JP6841839B2 - 熱硬化性樹脂用の活性エステル硬化剤化合物、それを含む難燃性組成物、およびそれから製造される物品 - Google Patents

熱硬化性樹脂用の活性エステル硬化剤化合物、それを含む難燃性組成物、およびそれから製造される物品 Download PDF

Info

Publication number
JP6841839B2
JP6841839B2 JP2018544762A JP2018544762A JP6841839B2 JP 6841839 B2 JP6841839 B2 JP 6841839B2 JP 2018544762 A JP2018544762 A JP 2018544762A JP 2018544762 A JP2018544762 A JP 2018544762A JP 6841839 B2 JP6841839 B2 JP 6841839B2
Authority
JP
Japan
Prior art keywords
group
carbon atoms
epoxy resin
composition
phosphorus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018544762A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019502011A5 (https=
JP2019502011A (ja
Inventor
ピオトロウスキー，アンドリュー
ジルバーマン，ジョーゼフ
レヴチク，セルゲイ
ジャン，メン
グラズ，エラン
スーリヤデヴァラ，カリ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ICL IP America Inc
Original Assignee
ICL IP America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ICL IP America Inc filed Critical ICL IP America Inc
Publication of JP2019502011A publication Critical patent/JP2019502011A/ja
Publication of JP2019502011A5 publication Critical patent/JP2019502011A5/ja
Application granted granted Critical
Publication of JP6841839B2 publication Critical patent/JP6841839B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
    • C08G63/692—Polyesters containing atoms other than carbon, hydrogen and oxygen containing phosphorus
    • C08G63/6924—Polyesters containing atoms other than carbon, hydrogen and oxygen containing phosphorus derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/6926—Dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2018544762A 2015-11-13 2016-11-01 熱硬化性樹脂用の活性エステル硬化剤化合物、それを含む難燃性組成物、およびそれから製造される物品 Active JP6841839B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562254847P 2015-11-13 2015-11-13
US62/254,847 2015-11-13
PCT/US2016/059878 WO2017083136A1 (en) 2015-11-13 2016-11-01 Active ester curing agent compound for thermosetting resins, flame retardant composition comprising same, and articles made therefrom

Publications (3)

Publication Number Publication Date
JP2019502011A JP2019502011A (ja) 2019-01-24
JP2019502011A5 JP2019502011A5 (https=) 2019-04-25
JP6841839B2 true JP6841839B2 (ja) 2021-03-10

Family

ID=57249944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018544762A Active JP6841839B2 (ja) 2015-11-13 2016-11-01 熱硬化性樹脂用の活性エステル硬化剤化合物、それを含む難燃性組成物、およびそれから製造される物品

Country Status (7)

