CN114981486B - 镀覆装置、预湿处理方法以及清洗处理方法 - Google Patents

镀覆装置、预湿处理方法以及清洗处理方法 Download PDF

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Publication number
CN114981486B
CN114981486B CN202080034254.9A CN202080034254A CN114981486B CN 114981486 B CN114981486 B CN 114981486B CN 202080034254 A CN202080034254 A CN 202080034254A CN 114981486 B CN114981486 B CN 114981486B
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China
Prior art keywords
module
substrate
plating
nozzles
substrate holder
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English (en)
Chinese (zh)
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CN114981486A (zh
Inventor
张绍华
关正也
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Ebara Corp
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Ebara Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/08—Rinsing
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C25D17/08—Supporting racks, i.e. not for suspending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
CN202080034254.9A 2020-12-22 2020-12-22 镀覆装置、预湿处理方法以及清洗处理方法 Active CN114981486B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/047931 WO2022137339A1 (ja) 2020-12-22 2020-12-22 めっき装置、プリウェット処理方法及び洗浄処理方法

Publications (2)

Publication Number Publication Date
CN114981486A CN114981486A (zh) 2022-08-30
CN114981486B true CN114981486B (zh) 2023-03-24

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CN202080034254.9A Active CN114981486B (zh) 2020-12-22 2020-12-22 镀覆装置、预湿处理方法以及清洗处理方法

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Country Link
US (1) US12054840B2 (https=)
JP (1) JP6934127B1 (https=)
KR (1) KR102338157B1 (https=)
CN (1) CN114981486B (https=)
WO (1) WO2022137339A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12084783B2 (en) 2021-09-10 2024-09-10 Ebara Corporation Plating apparatus and rinse process method
JP7101925B1 (ja) * 2021-10-14 2022-07-15 株式会社荏原製作所 プリウェット処理方法
WO2023079634A1 (ja) * 2021-11-04 2023-05-11 株式会社荏原製作所 めっき装置および基板洗浄方法
CN116324046B (zh) * 2021-11-04 2024-08-02 株式会社荏原制作所 镀覆装置及触点清洗方法
JP7089133B1 (ja) * 2021-11-04 2022-06-21 株式会社荏原製作所 めっき装置および基板洗浄方法
TWI803048B (zh) * 2021-11-11 2023-05-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
TWI775670B (zh) * 2021-11-11 2022-08-21 日商荏原製作所股份有限公司 鍍覆裝置及基板清洗方法
KR102848412B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치
KR102848406B1 (ko) * 2022-05-31 2025-08-25 (주)애니캐스팅 Ｓ－ｅｃａｍ 프린팅 장치 및 이의 제어방법
US20240271313A1 (en) * 2022-06-17 2024-08-15 Ebara Corporation Plating apparatus
KR102595617B1 (ko) * 2022-08-02 2023-10-31 가부시키가이샤 에바라 세이사꾸쇼 도금 방법 및 도금 장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0718034B2 (ja) 1989-06-09 1995-03-01 進工業株式会社 メッキ方法及びその装置
JPH05263290A (ja) 1992-03-18 1993-10-12 Toshiba Corp 高速半田メッキ装置
US6280581B1 (en) * 1998-12-29 2001-08-28 David Cheng Method and apparatus for electroplating films on semiconductor wafers
JP4664320B2 (ja) * 2000-03-17 2011-04-06 株式会社荏原製作所 めっき方法
US7189647B2 (en) * 2001-04-05 2007-03-13 Novellus Systems, Inc. Sequential station tool for wet processing of semiconductor wafers
JP2003027291A (ja) 2001-07-10 2003-01-29 Tokyo Electron Ltd 液処理装置および液処理方法
CN101383271A (zh) 2003-08-07 2009-03-11 株式会社荏原制作所 基片处理装置、基片处理方法和基片固定装置
JP2005163080A (ja) 2003-12-01 2005-06-23 Toshiba Corp めっき装置及びめっき方法
JP2008019496A (ja) 2006-07-14 2008-01-31 Matsushita Electric Ind Co Ltd 電解めっき装置および電解めっき方法
JP4695567B2 (ja) * 2006-09-04 2011-06-08 株式会社東設 ウエハー洗浄方法及びその装置
JP2008308709A (ja) * 2007-06-13 2008-12-25 Panasonic Corp 半導体装置の製造方法及び製造装置
JP5321574B2 (ja) * 2010-12-17 2013-10-23 ルネサスエレクトロニクス株式会社 半導体製造装置の動作方法及び半導体装置の製造方法
CN203245737U (zh) * 2013-05-14 2013-10-23 中芯国际集成电路制造(北京)有限公司 多功能研磨液供应结构及研磨装置
JP2015023048A (ja) 2013-07-16 2015-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2016058665A (ja) 2014-09-12 2016-04-21 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄方法および基板洗浄装置
JP5815827B2 (ja) * 2014-10-10 2015-11-17 東京エレクトロン株式会社 めっき処理装置、めっき処理方法および記憶媒体
US9816194B2 (en) * 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
JP6336022B1 (ja) * 2016-12-19 2018-06-06 株式会社荏原製作所 めっき装置、めっき方法、及びコンピュータ読み取り可能な記録媒体
JP7014553B2 (ja) * 2017-09-22 2022-02-01 株式会社荏原製作所 めっき装置
JP7291030B2 (ja) 2018-09-06 2023-06-14 株式会社荏原製作所 基板処理装置

Also Published As

Publication number Publication date
JP6934127B1 (ja) 2021-09-08
US12054840B2 (en) 2024-08-06
WO2022137339A1 (ja) 2022-06-30
US20220396897A1 (en) 2022-12-15
JPWO2022137339A1 (https=) 2022-06-30
KR102338157B1 (ko) 2021-12-10
CN114981486A (zh) 2022-08-30

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