JP6931208B2 - 低応力低水素lpcvdシリコン窒化物 - Google Patents
低応力低水素lpcvdシリコン窒化物 Download PDFInfo
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- JP6931208B2 JP6931208B2 JP2017558375A JP2017558375A JP6931208B2 JP 6931208 B2 JP6931208 B2 JP 6931208B2 JP 2017558375 A JP2017558375 A JP 2017558375A JP 2017558375 A JP2017558375 A JP 2017558375A JP 6931208 B2 JP6931208 B2 JP 6931208B2
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- nitride layer
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- 229910052581 Si3N4 Inorganic materials 0.000 title claims description 88
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title claims description 88
- 238000004518 low pressure chemical vapour deposition Methods 0.000 title claims description 29
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 title claims description 20
- 239000001257 hydrogen Substances 0.000 title claims description 20
- 229910052739 hydrogen Inorganic materials 0.000 title claims description 20
- 229910002601 GaN Inorganic materials 0.000 claims description 66
- 238000000034 method Methods 0.000 claims description 49
- 239000000758 substrate Substances 0.000 claims description 28
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 12
- 239000010703 silicon Substances 0.000 claims description 12
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 238000001020 plasma etching Methods 0.000 claims description 7
- 230000005669 field effect Effects 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 6
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 6
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 15
- 238000004377 microelectronic Methods 0.000 description 12
- 239000010409 thin film Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 9
- 229910021529 ammonia Inorganic materials 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000002019 doping agent Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- -1 silicon nitrides Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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Description
が、PMOSトランジスタ404のゲート414及びソース/ドレイン拡張部420の水平表面の上、並びにNMOSトランジスタ406のゲート432及びソース/ドレイン拡張部438の上の、図5Aの高性能シリコン窒化物層450を取り除き、PMOSトランジスタ404のオフセットスペーサ416の垂直表面上のゲート側壁スペーサ424を形成するため、並びにNMOSトランジスタ406のオフセットスペーサ434の垂直表面上のゲート側壁スペーサ442を形成するために、高性能シリコン窒化物層450を残す。高性能シリコン窒化物層450を形成するためのLPCVDプロセスのコンフォーマルの態様により、ゲート側壁スペーサ424及び442が、フォトリソグラフィオペレーションなしに形成され得、有利にも、集積回路400の製造コスト及び複雑性を低減する。
Claims (24)
- ガリウム窒化物電界効果トランジスタ(GaN FET)デバイスであって、
基板としてのガリウム窒化物層とアルミニウムガリウム窒化物層とのスタックと、
前記スタック上のガリウム窒化物のキャップ層と、
前記キャップ層の第1の表面上のシリコン窒化物層であって、
3:4の比の2パーセント内のシリコン:窒素原子比と、
600メカパスカル(MPa)〜1000MPaの応力と、
5原子百分率未満の水素含有量と、
の特性を有する、前記シリコン窒化物層と、
前記キャップ層の上のGaN FETのゲートであって、その中心部において前記キャップ層の第1の表面に直接に接し、その端部において前記シリコン窒化物層に部分的に重なる、前記ゲートと、
を含む、GaN FETデバイス。 - 請求項1に記載のGaN FETデバイスであって、
前記シリコン窒化物層が10ナノメートルと20ナノメートルとの間の厚みである、GaN FETデバイス。 - 請求項1に記載のGaN FETデバイスであって、
前記シリコン窒化物層が2.0〜2.1の屈折率を有する、GaN FETデバイス。 - 請求項1に記載のGaN FETデバイスであって、
前記シリコン窒化物層が、12メガボルトパーセンチメートル(MV/cm)より大きい誘電破壊強度を有する、GaN FETデバイス。 - 請求項1に記載のGaN FETデバイスであって、
ソースとドレインとを更に含む、GaN FETデバイス。 - 請求項5に記載のGaN FETデバイスであって、
前記ソースのコンタクト金属に電気的に接触するソース金属であって、前記ゲートに重なる、前記ソース金属を更に含む、GaN FETデバイス。 - 請求項6に記載のGaN FETデバイスであって、
