TWI700160B - 基板搬送方法及基板處理系統 - Google Patents
基板搬送方法及基板處理系統 Download PDFInfo
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Abstract
提供一種可以所欲之旋轉角度來正確地載置基板的基板搬送方法。
以伴隨著晶圓之搬送距離的變化而解決真空處理室之晶圓的旋轉方向偏移的方式,在裝載室中從台之中心來將晶圓偏移載置,以改變在搬送臂接收晶圓時,晶圓相對於夾具之旋轉角度。
Description
本發明係關於一種以搬送臂來搬送基板之基板搬送方法及基板處理系統。
對作為基板之半導體晶圓(以下,僅稱為「晶圓」)施予既定處理,例如為高溫處理之成膜處理或使用電漿之蝕刻處理的基板處理系統係具備有複數處理室以及連接於各處理室之搬送室,而藉由搬送室內所配置之搬送臂來將晶圓朝各搬送室搬出入。各處理室係具有載置台,晶圓係被載置於載置台。另外,在下述說明中,係將搬送臂中節點(彎曲點)與節點之間成為一體而加以移動的部分稱為節,將搬送臂之前端部稱為終端作動器。又,所謂2節式之搬送臂係表示具有2個節之搬送臂,所謂1節式之搬送臂係表示具有僅1個節之搬送臂。
自以往,基板處理系統係使用2節式之無向型或多關節型之搬送臂來作為搬送臂。該等搬送臂係具有作為握持晶圓之終端作動器的叉具以及作為節的2個臂部,且叉具與各臂部會個別地被加以構成。
然而,近年來,晶圓處理的高溫化有所進展,例如,會有在處理室中將晶圓加熱至例如700℃~800℃的情況。在此情況,搬送臂之叉具及臂部便會因來自高溫晶圓之導熱而被加熱,便有臂部所內建之軸承及驅動帶會因為熱能而破損之虞。於是,本申請人便提議有一種1節式之搬送臂,係廢除軸承及驅動帶且為了提高耐熱性而具有將叉具與臂部一體化的終端作動器(例如參照專利文獻1)。雖1節式之搬送臂在搬送晶圓時,終端作動器會握持晶圓,但在讓該搬送臂伸長時,由於終端作動器會旋轉,故該終端作動器
所握持之晶圓亦會旋轉。另一方面,基板處理系統為了對晶圓正確地施予既定處理,係需要以所欲之旋轉角度來將晶圓正確地載置。
【先前技術文獻】
【專利文獻】
專利文獻1:日本特願2016-016863號說明書
然而,為了對應於起因於基板處理系統之各構成要素的熱膨脹所致之晶圓實質上的搬送距離之改變,或者是為了對應於伴隨著相對於所握持之晶圓的終端作動器的位置偏移之修正所致的晶圓之搬送距離的改變,便會產生有需要改變晶圓之搬送量,亦即搬送臂之伸長量的情況。在此情況,因為搬送臂之伸長量改變,便會使得晶圓較既定旋轉角度要過度地旋轉,而產生無法以所欲旋轉角度來將晶圓正確地載置在載置台的問題。
本發明之目的係提供一種可以所欲之旋轉角度來正確地載置基板的基板搬送方法及基板處理系統。
為了達成上述目的,本發明的基板搬送方法,係基板處理系統之基板搬送方法,該基板處理系統係具備有從搬送端來接收基板且朝搬送目的地搬送之搬送系統,該搬送系統係具有握持該基板之握持部,且為了搬送該基板,在該搬送系統伸長時,該搬送系統會讓該握持部旋轉,該基板搬送方法係具有:第1步驟,係計算出該搬送目的地之該基板的旋轉方向偏移;以及第2步驟,係以解決該計算出之基板的旋轉方向偏移之方式,來改變在該搬送系統於該搬送端中接收該基板時,該基板相對於該握持部之旋轉角度。
