CN109416374B - 触针和具有触针的测试基座 - Google Patents

触针和具有触针的测试基座 Download PDF

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Publication number
CN109416374B
CN109416374B CN201780023433.0A CN201780023433A CN109416374B CN 109416374 B CN109416374 B CN 109416374B CN 201780023433 A CN201780023433 A CN 201780023433A CN 109416374 B CN109416374 B CN 109416374B
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CN
China
Prior art keywords
elastic arm
arm
elastic
contact
central region
Prior art date
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CN201780023433.0A
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English (en)
Chinese (zh)
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CN109416374A (zh
Inventor
斯蒂芬·赖希尔
路德维格·休伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosenberger Hochfrequenztechnik GmbH and Co KG
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Rosenberger Hochfrequenztechnik GmbH and Co KG
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Publication of CN109416374A publication Critical patent/CN109416374A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201780023433.0A 2016-04-13 2017-04-07 触针和具有触针的测试基座 Active CN109416374B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016004520.5 2016-04-13
DE102016004520.5A DE102016004520A1 (de) 2016-04-13 2016-04-13 Kontaktstift und Testsockel mit Kontaktstiften
PCT/EP2017/000445 WO2017178105A1 (de) 2016-04-13 2017-04-07 Kontaktstift und testsockel mit kontaktstiften

Publications (2)

Publication Number Publication Date
CN109416374A CN109416374A (zh) 2019-03-01
CN109416374B true CN109416374B (zh) 2020-02-04

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Application Number Title Priority Date Filing Date
CN201780023433.0A Active CN109416374B (zh) 2016-04-13 2017-04-07 触针和具有触针的测试基座

Country Status (8)

Country Link
US (1) US10641793B2 (enExample)
EP (1) EP3265831B1 (enExample)
JP (1) JP6818986B2 (enExample)
KR (1) KR101927678B1 (enExample)
CN (1) CN109416374B (enExample)
DE (1) DE102016004520A1 (enExample)
TW (1) TWI721151B (enExample)
WO (1) WO2017178105A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102590407B1 (ko) * 2017-10-31 2023-10-16 폼팩터, 인크. 디커플링된 전기 및 기계 프로브 연결들을 갖는 mems 프로브 카드 조립체
CN108306138A (zh) * 2018-01-09 2018-07-20 番禺得意精密电子工业有限公司 电连接器
DE102018104264A1 (de) 2018-02-26 2019-08-29 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Verfahren zur herstellung von mindestens einem hochfrequenz-kontaktelement oder einer hochfrequenz-kontaktelement-anordnung sowie zugehörige vorrichtung
CN111880067B (zh) * 2019-04-15 2023-05-05 台湾中华精测科技股份有限公司 晶片测试组件及其电性连接模块
TWI745182B (zh) * 2020-11-30 2021-11-01 中華精測科技股份有限公司 探針卡裝置及雙臂式探針
WO2023196438A1 (en) * 2022-04-07 2023-10-12 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
EP4372388A1 (en) 2022-11-18 2024-05-22 Cohu GmbH A test socket for and method of testing electronic components, in particular high-power semiconductor components

Citations (5)

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EP0621484A1 (en) * 1993-04-19 1994-10-26 Motorola, Inc. Method and apparatus for coupling a semiconductor device with a tester
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
EP0966687A1 (en) * 1997-03-11 1999-12-29 Primeyield Systems, Inc. Peripherally leaded package test contactor
CN101031804A (zh) * 2004-08-11 2007-09-05 安拓锐高新测试技术有限公司 用于探针卡的互连组件
WO2014003003A1 (ja) * 2012-06-25 2014-01-03 山一電機株式会社 電気テスト用コンタクトおよびそれを用いた電気テスト用ソケット

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JPH0447689A (ja) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Ｉｃタブ用ソケット
JPH0747689A (ja) 1993-08-03 1995-02-21 Canon Inc 記録装置
JPH07254468A (ja) * 1994-03-15 1995-10-03 Sony Corp Ｉｃ測定用ソケット
US6034534A (en) * 1995-05-25 2000-03-07 Kiyota; Shigeo Laminated contact probe for inspection of ultra-microscopic pitch
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EP0621484A1 (en) * 1993-04-19 1994-10-26 Motorola, Inc. Method and apparatus for coupling a semiconductor device with a tester
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
EP0966687A1 (en) * 1997-03-11 1999-12-29 Primeyield Systems, Inc. Peripherally leaded package test contactor
CN101031804A (zh) * 2004-08-11 2007-09-05 安拓锐高新测试技术有限公司 用于探针卡的互连组件
WO2014003003A1 (ja) * 2012-06-25 2014-01-03 山一電機株式会社 電気テスト用コンタクトおよびそれを用いた電気テスト用ソケット

Also Published As

Publication number Publication date
EP3265831B1 (de) 2018-06-13
KR101927678B1 (ko) 2018-12-10
JP2019514001A (ja) 2019-05-30
US10641793B2 (en) 2020-05-05
TW201738570A (zh) 2017-11-01
KR20180116420A (ko) 2018-10-24
DE102016004520A1 (de) 2017-10-19
JP6818986B2 (ja) 2021-01-27
WO2017178105A1 (de) 2017-10-19
TWI721151B (zh) 2021-03-11
US20190137545A1 (en) 2019-05-09
CN109416374A (zh) 2019-03-01
EP3265831A1 (de) 2018-01-10

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