Country Link
US (1) US10500823B2 (https=)
EP (1) EP3374414B1 (https=)
JP (1) JP6841839B2 (https=)
KR (1) KR102670101B1 (https=)
CN (1) CN108350157B (https=)
TW (1) TWI721024B (https=)
WO (1) WO2017083136A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018031103A1 (en) * 2016-08-11 2018-02-15 Icl-Ip America Inc. Curable epoxy composition
TWI808064B (zh) * 2016-11-30 2023-07-11 美商Ｉｃｌ－Ｉｐ美國股份有限公司 熱固性樹脂之活性酯硬化劑、含彼之阻燃組成物及由彼製成的物品
KR102340799B1 (ko) * 2018-09-20 2021-12-16 주식회사 엘지화학 금속 박막 코팅용 열경화성 수지 조성물, 이를 이용한 수지 코팅 금속 박막 및 금속박 적층판
CN109851997B (zh) * 2018-12-25 2020-10-27 广东生益科技股份有限公司 一种热固性树脂组合物及使用其的预浸料、层压板和覆金属箔层压板
US20220153920A1 (en) * 2019-02-14 2022-05-19 Nissan Chemical Corporation Method for producing polymer
CN109929222B (zh) * 2019-03-18 2021-07-30 广东生益科技股份有限公司 一种树脂组合物、包含其的预浸料以及层压板和印制电路板
CN110016206B (zh) * 2019-03-18 2020-10-27 广东生益科技股份有限公司 一种树脂组合物、包含其的预浸料以及层压板和印制电路板
KR102371132B1 (ko) * 2021-05-13 2022-03-11 주식회사 신아티앤씨 에폭시용 난연성 경화제 조성물 및 이를 포함하는 에폭시용 난연성 경화제
CN120248304A (zh) * 2025-06-05 2025-07-04 营口圣泉高科材料有限公司 含磷活性酯化合物的制备方法及应用
JP7835341B1 (ja) * 2025-12-18 2026-03-25 ａｒｔｉｅｎｃｅ株式会社 電子部品被覆シート、無加圧加工用電子部品被覆シート、電子部品搭載基板およびその製造方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155115A (ja) * 1984-08-27 1986-03-19 Nippon Ester Co Ltd ポリアリレ−トの製造方法
JPS61118393A (ja) * 1984-11-15 1986-06-05 Nippon Ester Co Ltd ホスフイン酸の低級脂肪族ジカルボン酸エステル及びその製造法
JPS61136519A (ja) * 1984-12-05 1986-06-24 Nippon Ester Co Ltd ポリアリレ−トの製造方法
JPH0670285B2 (ja) * 1985-12-04 1994-09-07 日本エステル株式会社 補強用ポリエステル繊維材料
JPH06179756A (ja) * 1992-12-15 1994-06-28 Nippon Ester Co Ltd ポリエステル系耐炎性熱硬化フィルム
JP3633163B2 (ja) * 1995-12-27 2005-03-30 東レ株式会社 難燃性樹脂組成物
WO2001042359A1 (en) * 1999-12-13 2001-06-14 Dow Global Technologies Inc. Flame retardant phosphorus element-containing epoxy resin compositions
JP2003128784A (ja) * 2001-10-19 2003-05-08 Hitachi Chem Co Ltd 難燃性熱硬化性樹脂組成物、プリプレグ、絶縁フィルム、積層板、樹脂付き金属箔及び多層配線板とその製造方法
JP3905820B2 (ja) * 2002-11-08 2007-04-18 互応化学工業株式会社 難燃性エポキシ樹脂組成物、並びにそれを含有するプリプレグ、積層板、銅張積層板およびプリント配線板
BRPI0510861A (pt) * 2004-05-28 2007-12-26 Dow Global Technologies Inc processo para preparar um composto contendo fósforo, processo para preparar uma composição contendo fósforo, processo para preparar um composto de resina epóxi contendo fósforo, processo para preparar uma composição de resina epóxi contendo fósforo , processo para preparar um composto contendo um anel de benzoxazina e fósforo, processo para preparar uma composição de resina contendo anel de benzoxazina e fósforo, processo para preparar um composto contendo grupo termolábil e fósforo, processo para preparar uma composição de resina termolábil contendo fósforo, composto contendo fósforo, composição contendo fósforo, composição de resina epóxi contendo fósforo, composição contendo fósforo, composto de resina epóxi contendo fósforo, composto contendo anel de benzoxazina e fósforo, composição de resina contendo anel de benzoxazina e fósforo, composto contendo grupo termolábil e fósforo, composição de resina termolábil contendo fósforo, produto obtenìvel, composição de resina epóxi resistente à chama, composto de epóxi, composição de resina epóxi resistente a chama, composição de cura resistente à ignição, pré-impregnado, laminado, placa de circuito, poliol, resina de poliuretano resistente à chama, composição termoplástica resistente à ignição, composição hìbrida termoplástica / termofixa resistente à ignição e composição de revestimento
CN101663374B (zh) * 2007-04-03 2014-10-15 巴斯夫欧洲公司 Dopo阻燃剂组合物
JP5246744B2 (ja) * 2007-12-28 2013-07-24 新日鉄住金化学株式会社 難燃性接着剤樹脂組成物及びそれを用いたフレキシブルプリント基板用材料
DE102008009298B4 (de) * 2008-02-15 2011-04-14 Schill + Seilacher "Struktol" Aktiengesellschaft Härtbare Epoxidharzformulierungen mit Polyester-Flammschutzmittel
JP5188860B2 (ja) * 2008-03-31 2013-04-24 ユニチカ株式会社 被膜形成用樹脂
CN101307171A (zh) * 2008-07-10 2008-11-19 天津市凯华绝缘材料有限公司 一种含磷聚酯阻燃环氧树脂组合物
CN102203176A (zh) * 2008-10-29 2011-09-28 Icl-Ip美国公司 含磷阻燃环氧树脂组合物、其预浸料和层压板
KR101141305B1 (ko) 2009-03-31 2012-05-04 코오롱인더스트리 주식회사 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물
KR101319677B1 (ko) * 2011-10-28 2013-10-17 삼성전기주식회사 인쇄 회로 기판용 절연성 수지 조성물 및 이를 포함하는 인쇄 회로 기판
DE102011118490B4 (de) * 2011-11-11 2014-05-15 Schill + Seilacher "Struktol" Gmbh Halogenfreie, flammfeste Epoxidharz-Zusammensetzungen und deren Verwendung
US20150189745A1 (en) 2012-09-14 2015-07-02 Shengyi Technology Co., Ltd. Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
CN103694642B (zh) * 2013-12-27 2015-11-25 广东生益科技股份有限公司 一种热固性树脂组合物及其用途