為了達成上述目的,本發明的基板處理系統,係具備有將基板從搬送端接收且朝搬送目的地搬送之搬送系統以及控制部,該搬送系統係具有握持該基板之握持部,為了搬送該基板,而在該搬送系統伸長時,該搬送系統會讓該握持部旋轉之基板處理系統;該控制部會計算出該搬送目的地之該基板的旋轉方向偏移,且進一步地以解決所計算出之該基板的旋轉方向
偏移之方式來改變該搬送系統在該搬送端接收該基板時,該基板相對於該握持部之旋轉角度。
根據本發明,便可以解決搬送目的地之基板旋轉方向偏移的方式來改變搬送系統在搬送端接收基板時,基板相對於握持部之旋轉角度。藉此,便可防止在搬送目的地產生基板之旋轉方向偏移,並可以所欲之旋轉角度來在搬送目的地中正確地載置基板。
W‧‧‧晶圓
10‧‧‧基板處理系統
11‧‧‧真空處理室
13‧‧‧裝載室
18‧‧‧搬送臂
20‧‧‧系統
27‧‧‧終端作動器
28‧‧‧叉具
圖1係概略性地顯示本發明實施形態相關之基板處理系統的構成之俯視圖。
圖2係用以說明圖1之搬送臂的構成之俯視圖,圖2(A)係顯示搬送臂收縮時之情況,圖2(B)係顯示搬送臂伸長時之情況,圖2(C)係顯示搬送臂會進一步地伸長較圖2(B)所示之狀態要稍微長的情況。
圖3係顯示晶圓之旋轉角度與搬送臂之伸長量的關係之圖表。
圖4係用以說明晶圓相對於叉具的位置偏移之計算方法的圖式。
圖5係用以說明基板處理系統之各構成要素的熱膨脹量之計算方法的圖式。
圖6係用以說明搬送臂在接收晶圓時,改變晶圓相對於叉具的旋轉角度之方法的圖式。
圖7係用以說明搬送臂18之變形例的構成之俯視圖。
以下,便參照圖式就本發明實施形態來詳細地說明。
圖1係概略性地顯示本發明實施形態相關之基板處理系統的構成之俯視圖。另位,為了易於說明,圖1中便以透視內部之構成要素一部分的方式來加以描繪。
基板處理系統10係具備有:4個真空處理室11(搬送目的地),係實行為高溫處理之成膜處理或使用電漿之蝕刻處理;真空搬送室12,係與各真空
處理室11連接;2個裝載室13(搬送端),係連接於該真空搬送室12,並可將內部切換為大氣壓及真空的任一者;內部為大氣壓的搬出入室14,係夾置有各裝載室13而連接至真空處理室11之間;以及控制器15(控制部),係控制各構成要素之動作。在各真空處理室11與真空搬送室12之間,以及各裝載室13與真空搬送室12之間係配置有閘閥16,各裝載室13與搬出入室14之間係配置有閘閥17。
真空搬送室12係內建有會在各真空處理室11與各裝載室13之間搬送晶圓W的1節式之搬送臂18(搬送系統)以及配置於各閘閥16前的6個感應器單元19。另外,搬送臂18係具有2個(下述)終端作動器27,2個終端作動器27會重疊配置。各感應器單元19係具有2個穿透式的光學感應器19a、19b,且會特定出藉由搬送臂18來搬送至各真空處理室11及各裝載室13之間的晶圓W邊緣及搬送臂18邊緣的位置。各裝載室13係內建台20,並會藉由將晶圓W載置於該台20來在真空搬送室12及搬出入室14之間進行晶圓W之收授。另外,各裝載室13亦可內建保持晶圓W之暫存板來取代台20。搬出入室14係具有作為安裝有收納複數晶圓W之容器21的晶圓W之搬出入口的3個埠22、讓晶圓W旋轉且調整晶圓W位置之定位器23、以及在各埠22、定位器23以及各裝載室13之間搬送晶圓W之大氣搬送臂24。
