JP6901828B2 - 基板搬送ロボットおよび基板搬送装置 - Google Patents

基板搬送ロボットおよび基板搬送装置 Download PDF

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Publication number
JP6901828B2
JP6901828B2 JP2016036421A JP2016036421A JP6901828B2 JP 6901828 B2 JP6901828 B2 JP 6901828B2 JP 2016036421 A JP2016036421 A JP 2016036421A JP 2016036421 A JP2016036421 A JP 2016036421A JP 6901828 B2 JP6901828 B2 JP 6901828B2
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JP
Japan
Prior art keywords
elevating
fixed
substrate transfer
transfer robot
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016036421A
Other languages
English (en)
Japanese (ja)
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JP2017148925A (ja
JP2017148925A5 (enExample
Inventor
田 武 士 芝
田 武 士 芝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Motors Ltd
Original Assignee
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Jukogyo KK filed Critical Kawasaki Jukogyo KK
Priority to JP2016036421A priority Critical patent/JP6901828B2/ja
Priority to TW106106475A priority patent/TWI643797B/zh
Priority to CN201780013321.7A priority patent/CN108698222B/zh
Priority to PCT/JP2017/007362 priority patent/WO2017146252A1/ja
Priority to US16/079,603 priority patent/US10867826B2/en
Priority to KR1020187027044A priority patent/KR102205661B1/ko
Publication of JP2017148925A publication Critical patent/JP2017148925A/ja
Publication of JP2017148925A5 publication Critical patent/JP2017148925A5/ja
Application granted granted Critical
Publication of JP6901828B2 publication Critical patent/JP6901828B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/04—Arms extensible rotatable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/02—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Program-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/06—Program-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H10P72/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3308—Vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2016036421A 2016-02-26 2016-02-26 基板搬送ロボットおよび基板搬送装置 Active JP6901828B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016036421A JP6901828B2 (ja) 2016-02-26 2016-02-26 基板搬送ロボットおよび基板搬送装置
TW106106475A TWI643797B (zh) 2016-02-26 2017-02-24 基板搬送機器人及基板搬送裝置
PCT/JP2017/007362 WO2017146252A1 (ja) 2016-02-26 2017-02-27 基板搬送ロボットおよび基板搬送装置
US16/079,603 US10867826B2 (en) 2016-02-26 2017-02-27 Substrate conveyance robot and substrate conveyance apparatus
CN201780013321.7A CN108698222B (zh) 2016-02-26 2017-02-27 衬底搬送机器人及衬底搬送装置
KR1020187027044A KR102205661B1 (ko) 2016-02-26 2017-02-27 기판 반송 로봇 및 기판 반송 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016036421A JP6901828B2 (ja) 2016-02-26 2016-02-26 基板搬送ロボットおよび基板搬送装置

Publications (3)

Publication Number Publication Date
JP2017148925A JP2017148925A (ja) 2017-08-31
JP2017148925A5 JP2017148925A5 (enExample) 2019-04-11
JP6901828B2 true JP6901828B2 (ja) 2021-07-14

Family

ID=59686363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016036421A Active JP6901828B2 (ja) 2016-02-26 2016-02-26 基板搬送ロボットおよび基板搬送装置

Country Status (6)

Country Link
US (1) US10867826B2 (enExample)
JP (1) JP6901828B2 (enExample)
KR (1) KR102205661B1 (enExample)
CN (1) CN108698222B (enExample)
TW (1) TWI643797B (enExample)
WO (1) WO2017146252A1 (enExample)

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JP6703091B2 (ja) * 2016-02-29 2020-06-03 ライフロボティクス株式会社 直動伸縮機構及びそれを備えたロボットアーム機構
JP6725645B2 (ja) * 2016-03-29 2020-07-22 ライフロボティクス株式会社 ロボットアーム機構
WO2017170304A1 (ja) * 2016-03-29 2017-10-05 ライフロボティクス株式会社 ねじり回転関節機構、ロボットアーム機構および片持ち回転機構
CN111421571A (zh) * 2019-01-09 2020-07-17 苏州吉泰兴机电设备有限公司 一种四轴机器人
CN109703972B (zh) * 2019-02-12 2024-05-14 合肥憬望智能科技有限公司 一种三站合一的自动化晶粒入料装置
WO2022049789A1 (ja) * 2020-09-03 2022-03-10 川崎重工業株式会社 基板搬送ロボット
JP7662388B2 (ja) * 2021-04-09 2025-04-15 川崎重工業株式会社 基板搬送ロボットおよび基板搬送装置
JP7732766B2 (ja) * 2021-04-23 2025-09-02 川崎重工業株式会社 基板搬送ロボットおよび基板搬送装置
CN116352690B (zh) * 2023-06-01 2023-08-22 沈阳芯达科技有限公司 一种基于大气机械手的垂直行程增程机构

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Also Published As

Publication number Publication date
KR102205661B1 (ko) 2021-01-21
TW201736233A (zh) 2017-10-16
JP2017148925A (ja) 2017-08-31
US10867826B2 (en) 2020-12-15
CN108698222B (zh) 2021-11-09
KR20180116338A (ko) 2018-10-24
WO2017146252A1 (ja) 2017-08-31
US20190054613A1 (en) 2019-02-21
TWI643797B (zh) 2018-12-11
CN108698222A (zh) 2018-10-23

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