WO2022137339A1 - めっき装置、プリウェット処理方法及び洗浄処理方法 - Google Patents

めっき装置、プリウェット処理方法及び洗浄処理方法 Download PDF

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Publication number
WO2022137339A1
WO2022137339A1 PCT/JP2020/047931 JP2020047931W WO2022137339A1 WO 2022137339 A1 WO2022137339 A1 WO 2022137339A1 JP 2020047931 W JP2020047931 W JP 2020047931W WO 2022137339 A1 WO2022137339 A1 WO 2022137339A1
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WIPO (PCT)
Prior art keywords
module
plating
substrate
nozzles
substrate holder
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Ceased
Application number
PCT/JP2020/047931
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English (en)
French (fr)
Japanese (ja)
Inventor
紹華 張
正也 関
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Ebara Corp
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Ebara Corp
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Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to KR1020217034766A priority Critical patent/KR102338157B1/ko
Priority to JP2021518979A priority patent/JP6934127B1/ja
Priority to PCT/JP2020/047931 priority patent/WO2022137339A1/ja
Priority to CN202080034254.9A priority patent/CN114981486B/zh
Priority to US17/612,024 priority patent/US12054840B2/en
Publication of WO2022137339A1 publication Critical patent/WO2022137339A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Definitions

  • the present invention relates to a plating apparatus, a pre-wet treatment method and a cleaning treatment method.
  • Such a plating apparatus includes a plating tank in which an anode is arranged, a substrate holder which is arranged above the anode and holds a substrate as a cathode, and a rotation mechanism for rotating the substrate holder.
  • a pre-wet treatment for wetting the substrate with a predetermined treatment liquid is executed before the substrate is plated (that is, before the plating treatment is executed), or a predetermined treatment liquid is executed after the plating treatment is executed.
  • a cleaning process for cleaning the substrate is performed in the above (see, for example, Patent Document 2).
  • a plating module having a plating tank, a substrate holder, and a rotation mechanism to execute a plating process, a pre-wet module to execute a pre-wet process, and a cleaning process to execute a cleaning process are described.
  • a plating device with a module is disclosed.
  • the present invention has been made in view of the above, and one of the objects of the present invention is to provide a technique capable of downsizing the plating apparatus.
  • the plating apparatus includes a plating tank in which an anode is arranged, a substrate holder which is arranged above the anode and holds a substrate as a cathode, and the substrate.
  • a plating apparatus having a plating module provided with a rotation mechanism for rotating a holder, wherein the plating module discharges a predetermined processing liquid toward the lower surface of the substrate held by the substrate holder.
  • the discharge module has a module body having a plurality of nozzles for discharging the treatment liquid upward, and a rotation shaft arranged next to the plating tank and connected to the module body.
  • a moving mechanism for moving the module body by rotating the rotation axis includes a first position where the module body is not between the substrate and the anode, and the module body is the module body.
  • the module body is moved between the substrate and the second position where the treatment liquid discharged from the plurality of nozzles abuts on the lower surface of the substrate, and the plurality of nozzles are moved.
  • the processing liquid discharged from the plurality of nozzles is arranged so as to abut from the center portion of the lower surface of the substrate to the outer peripheral edge portion, and the module main body is arranged.
  • a recovery member configured to recover the treatment liquid that has been ejected from the plurality of nozzles and has come into contact with the lower surface of the substrate and then has fallen.
  • the pre-wet processing is executed by moving the module main body from the first position to the second position by the moving mechanism and discharging the processing liquid from a plurality of nozzles while rotating the substrate holder by the rotating mechanism. Or can perform a cleaning process. Therefore, according to this aspect, the pre-wet treatment and the cleaning treatment can be performed without providing the pre-wet module and the cleaning module separately from the plating module. As a result, the size of the plating device can be reduced as compared with the conventional plating device in which the pre-wet module and the cleaning module are provided separately from the plating module.
  • the treatment liquid can be brought into contact with the entire surface from the central portion of the lower surface of the substrate to the outer peripheral edge portion to wet or clean the lower surface of the substrate as a whole. Further, according to this aspect, since the dropped treatment liquid can be recovered by the recovery member, it is possible to prevent the dropped treatment liquid from entering the inside of the plating tank.