圖2係用以說明圖1之搬送臂的構成之俯視圖,圖2(A)係顯示搬送臂收縮時之情況,圖2(B)係顯示搬送臂伸長時之情況,圖2(C)係顯示搬送臂會進一步地伸長較圖2(B)所示之狀態要稍微長的情況。
圖2中,搬送臂18係具有圓柱狀之台座25、臂部26以及重疊配置之2個終端作動器27。另外,圖2之後便省略描繪搬送臂18中的2個終端作動器27之一者。又,臂部26係將一端26a安裝於台座25,而藉由內建之驅動帶來繞該台座25之中心軸而水平地轉動。終端作動器27係由會在途中彎曲之長板狀構件所構成,且一端27a會安裝於臂部26之半圓狀的另端26b。終端作動器27會藉由臂部26所內建之驅動帶來繞臂部26之另端26b的中心軸且水平地轉動。終端作動器27之另端27b係形成有二股狀之叉具28(握持部),該叉具28會握持晶圓W。又,終端作動器27係由未內建有機械機構之塊材所構成,例如由陶瓷等的耐熱材所構成。
搬送臂18中,臂部26及終端作動器27會藉由調整旋轉角度並連動來讓叉具28所握持之晶圓W直線前進(移動於圖中左右方向)而加以搬送。然而,由於叉具28係與終端作動器27一體化,而在晶圓W搬送中終端作動器27會繞臂部26之另端26b的中心軸轉動,故叉具28亦會一邊轉動一邊移動。從而,在搬送臂18伸長時,該搬送臂18便會讓叉具28旋轉。又,在搬送臂18伸長時,叉具28所握持之晶圓W亦會旋轉。具體而言,如圖2(A)及圖2(B)所示,係相對於以虛線表示之晶圓W的直進方向為基準之座標系統(以下,稱為「直進方向座標系統」)而讓以一點鏈線所表示之叉具28中心為基準的座標系統(以下,稱為「叉具座標系統」)旋轉。其結果,在搬送臂18收縮時(圖2(A))與伸長時(圖2(B)),叉具座標系統相對於直進座標系統的旋轉角度便會有所不同。
另外,基板處理系統10係在各真空處理室11反覆成膜處理時,基板處理系統10之各構成要素的溫度會上升,而讓各構成要素會熱膨脹,並使得從裝載室13至真空處理室11的距離,亦即晶圓W之搬送距離改變。又,在晶圓W相對於叉具28有偏移而被握持的情況,雖會在計算出晶圓W相對於叉具28的位置偏移後,以修正所計算出之晶圓W的位置偏移的方式來調整晶圓W的搬送軌道,但在此時晶圓W的搬送距離亦會改變。例如,在為了對應於晶圓W之搬送距離的改變,而從La(參照圖2(B))將搬送臂18之伸長量微量改變為Lb(參照圖2(C))時,伴隨著搬送臂18之伸長量的微量變化,叉具28便會微量旋轉,且叉具28所握持之晶圓W亦會微量旋轉。例如,如圖3所示,在伸長量從La(969.5mm)改變為Lb(970.5mm)時,晶圓W之旋轉角度便會從10.79(deg)改變為10.62(deg)。其結果,便會在晶圓W於真空處理室11中較所欲之旋轉角度要更稍微旋轉的狀態下,被載置於例如真空處理室11之台(未圖示)。亦即,會在真空處理室11中產生晶圓W在旋轉方向的偏移。
圖4係用以說明晶圓相對於叉具的位置偏移之計算方法的圖式。
