018-11-29 |
| CN119349566A (zh) | 2025-01-24 |
| EP3347914A4 (en) | 2019-09-25 |
| KR20180051602A (ko) | 2018-05-16 |
| EP4105966A3 (en) | 2023-06-21 |
| WO2017044577A1 (en) | 2017-03-16 |
| EP3347914A1 (en) | 2018-07-18 |
| KR102809444B1 (ko) | 2025-05-19 |
| CN108140552A (zh) | 2018-06-08 |
| KR20250076667A (ko) | 2025-05-29 |
| EP4105966A2 (en) | 2022-12-21 |
| US10770289B2 (en) | 2020-09-08 |
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