JP6818986B2 - コンタクトピン及びそれを有する試験台 - Google Patents

コンタクトピン及びそれを有する試験台 Download PDF

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Publication number
JP6818986B2
JP6818986B2 JP2018553881A JP2018553881A JP6818986B2 JP 6818986 B2 JP6818986 B2 JP 6818986B2 JP 2018553881 A JP2018553881 A JP 2018553881A JP 2018553881 A JP2018553881 A JP 2018553881A JP 6818986 B2 JP6818986 B2 JP 6818986B2
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JP
Japan
Prior art keywords
spring arm
contact
central region
spring
test
Prior art date
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Active
Application number
JP2018553881A
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English (en)
Japanese (ja)
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JP2019514001A (ja
JP2019514001A5 (enExample
Inventor
レイシュル、ステファン
フーバー、ルードウィク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Publication of JP2019514001A publication Critical patent/JP2019514001A/ja
Publication of JP2019514001A5 publication Critical patent/JP2019514001A5/ja
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Publication of JP6818986B2 publication Critical patent/JP6818986B2/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2018553881A 2016-04-13 2017-04-07 コンタクトピン及びそれを有する試験台 Active JP6818986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016004520.5 2016-04-13
DE102016004520.5A DE102016004520A1 (de) 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften
PCT/EP2017/000445 WO2017178105A1 (de) 2016-04-13 2017-04-07 Kontaktstift und testsockel mit kontaktstiften

Publications (3)

Publication Number Publication Date
JP2019514001A JP2019514001A (ja) 2019-05-30
JP2019514001A5 JP2019514001A5 (enExample) 2019-07-18
JP6818986B2 true JP6818986B2 (ja) 2021-01-27

Family

ID=58503566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018553881A Active JP6818986B2 (ja) 2016-04-13 2017-04-07 コンタクトピン及びそれを有する試験台

Country Status (8)

Country Link
US (1) US10641793B2 (enExample)
EP (1) EP3265831B1 (enExample)
JP (1) JP6818986B2 (enExample)
KR (1) KR101927678B1 (enExample)
CN (1) CN109416374B (enExample)
DE (1) DE102016004520A1 (enExample)
TW (1) TWI721151B (enExample)
WO (1) WO2017178105A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102590407B1 (ko) * 2017-10-31 2023-10-16 폼팩터, 인크. 디커플링된 전기 및 기계 프로브 연결들을 갖는 mems 프로브 카드 조립체
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
DE102018104264A1 (de) 2018-02-26 2019-08-29 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtung
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
WO2023196438A1 (en) * 2022-04-07 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
EP4372388A1 (en) 2022-11-18 2024-05-22 Cohu GmbH A test socket for and method of testing electronic components, in particular high-power semiconductor components

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447689A (ja) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Ｉｃタブ用ソケット
US5440231A (en) 1993-04-19 1995-08-08 Motorola, Inc. Method and apparatus for coupling a semiconductor device with a tester
JPH0747689A (ja) 1993-08-03 1995-02-21 Canon Inc 記録装置
JPH07254468A (ja) * 1994-03-15 1995-10-03 Sony Corp Ｉｃ測定用ソケット
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US6064218A (en) 1997-03-11 2000-05-16 Primeyield Systems, Inc. Peripherally leaded package test contactor
US6045367A (en) 1997-09-24 2000-04-04 Teledyne Industries, Inc. Multi-pin connector
US6491968B1 (en) * 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
TW490832B (en) * 1999-12-29 2002-06-11 Formfactor Inc Spring interconnect structures and methods for making spring interconnect structures
JP3810977B2 (ja) * 2000-02-25 2006-08-16 株式会社エンプラス 電気部品用ソケット
US6604950B2 (en) 2001-04-26 2003-08-12 Teledyne Technologies Incorporated Low pitch, high density connector
JP2002365308A (ja) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
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JP2005069711A (ja) * 2003-08-27 2005-03-17 Japan Electronic Materials Corp プローブカード及びそれに使用する接触子
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JP2006132982A (ja) * 2004-11-02 2006-05-25 Tokyo Electron Ltd プローブ
JP2008532011A (ja) * 2005-02-24 2008-08-14 エス ヴィ プルーブ ピーティーイー リミテッド ウェハ試験装置のプローブ
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Also Published As

Publication number Publication date
EP3265831B1 (de) 2018-06-13
KR101927678B1 (ko) 2018-12-10
JP2019514001A (ja) 2019-05-30
US10641793B2 (en) 2020-05-05
TW201738570A (zh) 2017-11-01
KR20180116420A (ko) 2018-10-24
DE102016004520A1 (de) 2017-10-19
WO2017178105A1 (de) 2017-10-19
TWI721151B (zh) 2021-03-11
US20190137545A1 (en) 2019-05-09
CN109416374A (zh) 2019-03-01
CN109416374B (zh) 2020-02-04
EP3265831A1 (de) 2018-01-10

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