  • the module main body extends in a direction away from the rotation axis in a plan view, and a plurality of the plurality of nozzles are arranged in a plan view in the extending direction of the module main body.
  • a plurality of modules may be arranged in a direction perpendicular to the extending direction of the module body.
  • the recovery member may include a recess formed on the upper surface of the module body, and the plurality of nozzles may be arranged in the recess.
  • the treatment liquid may be pure water.
  • the pre-wet treatment method according to one aspect of the present invention is a pre-wet treatment method using the plating apparatus according to any one of the above aspects 1 to 4, and is the substrate.
  • a pre-wet process of wetting the lower surface of the substrate with the treatment liquid is included, and the pre-wet process is performed by the moving mechanism. This includes moving the module main body from the first position to the second position, and discharging the treatment liquid from the plurality of nozzles while rotating the substrate holder by the rotation mechanism.
  • the pre-wet process can be performed without providing the pre-wet module separately from the plating module, plating is performed as compared with the conventional plating apparatus having the pre-wet module separately from the plating module.
  • the size of the device can be reduced.
  • the plating apparatus further includes a tilting mechanism for tilting the substrate holder, and the pre-wet treatment is performed on the outer peripheral edge of the substrate holder when the treatment liquid is discharged from the plurality of nozzles.
  • the tilting mechanism may include tilting the substrate holder so that the portion near the rotation axis is located below the portion far from the rotation axis. According to this aspect, it is possible to effectively prevent the treatment liquid that has fallen after being discharged from the nozzle from entering the inside of the plating tank.
  • the cleaning treatment method according to one aspect of the present invention is a cleaning treatment method using the plating apparatus according to any one of the above aspects 1 to 4, and the substrate holder is used.
  • the cleaning process includes cleaning the lower surface of the substrate with the treatment liquid, and the cleaning process includes the module main body by the moving mechanism. This includes moving the substrate holder from the first position to the second position and discharging the treatment liquid from the plurality of nozzles while rotating the substrate holder by the rotation mechanism.
  • the size of the plating apparatus is smaller than that of the conventional plating apparatus having the cleaning module separately from the plating module. Can be achieved.
  • the plating apparatus further includes a tilting mechanism for tilting the substrate holder, and the cleaning process is performed on the outer peripheral edge of the substrate holder when the treatment liquid is discharged from the plurality of nozzles.
  • the tilting mechanism may include tilting the substrate holder so that the location near the axis of rotation is located below the location far from the axis of rotation. According to this aspect, it is possible to effectively prevent the treatment liquid that has fallen after being discharged from the nozzle from entering the inside of the plating tank.
  • FIG. 4 (A) and 4 (B) are schematic plan views of the discharge module according to the embodiment. It is a schematic diagram which shows the whole structure of the discharge module which concerns on embodiment. It is sectional drawing which shows typically the cross section of A2-A2 line of FIG. It is a schematic diagram of the peripheral structure of the substrate holder at the time of execution of the pre-wet treatment or the cleaning treatment which concerns on modification 3 of embodiment.
  • FIG. 1 is a perspective view showing the overall configuration of the plating apparatus 1000 of the present embodiment.
  • FIG. 2 is a plan view showing the overall configuration of the plating apparatus 1000 of the present embodiment.
  • the plating apparatus 1000 includes a load port 100, a transfer robot 110, an aligner 120, a pre-soak module 300, a plating module 400, a spin rinse dryer 600, a transfer device 700, and a control module 800.
  • the plating module 400 according to the present embodiment includes a discharge module 50, the illustration of the discharge module 50 is omitted in FIG. 1.
  • the load port 100 is a module for carrying in a substrate housed in a cassette such as FOUP (not shown in the plating apparatus 1000) or for carrying out the substrate from the plating apparatus 1000 to the cassette.
  • a cassette such as FOUP (not shown in the plating apparatus 1000)
  • four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary.
  • the transport robot 110 is a robot for transporting the substrate, and is configured to transfer the substrate between the load port 100, the aligner 120, and the transport device 700. When the transfer robot 110 and the transfer device 700 transfer the substrate between the transfer robot 110 and the transfer device 700, the transfer robot 110 and the transfer device 700 can transfer the substrate via a temporary stand (not shown).
