JP6908133B2 - プローブピン、検査治具、検査ユニットおよび検査装置 - Google Patents
プローブピン、検査治具、検査ユニットおよび検査装置 Download PDFInfo
- Publication number
- JP6908133B2 JP6908133B2 JP2019564209A JP2019564209A JP6908133B2 JP 6908133 B2 JP6908133 B2 JP 6908133B2 JP 2019564209 A JP2019564209 A JP 2019564209A JP 2019564209 A JP2019564209 A JP 2019564209A JP 6908133 B2 JP6908133 B2 JP 6908133B2
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- inspection
- probe pin
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- 238000007689 inspection Methods 0.000 title claims description 134
- 239000000523 sample Substances 0.000 title claims description 103
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2018/000508 WO2019138505A1 (ja) | 2018-01-11 | 2018-01-11 | プローブピン、検査治具、検査ユニットおよび検査装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020021769A Division JP6699812B1 (ja) | 2020-02-12 | 2020-02-12 | プローブピン、検査治具、検査ユニットおよび検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019138505A1 JPWO2019138505A1 (ja) | 2020-08-06 |
JP6908133B2 true JP6908133B2 (ja) | 2021-07-21 |
Family
ID=63877299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019564209A Active JP6908133B2 (ja) | 2018-01-11 | 2018-01-11 | プローブピン、検査治具、検査ユニットおよび検査装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6908133B2 (ko) |
KR (3) | KR101903319B1 (ko) |
CN (2) | CN111033272B (ko) |
WO (1) | WO2019138505A1 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7354534B2 (ja) * | 2018-11-08 | 2023-10-03 | オムロン株式会社 | プローブピンおよび検査治具 |
KR101999521B1 (ko) * | 2019-01-17 | 2019-07-12 | 위드시스템 주식회사 | 핀 파손 방지형 다중 접촉 소켓 |
JP2020180889A (ja) * | 2019-04-25 | 2020-11-05 | オムロン株式会社 | プローブピン、検査治具および検査ユニット |
JP7318297B2 (ja) * | 2019-04-25 | 2023-08-01 | オムロン株式会社 | プローブピン、検査治具および検査ユニット |
CN110658364A (zh) * | 2019-10-23 | 2020-01-07 | 柏成文 | 一种测试针 |
KR102086391B1 (ko) * | 2019-11-05 | 2020-03-09 | 주식회사 플라이업 | 회로 검사장치 |
KR102086390B1 (ko) * | 2019-11-05 | 2020-03-09 | 주식회사 플라이업 | 프로브 핀 |
KR102429358B1 (ko) * | 2020-01-16 | 2022-08-04 | 주식회사 플라이업 | 프로브 핀 및 이를 구비하는 회로 검사장치 |
DE102020102302A1 (de) | 2020-01-30 | 2021-08-05 | Ingun Prüfmittelbau Gmbh | Hochfrequenz-Prüfkontaktelement und Prüfstiftvorrichtung |
JP2021128055A (ja) * | 2020-02-13 | 2021-09-02 | オムロン株式会社 | 検査ソケット |
CN111579837B (zh) * | 2020-05-18 | 2022-09-20 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
CN111579833B (zh) * | 2020-05-18 | 2022-12-23 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
CN111579835B (zh) * | 2020-05-18 | 2023-05-16 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
CN111579836B (zh) * | 2020-05-18 | 2023-01-17 | 武汉精毅通电子技术有限公司 | 一种适用于大电流高速信号测试的探针及连接器 |
KR102431964B1 (ko) * | 2020-09-11 | 2022-08-12 | 주식회사 오킨스전자 | 멀티-레이어 콘택 핀 |
KR102606892B1 (ko) * | 2021-06-15 | 2023-11-29 | (주)포인트엔지니어링 | 검사 소켓용 지지 플레이트, 검사 소켓용 소켓핀 및 이들을 구비하는 검사 소켓 |
CN113507005A (zh) * | 2021-08-10 | 2021-10-15 | 烟台艾睿光电科技有限公司 | 一种巡检机器人充电房及巡检机器人 |
CN113866465A (zh) * | 2021-09-22 | 2021-12-31 | 深圳凯智通微电子技术有限公司 | 探针及集成电路测试设备 |