Also Published As

Publication number Publication date
CN108350157B (zh) 2020-06-09
TW201728613A (zh) 2017-08-16
US10500823B2 (en) 2019-12-10
KR20180084778A (ko) 2018-07-25
JP2019502011A (ja) 2019-01-24
WO2017083136A1 (en) 2017-05-18
US20180326708A1 (en) 2018-11-15
TWI721024B (zh) 2021-03-11
EP3374414B1 (en) 2020-04-22
CN108350157A (zh) 2018-07-31
KR102670101B1 (ko) 2024-05-27
EP3374414A1 (en) 2018-09-19

Similar Documents

Publication Publication Date Title
JP6841839B2 (ja) 熱硬化性樹脂用の活性エステル硬化剤化合物、それを含む難燃性組成物、およびそれから製造される物品
CN102762581B (zh) 含磷原子低聚物、其制造方法、固化性树脂组合物、其固化物和印刷电路基板
CN1423678B (zh) 含磷元素阻燃剂环氧树脂组合物
US20020032279A1 (en) Flame retardant resin and flame retardant composition containing the same
TW201816006A (zh) 可固化環氧組成物
US20060223921A1 (en) Prepolymers containing phosphororganic compounds and uses thereof
WO2001042253A2 (en) Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
CN101754989A (zh) 阻燃剂组合物
CN101490067A (zh) 含磷苯并嗪化合物、其制造方法、固化性树脂组合物、固化物及层合板
JP6063521B2 (ja) リン含有フェノール樹脂化合物及びそれを原料として調製されたリン含有難燃性エポキシ樹脂硬化物
WO2015179232A1 (en) Halogen-free active ester curing agent compound for epoxy resins, flame retardant composition comprising same, articles made therefrom and method of making said compound
KR20120124465A (ko) 인-함유 화합물을 갖는 조성물
US20040158023A1 (en) Halogen-free resin composition
TW201739832A (zh) 噁嗪樹脂組合物及其製造方法、預浸料、層疊板以及硬化物
JP6947520B2 (ja) 有機リン化合物、有機リン化合物を含む硬化性樹脂組成物、その硬化物、及び有機リン化合物の製造方法。
JP6098908B2 (ja) 硬化性樹脂組成物、その硬化物、半導体封止材料、プリプレグ、回路基板、及び、ビルドアップフィルム
JP5880921B2 (ja) 硬化性樹脂組成物、その硬化物、プリント配線基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181009

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190314

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20191031

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20200708

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200728

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201028

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20210209

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210218

R150 Certificate of patent or registration of utility model

Ref document number: 6841839

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250