JP6934127B1 - めっき装置、プリウェット処理方法及び洗浄処理方法 - Google Patents

めっき装置、プリウェット処理方法及び洗浄処理方法 Download PDF

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Publication number
JP6934127B1
JP6934127B1 JP2021518979A JP2021518979A JP6934127B1 JP 6934127 B1 JP6934127 B1 JP 6934127B1 JP 2021518979 A JP2021518979 A JP 2021518979A JP 2021518979 A JP2021518979 A JP 2021518979A JP 6934127 B1 JP6934127 B1 JP 6934127B1
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module
substrate
plating
nozzles
substrate holder
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JPWO2022137339A1 (https=
Inventor
紹華 張
紹華 張
関　正也
正也 関
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
JP2021518979A 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法 Active JP6934127B1 (ja)

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PCT/JP2020/047931 WO2022137339A1 (ja) 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法

Publications (2)

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JP6934127B1 true JP6934127B1 (ja) 2021-09-08
JPWO2022137339A1 JPWO2022137339A1 (https=) 2022-06-30

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US (1) US12054840B2 (https=)
JP (1) JP6934127B1 (https=)
KR (1) KR102338157B1 (https=)
CN (1) CN114981486B (https=)
WO (1) WO2022137339A1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7029579B1 (ja) * 2021-09-10 2022-03-03 株式会社荏原製作所 めっき装置及びリンス処理方法
JP7047200B1 (ja) * 2021-11-04 2022-04-04 株式会社荏原製作所 めっき装置および基板洗浄方法
JP7089133B1 (ja) * 2021-11-04 2022-06-21 株式会社荏原製作所 めっき装置および基板洗浄方法
TWI775670B (zh) * 2021-11-11 2022-08-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
JP7162787B1 (ja) * 2022-06-17 2022-10-28 株式会社荏原製作所 めっき装置
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置
CN115715337A (zh) * 2021-10-14 2023-02-24 株式会社荏原制作所 预湿处理方法
TWI803048B (zh) * 2021-11-11 2023-05-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
CN116324046A (zh) * 2021-11-04 2023-06-23 株式会社荏原制作所 镀覆装置及触点清洗方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102848412B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치
KR102848406B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치 및 이의 제어방법

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JP2003027291A (ja) * 2001-07-10 2003-01-29 Tokyo Electron Ltd 液処理装置および液処理方法
JP2008308709A (ja) * 2007-06-13 2008-12-25 Panasonic Corp 半導体装置の製造方法及び製造装置
JP2011089209A (ja) * 2010-12-17 2011-05-06 Renesas Electronics Corp 半導体製造装置の動作方法及び半導体装置の製造方法
JP2015023048A (ja) * 2013-07-16 2015-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2016058665A (ja) * 2014-09-12 2016-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置

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US7189647B2 (en) * 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
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JP2005163080A (ja) 2003-12-01 2005-06-23 Toshiba Corp めっき装置及びめっき方法
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
JP4695567B2 (ja) * 2006-09-04 2011-06-08 株式会社東設 ウエハー洗浄方法及びその装置
CN203245737U (zh) * 2013-05-14 2013-10-23 中芯国际集成电路制造(北京)有限公司 多功能研磨液供应结构及研磨装置
JP5815827B2 (ja) * 2014-10-10 2015-11-17 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
JP6336022B1 (ja) * 2016-12-19 2018-06-06 株式会社荏原製作所 めっき装置、めっき方法、及びコンピュータ読み取り可能な記録媒体
JP7014553B2 (ja) * 2017-09-22 2022-02-01 株式会社荏原製作所 めっき装置
JP7291030B2 (ja) 2018-09-06 2023-06-14 株式会社荏原製作所 基板処理装置

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JP2003027291A (ja) * 2001-07-10 2003-01-29 Tokyo Electron Ltd 液処理装置および液処理方法
JP2008308709A (ja) * 2007-06-13 2008-12-25 Panasonic Corp 半導体装置の製造方法及び製造装置
JP2011089209A (ja) * 2010-12-17 2011-05-06 Renesas Electronics Corp 半導体製造装置の動作方法及び半導体装置の製造方法
JP2015023048A (ja) * 2013-07-16 2015-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2016058665A (ja) * 2014-09-12 2016-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置

Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12084783B2 (en) 2021-09-10 2024-09-10 Ebara Corporation Plating apparatus and rinse process method
CN114746586A (zh) * 2021-09-10 2022-07-12 株式会社荏原制作所 镀覆装置以及冲洗处理方法
JP7029579B1 (ja) * 2021-09-10 2022-03-03 株式会社荏原製作所 めっき装置及びリンス処理方法
WO2023037495A1 (ja) * 2021-09-10 2023-03-16 株式会社荏原製作所 めっき装置及びリンス処理方法
KR102467233B1 (ko) * 2021-09-10 2022-11-16 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 린스 처리 방법
CN115715337A (zh) * 2021-10-14 2023-02-24 株式会社荏原制作所 预湿处理方法
CN115715337B (zh) * 2021-10-14 2023-09-08 株式会社荏原制作所 预湿处理方法
KR20230066270A (ko) 2021-11-04 2023-05-15 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판 세정 방법
KR102556645B1 (ko) * 2021-11-04 2023-07-18 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판 세정 방법
KR102499962B1 (ko) 2021-11-04 2023-02-16 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 기판 세정 방법
CN115461499A (zh) * 2021-11-04 2022-12-09 株式会社荏原制作所 镀覆装置及基板清洗方法
US12606929B2 (en) 2021-11-04 2026-04-21 Ebara Corporation Plating apparatus and substrate cleaning method
WO2023079634A1 (ja) * 2021-11-04 2023-05-11 株式会社荏原製作所 めっき装置および基板洗浄方法
WO2023079632A1 (ja) * 2021-11-04 2023-05-11 株式会社荏原製作所 めっき装置および基板洗浄方法
US12378689B2 (en) 2021-11-04 2025-08-05 Ebara Corporation Plating apparatus and contact cleaning method
US12264406B2 (en) 2021-11-04 2025-04-01 Ebara Corporation Plating apparatus and substrate cleaning method
CN116324046A (zh) * 2021-11-04 2023-06-23 株式会社荏原制作所 镀覆装置及触点清洗方法
CN116368268A (zh) * 2021-11-04 2023-06-30 株式会社荏原制作所 镀覆装置及基板清洗方法
JP7047200B1 (ja) * 2021-11-04 2022-04-04 株式会社荏原製作所 めっき装置および基板洗浄方法
JP7089133B1 (ja) * 2021-11-04 2022-06-21 株式会社荏原製作所 めっき装置および基板洗浄方法
CN116324046B (zh) * 2021-11-04 2024-08-02 株式会社荏原制作所 镀覆装置及触点清洗方法
CN116368268B (zh) * 2021-11-04 2024-02-13 株式会社荏原制作所 镀覆装置及基板清洗方法
TWI803048B (zh) * 2021-11-11 2023-05-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
TWI775670B (zh) * 2021-11-11 2022-08-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
WO2023243079A1 (ja) * 2022-06-17 2023-12-21 株式会社荏原製作所 めっき装置
JP7162787B1 (ja) * 2022-06-17 2022-10-28 株式会社荏原製作所 めっき装置
WO2024028973A1 (ja) * 2022-08-02 2024-02-08 株式会社荏原製作所 めっき方法、及び、めっき装置
KR102595617B1 (ko) * 2022-08-02 2023-10-31 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치
JP7199618B1 (ja) * 2022-08-02 2023-01-05 株式会社荏原製作所 めっき方法、及び、めっき装置
CN119013440A (zh) * 2022-08-02 2024-11-22 株式会社荏原制作所 镀覆方法以及镀覆装置
US12351933B2 (en) 2022-08-02 2025-07-08 Ebara Corporation Plating method and plating apparatus

Also Published As

Publication number Publication date
US12054840B2 (en) 2024-08-06
WO2022137339A1 (ja) 2022-06-30
US20220396897A1 (en) 2022-12-15
CN114981486B (zh) 2023-03-24
JPWO2022137339A1 (https=) 2022-06-30
KR102338157B1 (ko) 2021-12-10
CN114981486A (zh) 2022-08-30

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