JP2023141024A (ja) * | 2022-03-23 | 2023-10-05 | 株式会社日本マイクロニクス | プローブ、プローブ保持装置およびプローブの製造方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0434380A (ja) * | 1990-05-30 | 1992-02-05 | Toshiba Chem Corp | Icソケット |
JP3072071B2 (ja) * | 1997-11-26 | 2000-07-31 | 日本航空電子工業株式会社 | コンタクト |
JP2002134202A (ja) | 2000-10-27 | 2002-05-10 | Otax Co Ltd | 電子部品用ソケット |
JP2002164134A (ja) * | 2000-11-27 | 2002-06-07 | Yamaichi Electronics Co Ltd | Icパッケージ用ソケット |
JP2004138405A (ja) * | 2002-10-15 | 2004-05-13 | Renesas Technology Corp | 半導体装置測定用プローブ |
JP5005195B2 (ja) * | 2005-07-13 | 2012-08-22 | 東京エレクトロン株式会社 | プローブカード製造方法 |
JP4842733B2 (ja) * | 2006-08-18 | 2011-12-21 | 日本発條株式会社 | 導電性接触子および導電性接触子ユニット |
WO2009084906A2 (en) | 2008-01-02 | 2009-07-09 | Nakamura, Toshiyuki | The proble pin composed in one body and the method of making it |
TWM350159U (en) * | 2008-06-30 | 2009-02-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US20090326402A1 (en) * | 2008-06-30 | 2009-12-31 | Nellcor Puritan Bennett Ireland | Systems and methods for determining effort |
JP2010156595A (ja) * | 2008-12-26 | 2010-07-15 | Nhk Spring Co Ltd | プローブユニット |
JP2011191187A (ja) * | 2010-03-15 | 2011-09-29 | Nhk Spring Co Ltd | コンタクトプローブおよびプローブユニット |
US8970238B2 (en) * | 2011-06-17 | 2015-03-03 | Electro Scientific Industries, Inc. | Probe module with interleaved serpentine test contacts for electronic device testing |
JP2013007700A (ja) * | 2011-06-27 | 2013-01-10 | Japan Electronic Materials Corp | 電気的接触子 |
JP2013142689A (ja) * | 2012-01-06 | 2013-07-22 | Isao Kimoto | 複数チップ同時測定用プローブ組立体 |
JP6107234B2 (ja) * | 2013-03-01 | 2017-04-05 | 山一電機株式会社 | 検査用プローブ、および、それを備えるicソケット |
KR102018784B1 (ko) * | 2013-08-13 | 2019-09-05 | (주)위드멤스 | 미세 전극 회로 검사용 핀 제조 방법 및 이의 방법으로 제조된 미세 전극 회로 검사용 핀 |
JP6515877B2 (ja) * | 2016-06-17 | 2019-05-22 | オムロン株式会社 | プローブピン |
JP6737002B2 (ja) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | プローブピン |
-
2018
- 2018-01-11 JP JP2019564209A patent/JP6908133B2/ja active Active
- 2018-01-11 CN CN201880051883.5A patent/CN111033272B/zh active Active
- 2018-01-11 CN CN202010200587.6A patent/CN111239447B/zh active Active
- 2018-01-11 WO PCT/JP2018/000508 patent/WO2019138505A1/ja active Application Filing
- 2018-01-30 KR KR1020180011384A patent/KR101903319B1/ko active IP Right Grant
- 2018-09-19 KR KR1020180112245A patent/KR102058152B1/ko active IP Right Grant
-
2019
- 2019-12-16 KR KR1020190167468A patent/KR102103370B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20190141116A (ko) | 2019-12-23 |
KR102058152B1 (ko) | 2019-12-23 |
KR102103370B1 (ko) | 2020-04-22 |
KR20190085830A (ko) | 2019-07-19 |
CN111239447B (zh) | 2022-07-08 |
CN111033272A (zh) | 2020-04-17 |
KR101903319B1 (ko) | 2018-10-01 |
CN111239447A (zh) | 2020-06-05 |
WO2019138505A1 (ja) | 2019-07-18 |
CN111033272B (zh) | 2022-07-26 |
JPWO2019138505A1 (ja) | 2020-08-06 |
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