JP6818520B2 - 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法 - Google Patents

中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法 Download PDF

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Publication number
JP6818520B2
JP6818520B2 JP2016220435A JP2016220435A JP6818520B2 JP 6818520 B2 JP6818520 B2 JP 6818520B2 JP 2016220435 A JP2016220435 A JP 2016220435A JP 2016220435 A JP2016220435 A JP 2016220435A JP 6818520 B2 JP6818520 B2 JP 6818520B2
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Japan
Prior art keywords
plating
barrel
plating solution
acid
speed rotary
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JP2016220435A
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English (en)
Japanese (ja)
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JP2018076570A (ja
Inventor
近藤 誠
近藤  誠
水野 陽子
陽子 水野
Original Assignee
ローム・アンド・ハース電子材料株式会社
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Priority to JP2016220435A priority Critical patent/JP6818520B2/ja
Priority to US15/730,244 priority patent/US20180135195A1/en
Priority to TW106137168A priority patent/TWI659130B/zh
Priority to CN201711057609.2A priority patent/CN108070885B/zh
Priority to KR1020170145250A priority patent/KR102097996B1/ko
Priority to EP17200630.6A priority patent/EP3321396B1/de
Publication of JP2018076570A publication Critical patent/JP2018076570A/ja
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/30Electroplating: Baths therefor from solutions of tin
    • C25D3/32Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • C25D17/18Apparatus for electrolytic coating of small objects in bulk having closed containers
    • C25D17/20Horizontal barrels
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2016220435A 2016-11-11 2016-11-11 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法 Active JP6818520B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016220435A JP6818520B2 (ja) 2016-11-11 2016-11-11 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法
US15/730,244 US20180135195A1 (en) 2016-11-11 2017-10-11 Barrel plating or high-speed rotary plating using a neutral tin plating solution
TW106137168A TWI659130B (zh) 2016-11-11 2017-10-27 使用中性鍍錫液之滾鍍或高速旋轉電鍍
CN201711057609.2A CN108070885B (zh) 2016-11-11 2017-11-01 使用中性镀锡液的滚镀或高速旋转电镀
KR1020170145250A KR102097996B1 (ko) 2016-11-11 2017-11-02 중성 주석 도금액을 사용한 바렐 도금 또는 고속 회전식 도금
EP17200630.6A EP3321396B1 (de) 2016-11-11 2017-11-08 Trommelplattierung oder hochgeschwindigkeitsdrehplattierung mit einer neutralen zinnplattierungslösung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016220435A JP6818520B2 (ja) 2016-11-11 2016-11-11 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法

Publications (2)

Publication Number Publication Date
JP2018076570A JP2018076570A (ja) 2018-05-17
JP6818520B2 true JP6818520B2 (ja) 2021-01-20

Family

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JP2016220435A Active JP6818520B2 (ja) 2016-11-11 2016-11-11 中性スズめっき液を用いたバレルめっきまたは高速回転めっき方法

Country Status (6)

Country Link
US (1) US20180135195A1 (de)
EP (1) EP3321396B1 (de)
JP (1) JP6818520B2 (de)
KR (1) KR102097996B1 (de)
CN (1) CN108070885B (de)
TW (1) TWI659130B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111918998A (zh) 2018-04-12 2020-11-10 东丽株式会社 片状物及其制造方法
CN109338420A (zh) * 2018-12-14 2019-02-15 江苏艾森半导体材料股份有限公司 一种环保中性电镀锡电解液
JP2022059731A (ja) * 2020-10-02 2022-04-14 メルテックス株式会社 バレルめっき用スズめっき液
CN113930812B (zh) * 2021-11-15 2023-10-31 广东羚光新材料股份有限公司 片式电子元器件镀锡液和锡电镀方法
CN114351232A (zh) * 2022-01-14 2022-04-15 张家港扬子江冷轧板有限公司 一种电镀锡预电镀漂洗水循环系统及循环方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282954A (en) * 1991-12-30 1994-02-01 Atotech Usa, Inc. Alkoxylated diamine surfactants in high-speed tin plating
JP4249292B2 (ja) * 1998-07-10 2009-04-02 株式会社大和化成研究所 錫及び錫合金メッキ浴
JP3910028B2 (ja) * 2001-09-13 2007-04-25 株式会社村田製作所 チップ型セラミックス電子部品の電極形成法
JP3858241B2 (ja) 2002-04-09 2006-12-13 石原薬品株式会社 中性スズメッキ浴を用いたバレルメッキ方法
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
JP4812365B2 (ja) * 2005-08-19 2011-11-09 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 錫電気めっき液および錫電気めっき方法
JP5337352B2 (ja) * 2007-04-24 2013-11-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 錫または錫合金電気めっき液
JP5583894B2 (ja) 2008-06-12 2014-09-03 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 電気錫めっき液および電気錫めっき方法
JP5622360B2 (ja) * 2009-01-16 2014-11-12 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 電気錫めっき液および電気錫めっき方法
US20150122661A1 (en) * 2013-11-05 2015-05-07 Rohm And Haas Electronic Materials Llc Plating bath and method

Also Published As

Publication number Publication date
CN108070885A (zh) 2018-05-25
JP2018076570A (ja) 2018-05-17
EP3321396A1 (de) 2018-05-16
CN108070885B (zh) 2020-09-15
EP3321396B1 (de) 2021-07-07
TWI659130B (zh) 2019-05-11
KR20180053229A (ko) 2018-05-21
TW201817921A (zh) 2018-05-16
KR102097996B1 (ko) 2020-04-07
US20180135195A1 (en) 2018-05-17

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