  • the aligner 120 is a module for aligning the positions of the orientation flat and the notch of the substrate in a predetermined direction.
  • the two aligners 120 are arranged side by side in the horizontal direction, but the number and arrangement of the aligners 120 are arbitrary.
  • the pre-soak module 300 cleans the surface of the plating base by, for example, etching and removing an oxide film having a large electric resistance existing on the surface of the seed layer formed on the surface to be plated of the substrate before the plating treatment with a treatment liquid such as sulfuric acid or hydrochloric acid. Alternatively, it is configured to be subjected to a pre-soak treatment that activates it.
  • the two pre-soak modules 300 are arranged side by side in the vertical direction, but the number and arrangement of the pre-soak modules 300 are arbitrary.
  • the plating module 400 applies a plating process to the substrate. In the present embodiment, there are two sets of 12 plating modules 400 arranged three in the vertical direction and four in the horizontal direction, and a total of 24 plating modules 400 are provided. However, the plating module 400 is provided. The number and arrangement of are arbitrary.
  • the spin rinse dryer 600 is a module for rotating the substrate after the cleaning treatment at high speed to dry it.
  • the transport device 700 is a device for transporting a substrate between a plurality of modules in the plating device 1000.
  • the control module 800 is configured to control a plurality of modules of the plating apparatus 1000, and can be configured from a general computer or a dedicated computer having an input / output interface with an operator, for example.
  • the discharge module 50 is a pre-wet that replaces the air inside the pattern formed on the substrate surface with the treatment liquid PL by wetting the lower surface (plated surface) of the substrate before the execution of the plating treatment with a predetermined treatment liquid PL. It is a module for executing processing. Further, the discharge module 50 is also a module for executing a cleaning process of cleaning the lower surface of the substrate with the processing liquid PL after the plating process is executed in order to remove the plating solution and the like remaining on the substrate after the plating process is executed. be. As described above, the discharge module 50 according to the present embodiment has functions as a pre-wet module and a cleaning module. Details of the discharge module 50 will be described later.
  • the substrate housed in the cassette is carried into the load port 100.
  • the transfer robot 110 takes out the board from the cassette of the load port 100 and transfers the board to the aligner 120.
  • the aligner 120 aligns the orientation flat, the notch, and the like of the substrate in a predetermined direction.
  • the transfer robot 110 transfers the substrate oriented by the aligner 120 to the transfer device 700.
  • the transfer device 700 transfers the substrate received from the transfer robot 110 to the plating module 400.
  • the discharge module 50 applies a pre-wet treatment to the substrate.
  • the transport device 700 transports the pre-wet-treated substrate to the pre-soak module 300.
  • the pre-soak module 300 applies a pre-soak treatment to the substrate.
  • the transport device 700 transports the pre-soaked substrate to the plating module 400.
  • the plating module 400 applies a plating process to the substrate.
  • the discharge module 50 performs a cleaning process on the substrate.
  • the transport device 700 transports the cleaned substrate to the spin rinse dryer 600.
  • the substrate is dried.
  • the transfer device 700 transfers the dried substrate to the transfer robot 110.
  • the transfer robot 110 transfers the board received from the transfer device 700 to the cassette of the load port 100.
  • the cassette containing the substrate is carried out from the load port 100.
  • the configuration of the plating apparatus 1000 described with reference to FIGS. 1 and 2 is only an example, and the configuration of the plating apparatus 1000 is not limited to the configuration of FIGS. 1 and 2.
  • plating module 400 Since the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same configuration, one plating module 400 will be described.
  • FIG. 3 is a diagram for explaining the configuration of the plating module 400 of the plating apparatus 1000 according to the present embodiment.
  • the plating device 1000 according to the present embodiment is a cup-type plating device.
  • the plating module 400 of the plating apparatus 1000 according to the present embodiment illustrated in FIG. 3 mainly includes a plating tank 10, an overflow tank 20, a substrate holder 30, a rotation mechanism 40, an elevating mechanism 45, and an inclination mechanism 47. And have.
  • the plating module 400 also includes the discharge module 50, but the discharge module 50 is not shown in FIG. Further, in FIG. 3, the plating tank 10, the overflow tank 20, and the substrate holder 30 are schematically shown in cross section.
