JP6742849B2 - 基板搬送ロボット、真空処理装置 - Google Patents

基板搬送ロボット、真空処理装置 Download PDF

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Publication number
JP6742849B2
JP6742849B2 JP2016149937A JP2016149937A JP6742849B2 JP 6742849 B2 JP6742849 B2 JP 6742849B2 JP 2016149937 A JP2016149937 A JP 2016149937A JP 2016149937 A JP2016149937 A JP 2016149937A JP 6742849 B2 JP6742849 B2 JP 6742849B2
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JP
Japan
Prior art keywords
substrate
plate
quartz
transfer robot
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016149937A
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English (en)
Japanese (ja)
Other versions
JP2018019015A (ja
Inventor
洋介 神保
洋介 神保
謙次 江藤
謙次 江藤
厳 藤井
厳 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Priority to JP2016149937A priority Critical patent/JP6742849B2/ja
Priority to KR1020170093481A priority patent/KR102269697B1/ko
Priority to CN201710629887.4A priority patent/CN107665845B/zh
Priority to TW106122561A priority patent/TWI721190B/zh
Publication of JP2018019015A publication Critical patent/JP2018019015A/ja
Application granted granted Critical
Publication of JP6742849B2 publication Critical patent/JP6742849B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2016149937A 2016-07-29 2016-07-29 基板搬送ロボット、真空処理装置 Active JP6742849B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016149937A JP6742849B2 (ja) 2016-07-29 2016-07-29 基板搬送ロボット、真空処理装置
KR1020170093481A KR102269697B1 (ko) 2016-07-29 2017-07-24 기판 반송 로봇, 진공 처리 장치
CN201710629887.4A CN107665845B (zh) 2016-07-29 2017-07-28 基板搬运机器人及真空处理装置
TW106122561A TWI721190B (zh) 2016-07-29 2017-07-31 基板搬送機器人、真空處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016149937A JP6742849B2 (ja) 2016-07-29 2016-07-29 基板搬送ロボット、真空処理装置

Publications (2)

Publication Number Publication Date
JP2018019015A JP2018019015A (ja) 2018-02-01
JP6742849B2 true JP6742849B2 (ja) 2020-08-19

Family

ID=61075966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016149937A Active JP6742849B2 (ja) 2016-07-29 2016-07-29 基板搬送ロボット、真空処理装置

Country Status (4)

Country Link
JP (1) JP6742849B2 (ko)
KR (1) KR102269697B1 (ko)
CN (1) CN107665845B (ko)
TW (1) TWI721190B (ko)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721458Y2 (ja) * 1989-10-31 1995-05-17 大日本スクリーン製造株式会社 ウエハ搬送アーム
JPH03217041A (ja) * 1990-01-22 1991-09-24 Dainippon Screen Mfg Co Ltd 基板搬送用アーム
JPH0529431A (ja) * 1991-07-25 1993-02-05 Matsushita Electric Ind Co Ltd 基板搬送用アーム
JP3238432B2 (ja) * 1991-08-27 2001-12-17 東芝機械株式会社 マルチチャンバ型枚葉処理装置
JPH0722489A (ja) * 1993-06-29 1995-01-24 Toshiba Corp ウェハーフォーク
JPH08330385A (ja) * 1995-05-31 1996-12-13 Kokusai Electric Co Ltd 基板搬送ツィーザ
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
JP2003045937A (ja) * 2001-07-31 2003-02-14 Ishikawajima Harima Heavy Ind Co Ltd 高温炉用ハンド
JP2003224173A (ja) * 2002-01-29 2003-08-08 Komatsu Electronic Metals Co Ltd 半導体製造装置
JP2004018215A (ja) * 2002-06-18 2004-01-22 Tokyo Electron Ltd フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法
US7073834B2 (en) * 2004-06-25 2006-07-11 Applied Materials, Inc. Multiple section end effector assembly
US8545165B2 (en) * 2005-03-30 2013-10-01 Brooks Automation, Inc. High speed substrate aligner apparatus
JP2008227200A (ja) * 2007-03-14 2008-09-25 Ihi Corp 基板容器用ロボットハンドと蓋付基板容器
US8057602B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
JP5548163B2 (ja) * 2010-09-14 2014-07-16 株式会社日立国際電気 基板搬送機構、基板処理装置および半導体装置の製造方法
WO2012148568A1 (en) * 2011-03-01 2012-11-01 Applied Materials, Inc. Method and apparatus for substrate transfer and radical confinement
JP5959221B2 (ja) * 2011-11-16 2016-08-02 日本電産サンキョー株式会社 産業用ロボット
JP6256909B2 (ja) * 2013-10-21 2018-01-10 株式会社アルバック 基板搬送装置および基板処理装置
US9415519B2 (en) * 2014-07-01 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Composite end effector and method of making a composite end effector

Also Published As

Publication number Publication date
TWI721190B (zh) 2021-03-11
CN107665845B (zh) 2023-04-14
TW201807768A (zh) 2018-03-01
KR20180013737A (ko) 2018-02-07
JP2018019015A (ja) 2018-02-01
CN107665845A (zh) 2018-02-06
KR102269697B1 (ko) 2021-06-25

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