JP6875161B2 - テープ剥離装置 - Google Patents

テープ剥離装置 Download PDF

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Publication number
JP6875161B2
JP6875161B2 JP2017055783A JP2017055783A JP6875161B2 JP 6875161 B2 JP6875161 B2 JP 6875161B2 JP 2017055783 A JP2017055783 A JP 2017055783A JP 2017055783 A JP2017055783 A JP 2017055783A JP 6875161 B2 JP6875161 B2 JP 6875161B2
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JP
Japan
Prior art keywords
tape
peeling
plate
holding
starting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017055783A
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English (en)
Japanese (ja)
Other versions
JP2018160504A (ja
Inventor
藤澤　晋一
晋一 藤澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2017055783A priority Critical patent/JP6875161B2/ja
Priority to KR1020180030168A priority patent/KR102452295B1/ko
Priority to CN201810219275.2A priority patent/CN108630582B/zh
Priority to TW107109373A priority patent/TWI752197B/zh
Publication of JP2018160504A publication Critical patent/JP2018160504A/ja
Application granted granted Critical
Publication of JP6875161B2 publication Critical patent/JP6875161B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
JP2017055783A 2017-03-22 2017-03-22 テープ剥離装置 Active JP6875161B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017055783A JP6875161B2 (ja) 2017-03-22 2017-03-22 テープ剥離装置
KR1020180030168A KR102452295B1 (ko) 2017-03-22 2018-03-15 테이프 박리 장치
CN201810219275.2A CN108630582B (zh) 2017-03-22 2018-03-16 带剥离装置
TW107109373A TWI752197B (zh) 2017-03-22 2018-03-20 膠帶剝離裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017055783A JP6875161B2 (ja) 2017-03-22 2017-03-22 テープ剥離装置

Publications (2)

Publication Number Publication Date
JP2018160504A JP2018160504A (ja) 2018-10-11
JP6875161B2 true JP6875161B2 (ja) 2021-05-19

Family

ID=63706330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017055783A Active JP6875161B2 (ja) 2017-03-22 2017-03-22 テープ剥離装置

Country Status (4)

Country Link
JP (1) JP6875161B2 (zh)
KR (1) KR102452295B1 (zh)
CN (1) CN108630582B (zh)
TW (1) TWI752197B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7250512B2 (ja) * 2018-12-27 2023-04-03 リンテック株式会社 シート剥離装置およびシート剥離方法
CN110861355A (zh) * 2019-11-28 2020-03-06 安徽百盛源包装材料有限公司 一种包装材料加工用卷曲装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4204653B2 (ja) 1997-06-20 2009-01-07 リンテック株式会社 シート剥離装置および方法
JP4210406B2 (ja) 2000-01-20 2009-01-21 大日本印刷株式会社 保護フィルム剥離装置およびその方法
JP3910485B2 (ja) * 2002-05-15 2007-04-25 シャープ株式会社 フィルム剥離装置およびフィルム剥離方法
JP4060641B2 (ja) 2002-05-22 2008-03-12 株式会社ディスコ テープ剥離方法
KR100898025B1 (ko) * 2004-07-02 2009-05-19 샤프 가부시키가이샤 필름 박리방법과 장치
JP5870000B2 (ja) * 2012-09-19 2016-02-24 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP6410209B2 (ja) * 2013-09-17 2018-10-24 日本電気硝子株式会社 ガラスフィルム剥離装置
JP2015167206A (ja) 2014-03-04 2015-09-24 株式会社ディスコ 保護テープ剥離方法及び保護テープ剥離装置
JP6349194B2 (ja) 2014-08-07 2018-06-27 リンテック株式会社 シート剥離装置
CN104979262B (zh) * 2015-05-14 2020-09-22 浙江中纳晶微电子科技有限公司 一种晶圆分离的方法
JP6580408B2 (ja) * 2015-07-30 2019-09-25 株式会社ディスコ 剥離方法および剥離装置
JP6543135B2 (ja) * 2015-08-26 2019-07-10 株式会社ディスコ 粘着テープ剥離装置

Also Published As

Publication number Publication date
CN108630582A (zh) 2018-10-09
TWI752197B (zh) 2022-01-11
TW201836003A (zh) 2018-10-01
KR20180107727A (ko) 2018-10-02
JP2018160504A (ja) 2018-10-11
CN108630582B (zh) 2024-02-02
KR102452295B1 (ko) 2022-10-06

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