  • the plating tank 10 is composed of a bottomed container having an opening at the top. Specifically, the plating tank 10 has a bottom wall portion 10a and an outer peripheral wall portion 10b extending upward from the outer peripheral edge of the bottom wall portion 10a, and the upper portion of the outer peripheral wall portion 10b is open. is doing.
  • the shape of the outer peripheral wall portion 10b of the plating tank 10 is not particularly limited, but the outer peripheral wall portion 10b according to the present embodiment has a cylindrical shape as an example.
  • the plating solution Ps may be any solution containing ions of a metal element constituting the plating film, and specific examples thereof are not particularly limited.
  • the copper plating treatment is used as an example of the plating treatment, and the copper sulfate solution is used as an example of the plating liquid Ps.
  • the plating solution Ps contains a predetermined additive.
  • the configuration is not limited to this, and the plating solution Ps may have a configuration that does not contain additives.
  • the anode 11 is arranged inside the plating tank 10.
  • the specific type of the anode 11 is not particularly limited, and a dissolved anode or an insoluble anode can be used.
  • an insoluble anode is used as an example of the anode 11.
  • the specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, or the like can be used.
  • the diaphragm 12 is arranged above the anode 11. Specifically, the diaphragm 12 is arranged at a position between the anode 11 and the substrate Wf. As an example, the diaphragm 12 according to the present embodiment is connected to the outer peripheral wall portion 10b of the plating tank 10 via the holding member 10d. Further, the diaphragm 12 according to the present embodiment is arranged so that the plane direction of the diaphragm 12 is the horizontal direction.
  • the inside of the plating tank 10 is divided into two in the vertical direction by the diaphragm 12.
  • the region defined below the diaphragm 12 is referred to as an anode chamber 13.
  • the region above the diaphragm 12 is referred to as the cathode chamber 14.
  • the anode 11 described above is arranged in the anode chamber 13.
  • the diaphragm 12 is composed of a film that allows the passage of metal ions and suppresses the passage of additives contained in the plating solution Ps. That is, in the present embodiment, the plating solution in the cathode chamber 14 contains an additive, but the plating solution Ps in the anode chamber 13 does not contain an additive. However, the configuration is not limited to this, and for example, the plating solution Ps in the anode chamber 13 may also contain an additive. However, even in this case, the concentration of the additive in the anode chamber 13 is lower than the concentration of the additive in the cathode chamber 14.
  • the specific type of the diaphragm 12 is not particularly limited, and a known diaphragm can be used.
  • an electrolytic diaphragm can be used, and as a specific example of the electrolytic diaphragm, for example, an electrolytic diaphragm for plating manufactured by Yuasa Membrane System Co., Ltd. may be used, an ion exchange membrane or the like may be used. It can be used.
  • the plating tank 10 is provided with an anode supply port 15 for supplying the plating solution Ps to the anode chamber 13. Further, the plating tank 10 is provided with an anode discharge port 16 for discharging the plating solution Ps of the anode chamber 13 from the anode chamber 13. The plating solution Ps discharged from the anode discharge port 16 is then temporarily stored in a reservoir tank for the anode (not shown), and then supplied again from the anode supply port 15 to the anode chamber 13.
  • the plating tank 10 is provided with a cathode supply port 17 for supplying the plating solution Ps to the cathode chamber 14.
  • a protruding portion 10c protruding toward the center of the plating tank 10 is provided in a part of the portion corresponding to the cathode chamber 14 in the outer peripheral wall portion 10b of the plating tank 10 according to the present embodiment.
  • a cathode supply port 17 is provided in the protruding portion 10c.
  • the overflow tank 20 is composed of a bottomed container arranged outside the plating tank 10.
  • the overflow tank 20 is a tank provided for temporarily storing the plating liquid Ps (that is, the plating liquid Ps overflowing from the plating tank 10) beyond the upper end of the outer peripheral wall portion 10b of the plating tank 10.
  • the plating solution Ps supplied from the cathode supply port 17 to the cathode chamber 14 flows into the overflow tank 20 and then is discharged from the overflow tank 20 discharge port (not shown), and is discharged from the cathode reservoir tank (Fig.). (Not shown) is temporarily stored. After that, the plating solution Ps is supplied again to the cathode chamber 14 from the cathode supply port 17.