前記ソース金属と前記ゲートとの間の誘電体層を更に含む、GaN FETデバイス。 - 請求項5に記載のGaN FETデバイスであって、
前記シリコン窒化物層が、前記ゲートの端部の下の第1の部分と、前記ドレインと前記ゲートから距離を開けられた前記ゲートと前記ドレインとの間の第2の部分とを含む、GaN FETデバイス。 - ガリウム窒化物電界効果トランジスタ(GaN FET)デバイスであって、
基板としてのガリウム窒化物層とアルミニウムガリウム窒化物層とのスタックと、
前記スタック上のガリウム窒化物のキャップ層と、
前記キャップ層の第1の表面上のシリコン窒化物層であって、
3:4の比の2パーセント内のシリコン:窒素原子比と、
600メカパスカル(MPa)〜1000MPaの応力と、
5原子百分率未満の水素含有量と、
の特性を有する、前記シリコン窒化物層と、
ソースとドレインとであって、前記シリコン窒化物層が前記ソースと前記ドレインとの間に位置する、前記ソースとドレインと、
前記ソースと前記ドレインとの間の前記キャップ層の上の前記GaN FETのゲートであって、その中心部において前記キャップ層の第1の表面に直接に接し、その端部において前記シリコン窒化物層に部分的に重なる、前記ゲートと、
を含む、GaN FETデバイス。 - 請求項9に記載のGaN FETデバイスであって、
前記ソースのコンタクト金属に電気的に接触するソース金属であって、前記ゲートに重なる、前記ソース金属を更に含む、GaN FETデバイス。 - 請求項10に記載のGaN FETデバイスであって、
前記ソース金属と前記ゲートとの間の誘電体層を更に含む、GaN FETデバイス。 - 請求項9に記載のGaN FETデバイスであって、
前記シリコン窒化物層が、前記ゲートの端部の下の第1の部分と、前記ドレインと前記ゲートとから空間を開けられている前記ゲートと前記ドレインとの間の第2の部分とを含む、GaN FETデバイス。 - ガリウム窒化物電界効果トランジスタ(GaN FET)デバイスであって、
ガリウム窒化物層とアルニミウムガリウム窒化物層とのスタックと、
前記スタック上のガリウム窒化物のキャップ層と、
前記キャップ層上のシリコン窒化物層であって、
3:4の比の2パーセント内のシリコン:窒素原子比と、
600メカパスカル(MPa)〜1000MPaの応力と、
5原子百分率未満の水素含有量と、
の特性を有する、前記シリコン窒化物層と、
ソースとドレインと、
前記ソースと前記ドレインとの間の前記キャップ層の上の前記GaN FETのゲートであって、その中心部において前記キャップ層の第1の表面に直接に接し、その端部において前記シリコン窒化物層に部分的に重なる、前記ゲートと、
前記ソースのコンタクト金属に電気的に接触するソース金属であって、前記ゲートに重なる、前記ソース金属と、
を含み、
前記シリコン窒化物層が、前記ゲートの端部の下の第1の部分と、前記ドレインと前記ゲートから空間を開けられている前記ゲートと前記ドレインとの間の第2の部分とを含む、GaN FETデバイス。 - ガリウム窒化物電界効果トランジスタ(GaN FET)デバイスを形成する方法であって、
基板としてのガリウム窒化物層とアルニニウムガリウム窒化物層とのスタックを形成することと、
前記スタック上にガリウム窒化物のキャップ層を形成することと、
低圧化学気相成長(LPCVD)プロセスを用いて前記キャップ層の第1の表面上にシリコン窒化物層を形成することであって、前記シリコン窒化物層が、
3:4の比の2パーセント内のシリコン:窒素原子比と、
600メカパスカル(MPa)〜1000MPaの応力と、
5原子百分率未満の水素含有量と、
の特性を有する、前記シリコン窒化物層を形成することと、
前記シリコン窒化物層の上にエッチマスクを形成することと、
前記エッチマスクにより露出される前記シリコン窒化物層を除去することと、
その後に前記エッチマスクを除去することと、
前記キャップ層の上に前記GaN FETのゲートを形成することであって、前記ゲートが、その中心部において前記キャップ層の第1の表面に直接に接し、その端部において前記シリコン窒化物層に部分的に重なる、前記ゲートを形成することと、
を含む、方法。 - 請求項14に記載の方法であって、
前記LPCVDプロセスが、
LPCVDファーネスに前記基板を置くことと、
前記LPCVDファーネスにおいて前記基板を800℃〜820℃の温度まで加熱することと、
アンモニアガスとジクロロシランガスとを4対6の比で150ミリトル〜250ミリトルの圧力で反応チャンバに提供することと、
前記LPCVDファーネスから前記基板を取り除くことと、
を含む、方法。 - 請求項14に記載の方法であって、
前記シリコン窒化物層を除去することが、フッ素ラジカルを用いる反応性イオンエッチ(RIE)プロセスを含む、方法。 - 請求項14に記載の方法であって、
前記シリコン窒化物層が10ナノメートルと20ナノメートルとの間の厚みである、方法。 - 請求項14に記載の方法であって、
前記シリコン窒化物層が2.0〜2.1の屈折率を有する、方法。 - 請求項14に記載の方法であって、
前記シリコン窒化物層が、12メガボルトパーセンチメートル(MV/cm)より大きい誘電破壊強度を有する、方法。 - ガリウム窒化物電界効果トランジスタ(GaN FET)デバイスを形成する方法であって、
基板としてのガリウム窒化物層とアルミニウムガリウム窒化物層とのスタックを形成することと、
前記スタック上にガリウム窒化物のキャップ層を形成することと、
低圧化学気相成長(LPCVD)プロセスを用いて前記キャップ層の第1の表面上にシリコン窒化物層を形成することであって、前記LPCVDプロセスが、
前記基板をLPCVDファーネス内に置くことと、
前記LPCVDファーネスにおいて前記基板を800℃〜820℃の温度まで加熱することと、
アンモニアガスとジクロロシランガスとを4対6の比で150ミリトル〜250ミリトルの圧力で反応チャンバに提供することと、
前記LPCVDファーネスから前記基板を取り除くことと、
による、前記シリコン窒化物層を形成することと、
前記シリコン窒化物層の上にエッチングマスクを形成することと、
前記エッチングマスクにより露出された前記シリコン窒化物層を取り除くことと、
その後に前記エッチングマスクを取り除くことと、
前記キャップ層の上に前記GaN FETのゲート構造を形成することであって、前記ゲート構造が、その中心部において前記キャップ層の第1の表面に直接に接し、その端部において前記シリコン窒化物層に部分的に重なる、前記ゲートを形成することと、
を含む、方法。 - 請求項20に記載の方法であって、
前記シリコン窒化物層を取り除くことが、フッ素ラジカルを用いるRIEプロセスを含む、方法。 - 請求項20に記載の方法であって、
前記シリコン窒化物層が10ナノメートルから20ナノメートルの厚みである、方法。 - 請求項20に記載の方法であって、
前記シリコン窒化物層が2.0から2.1の屈折率を有する、方法。 - 請求項20に記載の方法であって、
前記シリコン窒化物層が、12メガボルトパーセンチメートル(MV/cm)より大きい誘電破壊強度を有する、方法。
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