TWI721190B - 基板搬送機器人、真空處理裝置 - Google Patents

基板搬送機器人、真空處理裝置 Download PDF

Info

Publication number
TWI721190B
TWI721190B TW106122561A TW106122561A TWI721190B TW I721190 B TWI721190 B TW I721190B TW 106122561 A TW106122561 A TW 106122561A TW 106122561 A TW106122561 A TW 106122561A TW I721190 B TWI721190 B TW I721190B
Authority
TW
Taiwan
Prior art keywords
plate
quartz
palm
fingers
substrate
Prior art date
Application number
TW106122561A
Other languages
English (en)
Chinese (zh)
Other versions
TW201807768A (zh
Inventor
神保洋介
江藤謙次
藤井厳
Original Assignee
日商愛發科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商愛發科股份有限公司 filed Critical 日商愛發科股份有限公司
Publication of TW201807768A publication Critical patent/TW201807768A/zh
Application granted granted Critical
Publication of TWI721190B publication Critical patent/TWI721190B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW106122561A 2016-07-29 2017-07-31 基板搬送機器人、真空處理裝置 TWI721190B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016149937A JP6742849B2 (ja) 2016-07-29 2016-07-29 基板搬送ロボット、真空処理装置
JP2016-149937 2016-07-29

Publications (2)

Publication Number Publication Date
TW201807768A TW201807768A (zh) 2018-03-01
TWI721190B true TWI721190B (zh) 2021-03-11

Family

ID=61075966

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106122561A TWI721190B (zh) 2016-07-29 2017-07-31 基板搬送機器人、真空處理裝置

Country Status (4)

Country Link
JP (1) JP6742849B2 (ko)
KR (1) KR102269697B1 (ko)
CN (1) CN107665845B (ko)
TW (1) TWI721190B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200717692A (en) * 2005-07-11 2007-05-01 Brooks Automation Inc High speed substrate aligner apparatus
TW201214610A (en) * 2010-09-14 2012-04-01 Hitachi Int Electric Inc Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method
WO2012148568A1 (en) * 2011-03-01 2012-11-01 Applied Materials, Inc. Method and apparatus for substrate transfer and radical confinement
TW201320237A (zh) * 2008-01-21 2013-05-16 Applied Materials Inc 用以在處理腔室內支撐、定位及旋轉基板的設備與方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0721458Y2 (ja) * 1989-10-31 1995-05-17 大日本スクリーン製造株式会社 ウエハ搬送アーム
JPH03217041A (ja) * 1990-01-22 1991-09-24 Dainippon Screen Mfg Co Ltd 基板搬送用アーム
JPH0529431A (ja) * 1991-07-25 1993-02-05 Matsushita Electric Ind Co Ltd 基板搬送用アーム
JP3238432B2 (ja) * 1991-08-27 2001-12-17 東芝機械株式会社 マルチチャンバ型枚葉処理装置
JPH0722489A (ja) * 1993-06-29 1995-01-24 Toshiba Corp ウェハーフォーク
JPH08330385A (ja) * 1995-05-31 1996-12-13 Kokusai Electric Co Ltd 基板搬送ツィーザ
US5746460A (en) * 1995-12-08 1998-05-05 Applied Materials, Inc. End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
JP2003045937A (ja) * 2001-07-31 2003-02-14 Ishikawajima Harima Heavy Ind Co Ltd 高温炉用ハンド
JP2003224173A (ja) * 2002-01-29 2003-08-08 Komatsu Electronic Metals Co Ltd 半導体製造装置
JP2004018215A (ja) * 2002-06-18 2004-01-22 Tokyo Electron Ltd フラット・パネル・ディスプレイ用熱処理装置及び熱処理方法
US7073834B2 (en) * 2004-06-25 2006-07-11 Applied Materials, Inc. Multiple section end effector assembly
JP2008227200A (ja) * 2007-03-14 2008-09-25 Ihi Corp 基板容器用ロボットハンドと蓋付基板容器
US8382180B2 (en) * 2007-10-31 2013-02-26 Applied Material, Inc. Advanced FI blade for high temperature extraction
JP5959221B2 (ja) * 2011-11-16 2016-08-02 日本電産サンキョー株式会社 産業用ロボット
JP6256909B2 (ja) * 2013-10-21 2018-01-10 株式会社アルバック 基板搬送装置および基板処理装置
US9415519B2 (en) * 2014-07-01 2016-08-16 Varian Semiconductor Equipment Associates, Inc. Composite end effector and method of making a composite end effector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200717692A (en) * 2005-07-11 2007-05-01 Brooks Automation Inc High speed substrate aligner apparatus
TW201320237A (zh) * 2008-01-21 2013-05-16 Applied Materials Inc 用以在處理腔室內支撐、定位及旋轉基板的設備與方法
TW201214610A (en) * 2010-09-14 2012-04-01 Hitachi Int Electric Inc Substrate carrying mechanism, substrate processing apparatus, and semiconductor device manufacturing method
WO2012148568A1 (en) * 2011-03-01 2012-11-01 Applied Materials, Inc. Method and apparatus for substrate transfer and radical confinement

Also Published As

Publication number Publication date
CN107665845B (zh) 2023-04-14
TW201807768A (zh) 2018-03-01
KR20180013737A (ko) 2018-02-07
JP2018019015A (ja) 2018-02-01
CN107665845A (zh) 2018-02-06
JP6742849B2 (ja) 2020-08-19
KR102269697B1 (ko) 2021-06-25

Similar Documents

Publication Publication Date Title
US20240112937A1 (en) On the fly automatic wafer centering method and apparatus
TWI455226B (zh) 用於基板傳送設備且在高溫下防下垂的端效器
JP4254116B2 (ja) 位置合わせ用基板
JP7158238B2 (ja) 基板処理システム
JP7244401B2 (ja) アライメント装置、成膜装置、アライメント方法、成膜方法、及び電子デバイスの製造方法
KR101020474B1 (ko) 로봇아암의 관절
JP2017100261A (ja) 搬送装置及び補正方法
TWI700160B (zh) 基板搬送方法及基板處理系統
TWI752910B (zh) 同步自動晶圓定心方法及設備
US20200357674A1 (en) Robot hand, wafer transfer robot, and wafer transfer apparatus
JP4534886B2 (ja) 処理システム
JP4346765B2 (ja) 基板搬送ロボット
US8402628B2 (en) Apparatus, carrier, and method for securing an article for coating processes
TWI721190B (zh) 基板搬送機器人、真空處理裝置
KR102652598B1 (ko) 기판 반송 장치, 기판 반송 방법, 및 기판 처리 시스템
KR102127577B1 (ko) 기판 처리 장치 및 기판 처리 장치의 운전 방법
JP7550104B2 (ja) 基板搬送装置及びアームの冷却方法
US20110142579A1 (en) Transfer device and target object processing apparatus including same
JP2006237256A (ja) 基板搬送ハンド
US20170087727A1 (en) Conveying apparatus and conveying system with cant surfaces
KR200451640Y1 (ko) 고온 인출용 블레이드
JP2018006500A (ja) 搬送対象物を搬送する搬送方法
JP2007142449A (ja) 基板搬送装置
JP2011108923A (ja) 真空処理装置
US20160035604A1 (en) Substrate Processing Device and Substrate Processing Device-Use Coupling Member