  • a porous resistor 18 is arranged in the cathode chamber 14 in the present embodiment. Specifically, the resistor 18 according to the present embodiment is provided near the upper end portion of the protruding portion 10c.
  • the resistor 18 is composed of a porous plate member having a plurality of pores (pores).
  • the resistor 18 is a member provided for uniformizing the electric field formed between the anode 11 and the substrate Wf.
  • the anode mask 19 is arranged in the anode chamber 13.
  • the anode mask 19 according to the present embodiment is arranged so that the upper surface of the anode mask 19 comes into contact with the lower surface of the diaphragm 12.
  • the location where the anode mask 19 is arranged may be any as long as it is the anode chamber 13, and is not limited to the location shown in FIG.
  • the anode mask 19 may be arranged at a position below the diaphragm 12 so as to have a space between the anode mask 19 and the diaphragm 12.
  • the anode mask 19 has an opening 19a through which electricity flowing between the anode 11 and the substrate Wf passes.
  • the substrate holder 30 is a member for holding the substrate Wf as a cathode.
  • the lower surface Wfa of the substrate Wf corresponds to the surface to be plated.
  • the board holder 30 is connected to the rotation mechanism 40.
  • the rotation mechanism 40 is a mechanism for rotating the substrate holder 30.
  • As the rotation mechanism 40 a known mechanism such as a rotation motor can be used.
  • the rotation mechanism 40 is connected to the elevating mechanism 45.
  • the elevating mechanism 45 is supported by a support shaft 46 extending in the vertical direction.
  • the elevating mechanism 45 is a mechanism for elevating and lowering the substrate holder 30, the rotation mechanism 40, and the tilting mechanism 47 in the vertical direction.
  • As the elevating mechanism 45 a known elevating mechanism such as a linear acting actuator can be used.
  • the tilting mechanism 47 is a mechanism for tilting the substrate holder 30 and the rotating mechanism 40.
  • As the tilting mechanism 47 a known tilting mechanism such as a piston / cylinder can be used.
  • the rotation mechanism 40 rotates the substrate holder 30, and the elevating mechanism 45 moves the substrate holder 30 downward to immerse the substrate Wf in the plating solution Ps of the plating tank 10.
  • a plating film is formed (that is, a plating treatment is applied) on the lower surface Wfa of the substrate Wf.
  • the operation of the plating module 400 is controlled by the control module 800.
  • the control module 800 includes a microcomputer, which includes a CPU (Central Processing Unit) 801 as a processor, a storage unit 802 as a non-temporary storage medium, and the like.
  • the CPU 801 controls the operation of the plating module 400 based on the command of the program stored in the storage unit 802.
  • one control module 800 functions as a control device that integrally controls the controlled unit of the plating module 400, but the configuration is not limited to this.
  • the control module 800 includes a plurality of control devices, and each of the plurality of control devices may individually control each controlled unit of the plating module 400.
  • FIG. 4 (A) and 4 (B) are schematic plan views of the discharge module 50.
  • FIG. 4A shows a state in which the module main body 51 described later of the discharge module 50 is in the first position
  • FIG. 4B shows a state in which the module main body 51 is in the second position. ..
  • the plating tank 10 is also shown in FIGS. 4A and 4B, but the internal configuration of the plating tank 10 is not shown.
  • FIG. 5 is a schematic diagram showing the overall configuration of the discharge module 50.
  • the module main body 51 and the rotating shaft 61 of the discharge module 50 are schematically shown in cross section taken along the line A1-A1 of FIG. 4 (B).
  • FIG. 5 is a cross-sectional view schematically showing the cross section taken along the line A2-A2 of FIG.
  • the discharge module 50 will be described as follows with reference to these figures.
  • the discharge module 50 mainly includes a module main body 51, a moving mechanism 60, a pump (pump 70a and pump 70b), a reservoir tank (reservoir tank 71a and a reservoir tank 71b), and piping (piping). 72a and pipe 72b) are provided.
  • the module main body 51 has a shape extending in a direction away from the rotation axis 61 described later in a plan view (top view). have. Specifically, the module main body 51 has a rectangular shape having a long side in a direction away from the rotation axis 61 and a short side in a direction perpendicular to the long side. As shown in FIGS. 4A, 4B, 5 and 6, the module main body 51 includes at least one nozzle 52 for discharging the processing liquid PL upward. Further, the module main body 51 according to the present embodiment also includes a recovery member 53.
