JP2018160504A - テープ剥離装置 - Google Patents
テープ剥離装置 Download PDFInfo
- Publication number
- JP2018160504A JP2018160504A JP2017055783A JP2017055783A JP2018160504A JP 2018160504 A JP2018160504 A JP 2018160504A JP 2017055783 A JP2017055783 A JP 2017055783A JP 2017055783 A JP2017055783 A JP 2017055783A JP 2018160504 A JP2018160504 A JP 2018160504A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- peeling
- plate
- start point
- holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 6
- 210000000078 claw Anatomy 0.000 description 13
- 238000005452 bending Methods 0.000 description 11
- 238000000926 separation method Methods 0.000 description 11
- 230000001681 protective effect Effects 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
Abstract
Description
また、上記実施形態では、昇降手段31が剥離起点形成部3を上昇させることにより、テープTの端部を板状物Wから剥離することとしたが、剥離起点形成部3が昇降せずに、保持手段2が昇降する構成としてもよいし、保持手段2及び剥離起点形成部3の双方が昇降する構成としてもよい。
すなわち、テープ剥離装置1は、界面Bに対して剥離基点形成部3を進退自在に相対移動させることができる移動手段を備えていればよい。
2:保持手段 20:吸着部 21:枠体 22:保持面
3:剥離起点形成部
30:先端部 300:エアー供給路 301:エアー噴出口
31:昇降手段 310a:第1エアシリンダ 310b:第1ロッド
311:アーム部 312:垂下部
32:バルブ 33:エアー供給源
34:軸部 35:作用部 350:底部 351:傾斜面 352:爪部
4:剥離手段 40:保持ベース 41:保持板 42:挟持部
43a:第2エアシリンダ 43b:第2ロッド
44a:第3エアシリンダ 44b:第3ロッド
45:第1挟持片 46:第2挟持片
47a:第4エアシリンダ 47b:第4ロッド
48:折り曲げローラ 48a:案内部
5:移動手段
50:ボールネジ 51:ガイドレール 52:モータ 53:移動基台
6:廃棄容器
7:昇降手段 70a:第5エアシリンダ 70b:第5ロッド
8:シート保持手段
Claims (1)
- テープが貼着された板状物から該テープを剥離するテープ剥離装置であって、
該テープが貼着された板状物を保持する保持手段と、
板状物と該テープとの界面に進入して剥離起点を形成する剥離起点形成部と、
該剥離起点形成部を該界面に対して進退自在に相対移動させる移動手段と、
該剥離起点形成部によって形成された該テープの剥離起点を保持しつつ該テープを板状物から剥離する剥離手段と、を備え、
該剥離起点形成部は、板状物の厚み方向から傾斜した傾斜面と、該界面に進入する進入方向と平行な底部と、を含む先端部を有し、
該先端部には、一端がエアー供給源に接続されたエアー供給路と、該エアー供給路の他端が接続され進入した該界面にエアーを噴出するエアー噴出口と、
が形成されたテープ剥離装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017055783A JP6875161B2 (ja) | 2017-03-22 | 2017-03-22 | テープ剥離装置 |
KR1020180030168A KR102452295B1 (ko) | 2017-03-22 | 2018-03-15 | 테이프 박리 장치 |
CN201810219275.2A CN108630582B (zh) | 2017-03-22 | 2018-03-16 | 带剥离装置 |
TW107109373A TWI752197B (zh) | 2017-03-22 | 2018-03-20 | 膠帶剝離裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017055783A JP6875161B2 (ja) | 2017-03-22 | 2017-03-22 | テープ剥離装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018160504A true JP2018160504A (ja) | 2018-10-11 |
JP6875161B2 JP6875161B2 (ja) | 2021-05-19 |
Family
ID=63706330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017055783A Active JP6875161B2 (ja) | 2017-03-22 | 2017-03-22 | テープ剥離装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6875161B2 (ja) |
KR (1) | KR102452295B1 (ja) |
CN (1) | CN108630582B (ja) |
TW (1) | TWI752197B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020107749A (ja) * | 2018-12-27 | 2020-07-09 | リンテック株式会社 | シート剥離装置およびシート剥離方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110861355A (zh) * | 2019-11-28 | 2020-03-06 | 安徽百盛源包装材料有限公司 | 一种包装材料加工用卷曲装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014060346A (ja) * | 2012-09-19 | 2014-04-03 | Tokyo Electron Ltd | 剥離装置、剥離システムおよび剥離方法 |
WO2015041165A1 (ja) * | 2013-09-17 | 2015-03-26 | 日本電気硝子株式会社 | ガラスフィルム剥離装置 |
JP2017034015A (ja) * | 2015-07-30 | 2017-02-09 | 株式会社ディスコ | 剥離方法および剥離装置 |
JP2017045830A (ja) * | 2015-08-26 | 2017-03-02 | 株式会社ディスコ | 粘着テープ剥離装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4204653B2 (ja) | 1997-06-20 | 2009-01-07 | リンテック株式会社 | シート剥離装置および方法 |
