DE102016004520A1 - Kontaktstift und Testsockel mit Kontaktstiften - Google Patents

Kontaktstift und Testsockel mit Kontaktstiften Download PDF

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Publication number
DE102016004520A1
DE102016004520A1 DE102016004520.5A DE102016004520A DE102016004520A1 DE 102016004520 A1 DE102016004520 A1 DE 102016004520A1 DE 102016004520 A DE102016004520 A DE 102016004520A DE 102016004520 A1 DE102016004520 A1 DE 102016004520A1
Authority
DE
Germany
Prior art keywords
spring arm
contact
contact pin
spring
test socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102016004520.5A
Other languages
German (de)
English (en)
Inventor
Stefan Reischl
Ludwig Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
Original Assignee
Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosenberger Hochfrequenztechnik GmbH and Co KG filed Critical Rosenberger Hochfrequenztechnik GmbH and Co KG
Priority to DE102016004520.5A priority Critical patent/DE102016004520A1/de
Priority to JP2018553881A priority patent/JP6818986B2/ja
Priority to CN201780023433.0A priority patent/CN109416374B/zh
Priority to KR1020187028346A priority patent/KR101927678B1/ko
Priority to US16/092,771 priority patent/US10641793B2/en
Priority to PCT/EP2017/000445 priority patent/WO2017178105A1/de
Priority to EP17716128.8A priority patent/EP3265831B1/de
Priority to TW106112197A priority patent/TWI721151B/zh
Publication of DE102016004520A1 publication Critical patent/DE102016004520A1/de
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE102016004520.5A 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften Withdrawn DE102016004520A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102016004520.5A DE102016004520A1 (de) 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften
JP2018553881A JP6818986B2 (ja) 2016-04-13 2017-04-07 コンタクトピン及びそれを有する試験台
CN201780023433.0A CN109416374B (zh) 2016-04-13 2017-04-07 触针和具有触针的测试基座
KR1020187028346A KR101927678B1 (ko) 2016-04-13 2017-04-07 접촉 핀 및 접촉 핀들을 구비한 테스트 베이스
US16/092,771 US10641793B2 (en) 2016-04-13 2017-04-07 Contact pin and test base having contact pins
PCT/EP2017/000445 WO2017178105A1 (de) 2016-04-13 2017-04-07 Kontaktstift und testsockel mit kontaktstiften
EP17716128.8A EP3265831B1 (de) 2016-04-13 2017-04-07 Kontaktstift und testsockel mit kontaktstiften
TW106112197A TWI721151B (zh) 2016-04-13 2017-04-12 探針及具有探針的測試插槽

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016004520.5A DE102016004520A1 (de) 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften

Publications (1)

Publication Number Publication Date
DE102016004520A1 true DE102016004520A1 (de) 2017-10-19

Family

ID=58503566

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102016004520.5A Withdrawn DE102016004520A1 (de) 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften

Country Status (8)

Country Link
US (1) US10641793B2 (enExample)
EP (1) EP3265831B1 (enExample)
JP (1) JP6818986B2 (enExample)
KR (1) KR101927678B1 (enExample)
CN (1) CN109416374B (enExample)
DE (1) DE102016004520A1 (enExample)
TW (1) TWI721151B (enExample)
WO (1) WO2017178105A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019089611A1 (en) 2017-10-31 2019-05-09 Formfactor, Inc. Mems probe card assembly having decoupled electrical and mechanical probe connections
WO2019162066A1 (de) 2018-02-26 2019-08-29 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtungen

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
WO2023196438A1 (en) * 2022-04-07 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
EP4372388A1 (en) 2022-11-18 2024-05-22 Cohu GmbH A test socket for and method of testing electronic components, in particular high-power semiconductor components

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447689A (ja) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Ｉｃタブ用ソケット
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
EP0906007B1 (en) 1997-09-24 2003-04-09 Teledyne Industries, Inc. Multi-pin connector
US20080258746A1 (en) * 2005-02-24 2008-10-23 Lich Thanh Tran Probes for a Wafer Test Apparatus
EP1200992B1 (en) * 1999-12-29 2008-10-29 FormFactor, Inc. Resilient interconnect structure for electronic components and method for making the same
US20140327461A1 (en) * 2013-05-06 2014-11-06 Formfactor, Inc. Probe Card Assembly For Testing Electronic Devices

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US5440231A (en) 1993-04-19 1995-08-08 Motorola, Inc. Method and apparatus for coupling a semiconductor device with a tester
JPH0747689A (ja) 1993-08-03 1995-02-21 Canon Inc 記録装置
JPH07254468A (ja) * 1994-03-15 1995-10-03 Sony Corp Ｉｃ測定用ソケット
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US6064218A (en) 1997-03-11 2000-05-16 Primeyield Systems, Inc. Peripherally leaded package test contactor
US6491968B1 (en) * 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
JP3810977B2 (ja) * 2000-02-25 2006-08-16 株式会社エンプラス 電気部品用ソケット
US6604950B2 (en) 2001-04-26 2003-08-12 Teledyne Technologies Incorporated Low pitch, high density connector
JP2002365308A (ja) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
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JP3860561B2 (ja) 2003-06-27 2006-12-20 タイコエレクトロニクスアンプ株式会社 Ｉｃソケット
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0447689A (ja) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Ｉｃタブ用ソケット
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
EP0906007B1 (en) 1997-09-24 2003-04-09 Teledyne Industries, Inc. Multi-pin connector
EP1200992B1 (en) * 1999-12-29 2008-10-29 FormFactor, Inc. Resilient interconnect structure for electronic components and method for making the same
US20080258746A1 (en) * 2005-02-24 2008-10-23 Lich Thanh Tran Probes for a Wafer Test Apparatus
US20140327461A1 (en) * 2013-05-06 2014-11-06 Formfactor, Inc. Probe Card Assembly For Testing Electronic Devices

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019089611A1 (en) 2017-10-31 2019-05-09 Formfactor, Inc. Mems probe card assembly having decoupled electrical and mechanical probe connections
EP3704496A4 (en) * 2017-10-31 2021-08-11 FormFactor, Inc. MEMS PROBE CARD ARRANGEMENT WITH DECOUPLED ELECTRICAL AND MECHANICAL PROBE CONNECTIONS
WO2019162066A1 (de) 2018-02-26 2019-08-29 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtungen
CN112136250A (zh) * 2018-02-26 2020-12-25 罗森伯格高频技术有限及两合公司 用于生产至少一个高频接触元件或高频接触元件组件的方法和相关装置
CN112136250B (zh) * 2018-02-26 2022-04-08 罗森伯格高频技术有限及两合公司 生产高频接触元件或组件的方法和装置
US11984693B2 (en) 2018-02-26 2024-05-14 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Method for producing at least one high-frequency contact element or a high-frequency contact element arrangement

Also Published As

Publication number Publication date
EP3265831B1 (de) 2018-06-13
KR101927678B1 (ko) 2018-12-10
JP2019514001A (ja) 2019-05-30
US10641793B2 (en) 2020-05-05
TW201738570A (zh) 2017-11-01
KR20180116420A (ko) 2018-10-24
JP6818986B2 (ja) 2021-01-27
WO2017178105A1 (de) 2017-10-19
TWI721151B (zh) 2021-03-11
US20190137545A1 (en) 2019-05-09
CN109416374A (zh) 2019-03-01
CN109416374B (zh) 2020-02-04
EP3265831A1 (de) 2018-01-10

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