  • the number of nozzles 52 according to this embodiment is a plurality.
  • the plurality of nozzles 52 according to the present embodiment are arranged in a plurality (5 as an example) in the extending direction (longitudinal direction) of the module main body 51, and are arranged in a direction perpendicular to the extending direction (5 in the extending direction).
  • a plurality (two as an example) are also arranged in the lateral direction (or width direction).
  • the two nozzles 52 arranged in the lateral direction sandwich the central axis XL of the recess 54 described later in a cross-sectional view obtained by cutting the module main body 51 in the lateral direction.
  • the total number of the plurality of nozzles 52 according to the present embodiment is 10.
  • the number of nozzles 52 is not limited to this, and may be less than 10 or may be larger.
  • each nozzle 52 is configured to inject the treatment liquid PL upward at a wide angle (that is, in a fan shape). Specifically, each nozzle 52 has a discharge port for injecting the treatment liquid PL at a wide angle, and the treatment liquid PL is ejected upward at a wide angle from this discharge port.
  • the treatment liquid PL discharged from the nozzle 52 may be any liquid that can perform pre-wet treatment and cleaning treatment, and the specific type thereof is not particularly limited, but in the present embodiment, a specific example is used.
  • Pure water is used as the water.
  • the pure water for example, it is preferable to use one having an electrical resistivity of "0.1 (M ⁇ ⁇ cm)" or more.
  • pure water from which air has been degassed that is, degassed pure water
  • pure water that has not been degassed may be used, or pure water from which ions have been removed. Water (ie, deionized water) may be used.
  • the moving mechanism 60 is a mechanism for moving the module main body 51.
  • the module main body 51 is the "first position (FIG. 4 (A))" in which the module main body 51 is not between the substrate Wf and the anode 11, and the module main body 51 is the substrate Wf.
  • the processing liquid PL located between the anode 11 and the anode 11 and discharged from the nozzle 52 is moved between the "second position (FIG. 4 (B))" where the processing liquid PL is in contact with the lower surface Wfa of the substrate Wf. It is configured.
  • the second position is specifically such that the nozzle 52 is located directly below the lower surface Wfa of the substrate Wf, in other words, the nozzle 52 faces the lower surface Wfa of the substrate Wf. It is also a position to do.
  • the moving mechanism 60 includes a rotating shaft 61 and an actuator 62.
  • the rotating shaft 61 is arranged next to the plating tank 10. Further, the rotating shaft 61 is connected to the module main body 51.
  • the actuator 62 is a device for driving the rotating shaft 61.
  • the rotation shaft 61 rotates about the Z axis.
  • the rotation of the rotating shaft 61 driven by the actuator 62 causes the module body 51 to move between the first position and the second position.
  • the actuator 62 for example, a known actuator including a motor capable of rotating in one rotation direction and the other rotation direction (that is, a motor capable of forward rotation and reverse rotation) and the like can be used. ..
  • the operation of the actuator 62 is controlled by the control module 800.
  • a supply flow path 73 and a discharge flow path 74 are provided inside the module main body 51 and the inside of the rotating shaft 61 according to the present embodiment.
  • the supply flow path 73 and the discharge flow path 74 may not pass through the inside of the rotating shaft 61, but may pass through the outside of the rotating shaft 61 and be connected to the pipes (pipes 72a, 72b) described later. ..
  • the supply flow path 73 is a flow path for the processing liquid PL supplied to the nozzle 52 to flow.
  • the discharge flow path 74 is a flow path for flowing the treatment liquid PL recovered by the recovery member 53 described later.
  • the supply flow path 73 communicates with the reservoir tank 71a via the pipe 72a.
  • the treatment liquid PL is stored in the reservoir tank 71a.
  • a pump 70a is arranged in the pipe 72a. When the pump 70a is driven in response to a command from the control module 800, the processing liquid PL stored in the reservoir tank 71a is sucked up by the pump 70a, flows through the pipe 72a and the supply flow path 73, and is discharged from the nozzle 52. Ru.
  • the discharge flow path 74 communicates with the reservoir tank 71b via the pipe 72b.