JP4210406B2 (ja) * | 2000-01-20 | 2009-01-21 | 大日本印刷株式会社 | 保護フィルム剥離装置およびその方法 |
JP3910485B2 (ja) * | 2002-05-15 | 2007-04-25 | シャープ株式会社 | フィルム剥離装置およびフィルム剥離方法 |
JP4060641B2 (ja) | 2002-05-22 | 2008-03-12 | 株式会社ディスコ | テープ剥離方法 |
KR100898025B1 (ko) * | 2004-07-02 | 2009-05-19 | 샤프 가부시키가이샤 | 필름 박리방법과 장치 |
JP2015167206A (ja) * | 2014-03-04 | 2015-09-24 | 株式会社ディスコ | 保護テープ剥離方法及び保護テープ剥離装置 |
JP6349194B2 (ja) * | 2014-08-07 | 2018-06-27 | リンテック株式会社 | シート剥離装置 |
CN104979262B (zh) * | 2015-05-14 | 2020-09-22 | 浙江中纳晶微电子科技有限公司 | 一种晶圆分离的方法 |
-
2017
- 2017-03-22 JP JP2017055783A patent/JP6875161B2/ja active Active
-
2018
- 2018-03-15 KR KR1020180030168A patent/KR102452295B1/ko active IP Right Grant
- 2018-03-16 CN CN201810219275.2A patent/CN108630582B/zh active Active
- 2018-03-20 TW TW107109373A patent/TWI752197B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014060346A (ja) * | 2012-09-19 | 2014-04-03 | Tokyo Electron Ltd | 剥離装置、剥離システムおよび剥離方法 |
WO2015041165A1 (ja) * | 2013-09-17 | 2015-03-26 | 日本電気硝子株式会社 | ガラスフィルム剥離装置 |
JP2017034015A (ja) * | 2015-07-30 | 2017-02-09 | 株式会社ディスコ | 剥離方法および剥離装置 |
JP2017045830A (ja) * | 2015-08-26 | 2017-03-02 | 株式会社ディスコ | 粘着テープ剥離装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020107749A (ja) * | 2018-12-27 | 2020-07-09 | リンテック株式会社 | シート剥離装置およびシート剥離方法 |
JP7250512B2 (ja) | 2018-12-27 | 2023-04-03 | リンテック株式会社 | シート剥離装置およびシート剥離方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20180107727A (ko) | 2018-10-02 |
CN108630582A (zh) | 2018-10-09 |
CN108630582B (zh) | 2024-02-02 |
TWI752197B (zh) | 2022-01-11 |
TW201836003A (zh) | 2018-10-01 |
JP6875161B2 (ja) | 2021-05-19 |
KR102452295B1 (ko) | 2022-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6301685B2 (ja) | 保護テープ剥離装置及び保護テープ剥離方法 | |
JP5216472B2 (ja) | 半導体ウエハの保護テープ貼付け方法およびその装置 | |
KR101312908B1 (ko) | 반도체 웨이퍼로의 점착 테이프 부착 방법 및 반도체웨이퍼로부터의 보호 테이프 박리 방법 및 이들을 이용한장치 | |
JP4641984B2 (ja) | 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法 | |
KR102391268B1 (ko) | 박리 방법 및 박리 장치 | |
TW201608631A (zh) | 黏著帶剝離方法及黏著帶剝離裝置 | |
TWI752215B (zh) | 被加工物的加工方法 | |
TW200537584A (en) | Method for detaching a semiconductor chip from a foil and apparatus for mounting semiconductor chip | |
JP6247075B2 (ja) | 保護テープ剥離方法および保護テープ剥離装置 | |
JP2019041051A (ja) | 粘着テープ剥離方法および粘着テープ剥離装置 | |
JP2018160504A (ja) | テープ剥離装置 | |
JP2009032853A (ja) | シート貼付装置及び貼付方法 | |
KR102466350B1 (ko) | 보호 테이프 박리 방법 및 보호 테이프 박리 장치 | |
JP6822869B2 (ja) | 剥離装置 | |
JP6543135B2 (ja) | 粘着テープ剥離装置 | |
JP2010147123A (ja) | シート剥離装置及び剥離方法 | |
JP2009111056A (ja) | シート剥離装置及び剥離方法 | |
JP4642057B2 (ja) | シート剥離装置および方法 | |
JP2006199478A (ja) | ガラスの両面フィルムの剥離装置 | |
JP2016039260A (ja) | シート剥離装置および剥離方法並びに剥離開始部形成装置 | |
JP2023112862A (ja) | 粘着テープ剥離方法および粘着テープ剥離装置 | |
JP4342600B2 (ja) | シート剥離装置および方法 | |
CN116544166A (zh) | 粘合带剥离方法和粘合带剥离装置 | |
JP6706979B2 (ja) | 拡張装置及び拡張方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200109 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201215 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210209 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210330 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210422 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6875161 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |