JP6765272B2 - ポリイミドフィルム - Google Patents

ポリイミドフィルム Download PDF

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Publication number
JP6765272B2
JP6765272B2 JP2016195260A JP2016195260A JP6765272B2 JP 6765272 B2 JP6765272 B2 JP 6765272B2 JP 2016195260 A JP2016195260 A JP 2016195260A JP 2016195260 A JP2016195260 A JP 2016195260A JP 6765272 B2 JP6765272 B2 JP 6765272B2
Authority
JP
Japan
Prior art keywords
film
points
polyimide
polyimide film
width direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016195260A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018058923A (ja
Inventor
弘晃 小路
弘晃 小路
亮作 我妻
亮作 我妻
大史 大場
大史 大場
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Du Pont Toray Co Ltd
Original Assignee
Du Pont Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont Toray Co Ltd filed Critical Du Pont Toray Co Ltd
Priority to JP2016195260A priority Critical patent/JP6765272B2/ja
Priority to TW106132181A priority patent/TWI741030B/zh
Priority to CN201710910771.8A priority patent/CN107880546A/zh
Priority to KR1020170126892A priority patent/KR102432657B1/ko
Publication of JP2018058923A publication Critical patent/JP2018058923A/ja
Application granted granted Critical
Publication of JP6765272B2 publication Critical patent/JP6765272B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
JP2016195260A 2016-09-30 2016-09-30 ポリイミドフィルム Active JP6765272B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016195260A JP6765272B2 (ja) 2016-09-30 2016-09-30 ポリイミドフィルム
TW106132181A TWI741030B (zh) 2016-09-30 2017-09-20 聚醯亞胺膜
CN201710910771.8A CN107880546A (zh) 2016-09-30 2017-09-29 聚酰亚胺膜
KR1020170126892A KR102432657B1 (ko) 2016-09-30 2017-09-29 폴리이미드 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016195260A JP6765272B2 (ja) 2016-09-30 2016-09-30 ポリイミドフィルム

Publications (2)

Publication Number Publication Date
JP2018058923A JP2018058923A (ja) 2018-04-12
JP6765272B2 true JP6765272B2 (ja) 2020-10-07

Family

ID=61781103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016195260A Active JP6765272B2 (ja) 2016-09-30 2016-09-30 ポリイミドフィルム

Country Status (4)

Country Link
JP (1) JP6765272B2 (zh)
KR (1) KR102432657B1 (zh)
CN (1) CN107880546A (zh)
TW (1) TWI741030B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102445910B1 (ko) * 2020-11-24 2022-09-22 피아이첨단소재 주식회사 높은 치수 안정성을 가지는 폴리이미드 필름 및 그 제조방법
JP2022151287A (ja) 2021-03-26 2022-10-07 富士フイルムビジネスイノベーション株式会社 ポリイミド前駆体皮膜、ポリイミドフィルムの製造方法
KR102634466B1 (ko) * 2021-08-20 2024-02-06 에스케이마이크로웍스 주식회사 폴리아마이드-이미드계 필름, 이의 제조방법, 및 이를 포함하는 커버 윈도우 및 디스플레이 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002047360A (ja) * 2000-04-21 2002-02-12 Toray Ind Inc ポリフェニレンスルフィドフィルム、その製造方法および回路基板
JP4922754B2 (ja) * 2004-03-03 2012-04-25 株式会社カネカ 分子配向が制御されたポリイミドフィルムの製造方法およびその利用
US8445099B2 (en) * 2009-11-30 2013-05-21 E. I. Du Pont De Nemours And Company Polyimide film
JP5754692B2 (ja) * 2012-03-13 2015-07-29 東レ・デュポン株式会社 ポリイミドフィルムの製造方法
TWI580712B (zh) * 2012-06-08 2017-05-01 東麗 杜邦股份有限公司 聚亞醯胺膜
JP6325265B2 (ja) * 2013-03-07 2018-05-16 東レ・デュポン株式会社 ポリイミドフィルム、および、その製造方法
JP6134213B2 (ja) * 2013-06-26 2017-05-24 東レ・デュポン株式会社 ポリイミドフィルム
JP6148556B2 (ja) * 2013-07-22 2017-06-14 東レ・デュポン株式会社 ポリイミドフィルム
JP6370609B2 (ja) * 2014-05-29 2018-08-08 東レ・デュポン株式会社 ポリイミドフィルム
JP2016132744A (ja) * 2015-01-21 2016-07-25 東レ・デュポン株式会社 ポリイミドフィルム

Also Published As

Publication number Publication date
KR20180036601A (ko) 2018-04-09
TW201817784A (zh) 2018-05-16
TWI741030B (zh) 2021-10-01
CN107880546A (zh) 2018-04-06
JP2018058923A (ja) 2018-04-12
KR102432657B1 (ko) 2022-08-16

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