  • a pump 70b is connected to the pipe 72b.
  • the recovery member 53 is configured to recover the processing liquid PL that has been discharged from the plurality of nozzles 52 and has come into contact with the lower surface Wfa of the substrate Wf and then dropped. It is the part that was done.
  • the treated liquid PL that has fallen after being ejected upward from the plurality of nozzles 52 can be recovered by the recovery member 53, so that the dropped treatment liquid PL can be collected in the plating tank. It is possible to suppress the entry into the inside of the 10.
  • the recovery member 53 is composed of a recess 54 formed on the upper surface 51a of the module main body 51. Further, a groove 55 is provided in the center of the bottom of the recess 54, and the above-mentioned discharge flow path 74 is arranged in the groove 55.
  • the discharge flow path 74 is provided with a suction port (not shown) for allowing the collected treatment liquid PL to flow into the discharge flow path 74 in the recess 54 of the recovery member 53.
  • the specific location where the suction port is formed is not particularly limited, and may be, for example, the upstream end of the discharge flow path 74, and the side surface of the discharge flow path 74 (the pipe constituting the discharge flow path 74). Side of).
  • the processing liquid PL recovered by the recovery member 53 enters the discharge flow path 74 from this suction port. After flowing in, it flows through the pipe 72b and is stored in the reservoir tank 71b.
  • the plurality of nozzles 52 of the module main body 51 are arranged in the recesses 54.
  • the processing liquid PL that has fallen after being ejected from the plurality of nozzles 52 can be effectively recovered by the recesses 54.
  • the nozzle 52 arranged on one side and the nozzle 52 arranged on the other side of the central axis XL of the recess 54 are located on the upper side of the treatment liquid PL and in the center of the recess 54, respectively. It is discharging toward the side.
  • the processing liquid PL discharged from the plurality of nozzles 52 and in contact with the lower surface Wfa of the substrate Wf can be easily dropped toward the center side of the recess 54.
  • the treatment liquid PL can be effectively recovered by the recess 54.
  • the module main body 51 is moved to the first position in the normal state (FIG. 4 (A)).
  • the control module 800 controls the moving mechanism 60 to rotate the rotating shaft 61 and move the module main body 51 to the second position (FIG. 4B).
  • the control module 800 controls the rotation mechanism 40 to rotate the substrate holder 30 and drives the pump 70a to discharge the processing liquid PL from the nozzle 52.
  • the control module 800 drives the pump 70b at the same time as driving the pump 70a, so that the processing liquid PL recovered by the recovery member 53 is returned to the reservoir tank 71b.
  • the treatment liquid PL is discharged from the nozzle 52 while the substrate holder 30 is rotating, so that the treatment liquid PL is entirely adhered to the lower surface Wfa of the substrate Wf held by the substrate holder 30, and the lower surface Wfa of the substrate Wf is adhered to the entire surface. Can be entirely wetted with the treatment liquid PL. As described above, the pre-wet process is executed.
  • the control module 800 stops the rotation of the substrate holder 30 by the rotation mechanism 40 and also stops the pump 70a and the pump 70b.
  • the pump 70a is stopped, the discharge of the processing liquid PL from the nozzle 52 is stopped, and when the pump 70b is stopped, the collection of the processing liquid PL by the recovery member 53 is also stopped.
  • the control module 800 rotates the rotation shaft 61 to move the module main body 51 to the first position.
  • the control module 800 performs the same control as in the case of the pre-wet treatment described above even when the cleaning treatment performed after the plating treatment is executed. Specifically, the control module 800 controls the moving mechanism 60 to rotate the rotating shaft 61 and move the module main body 51 to the second position. Next, the control module 800 controls the rotation mechanism 40 to rotate the substrate holder 30 and drives the pump 70a to discharge the processing liquid PL from the nozzle 52. Further, the control module 800 drives the pump 70b at the same time as driving the pump 70a, so that the processing liquid PL recovered by the recovery member 53 is returned to the reservoir tank 71b.
  • the control module 800 stops the rotation of the substrate holder 30 by the rotation mechanism 40 and also stops the pump 70a and the pump 70b. Further, the module main body 51 is moved to the first position.
  • the discharge module 50 can execute a pre-wet process or a cleaning process. That is, the discharge module 50 can exhibit a function as a pre-wet module that executes a pre-wet process and a cleaning module that executes a cleaning process.
  • the pre-wet treatment and the cleaning treatment can be executed without providing the pre-wet module and the cleaning module separately from the plating module 400. Therefore, the conventional pre-wet module and the cleaning module are provided separately from the plating module 400.
  • the size of the plating apparatus 1000 can be reduced as compared with the plating apparatus.
  • the plating apparatus 1000 can be miniaturized as described above, the transport distance of the substrate Wf can be shortened. Thereby, the throughput of the plating apparatus 1000 can be improved.
  • the substrate Wf is arranged.
  • the treatment liquid PL can be totally brought into contact with the lower surface Wfa from the central portion to the outer peripheral edge portion to wet or clean the lower surface Wfa as a whole.
  • the plating apparatus 1000 performs both the pre-wet treatment and the cleaning treatment by using the discharge module 50, but is not limited to this configuration.
  • the plating apparatus 1000 may not execute the cleaning process by the discharge module 50, but may execute only the pre-wet process by the discharge module 50.
  • the plating apparatus 1000 is provided with a cleaning module for executing the cleaning process separately from the plating module 400.
  • the pre-wet process can be executed without providing the pre-wet module separately from the plating module 400, the pre-wet module can be compared with the conventional plating apparatus provided separately from the plating module 400. , The plating apparatus 1000 can be miniaturized.
  • the plating apparatus 1000 may execute only the cleaning process by the discharge module 50 without executing the pre-wet process by the discharge module 50.
  • the plating apparatus 1000 includes a pre-wet module that executes the pre-wet treatment separately from the plating module 400.
  • the plating apparatus is compared with the conventional plating apparatus provided with the cleaning module separately from the plating module 400. It is possible to reduce the size by 1000.
  • FIG. 7 is a schematic view of the peripheral configuration of the substrate holder 30 at the time of executing the pre-wet treatment or the cleaning treatment according to the present modification.
  • the portion 30a of the outer peripheral edge of the substrate holder 30 near the rotating shaft 61 is located far from the rotating shaft 61. It may further include tilting the substrate holder 30 by the tilting mechanism 47 so that it is located below 30b. That is, in this case, in the pre-wet processing, the processing liquid PL is discharged from the nozzle 52 while the substrate holder 30 is rotating in a state where the substrate holder 30 is tilted as described above.
  • the processing liquid PL when the processing liquid PL is discharged from the nozzle 52, the portion 30a of the outer peripheral edge of the substrate holder 30 near the rotating shaft 61 is the rotating shaft. It may further include tilting the substrate holder 30 by the tilting mechanism 47 so that it is located below the location 30b far from 61. That is, in this case, in the cleaning process, the processing liquid PL is discharged from the nozzle 52 while the substrate holder 30 is rotating in a state where the substrate holder 30 is tilted as described above.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
PCT/JP2020/047931 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法 Ceased WO2022137339A1 (ja)

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KR1020217034766A KR102338157B1 (ko) 2020-12-22 2020-12-22 도금 장치, 프리웨트 처리 방법 및 세정 처리 방법
JP2021518979A JP6934127B1 (ja) 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法
PCT/JP2020/047931 WO2022137339A1 (ja) 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法
CN202080034254.9A CN114981486B (zh) 2020-12-22 2020-12-22 镀覆装置、预湿处理方法以及清洗处理方法
US17/612,024 US12054840B2 (en) 2020-12-22 2020-12-22 Plating apparatus, pre-wet process method, and cleaning process method

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US12264406B2 (en) 2021-11-04 2025-04-01 Ebara Corporation Plating apparatus and substrate cleaning method
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CN116324046B (zh) * 2021-11-04 2024-08-02 株式会社荏原制作所 镀覆装置及触点清洗方法
TWI803048B (zh) * 2021-11-11 2023-05-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
TWI775670B (zh) * 2021-11-11 2022-08-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
KR102848412B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치
KR102848406B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치 및 이의 제어방법
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US12054840B2 (en) 2024-08-06
US20220396897A1 (en) 2022-12-15
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JPWO2022137339A1 (https=) 2022-06-30
KR102338157B1 (ko) 2021-12-10
CN114981486A (zh) 2022-08-30

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