基板處理系統10中,係於藉由搬送臂18來將晶圓W朝真空處理室11搬入時,感應器單元19會特定出晶圓W邊緣之位置。具體而言,係在晶圓W的搬送中,首先,從晶圓W邊緣橫切光學感應器19a或光學感應器19b的對面時之叉具28中心的位置,以及光學感應器19a或光學感應器19b之位置的相
對位置關係來特定出晶圓W邊緣之位置。另外,叉具28中心的位置係從搬送臂18之編碼值來被計算出。之後,便從所特定之晶圓W邊緣的位置來計算出晶圓W中心之位置,且進一步地基於晶圓W中心之位置及叉具28中心之位置來計算出晶圓W相對於叉具28的位置偏移。
圖5係用以說明基板處理系統之各構成要素的熱膨脹量之計算方法的圖式。
基板處理系統10係在藉由搬送臂18來將晶圓W朝真空處理室11搬入時或是從真空處理室11搬出晶圓W時,會計算出各構成要素之熱膨脹量。具體而言,係在藉由熱膨脹後之搬送臂18來搬送晶圓W中,首先在終端作動器27(叉具28)邊緣橫切光學感應器19b之對面時,會特定出叉具28邊緣的位置(圖5(A))。此時,便會從搬送臂18之編碼值來特定出未熱膨脹時之叉具28邊緣的位置。之後,便從所特定出之2個邊緣的位置之差異來計算出搬送臂18之熱膨脹量。又,亦會在叉具28邊緣橫切光學感應器19a的對面時,特定出叉具28邊緣的位置(圖5(B))。進一步地,亦會從此時之搬送臂18的編碼值來特定出未熱膨脹時之叉具28邊緣的位置。之後,亦會從所特定出之2個邊緣的位置之差異來計算出搬送臂18之熱膨脹量。接著,便從所計算出之搬送臂18的2個熱膨脹量來計算出基板處理系統10之各構成要素的熱膨脹量。例如,計算出所計算出之搬送臂18的2個熱膨脹量之平均值來作為基板處理系統10之各構成要素的熱膨脹量。
本實施形態中,係以解決伴隨著所計算出之晶圓W相對於叉具28的位置偏移之修正的晶圓W之搬送距離的改變,以及伴隨著對應於所計算出之基板處理系統10的各構成要素的熱膨脹量的晶圓W之搬送距離的改變而在真空處理室11中之晶圓W的旋轉方向偏移(以下,稱為「搬送端之旋轉方向偏移」)的方式,來改變搬送臂18在裝載室13中接收晶圓W時之晶圓W相對於叉具28的旋轉角度(以下,稱為「接收時之晶圓旋轉角度」)。又,搬送端之旋轉方向偏移係基於晶圓W之搬送距離的改變,例如從圖3所示之晶圓W的旋轉角度及搬送臂18的伸長量之關係來計算出。
圖6係用以說明搬送臂在接收晶圓時,改變晶圓相對於叉具的旋轉角度之方法的圖式。
首先,在未產生基板處理系統10之各構成要素的熱膨脹時,或未產生晶圓W相對於叉具28的位置偏移時,將搬送臂18在裝載室13中接收晶圓W用之搬送臂18的伸長量作為Lc。此時,便假設晶圓W會在裝載室13中被載置於台20中心,且叉具座標系統與以晶圓W之切凹N及晶圓W中心為基準的座標系統(以下,稱為「晶圓座標系統」)會一致(圖6(A))。
之後,將下一個藉由搬送臂18來搬送之晶圓W藉由大氣搬送臂24來載置於台20。此時,大氣搬送臂24會從台20中心來將晶圓W偏移載置。用以接收從台20中心偏移的晶圓W之搬送臂18的伸長量會成為與Lc相異的Ld。伴隨此搬送臂18之伸長量的變化(從Lc朝Ld的變化),如圖6(B)所示叉具坐標系統(圖中以一點鏈線所示)會相對於晶圓座標系統(圖中以虛線表示)而偏移於旋轉方向。此時旋轉方向的偏移量可基於搬送臂18之伸長量的改變以及圖3所示之晶圓W的旋轉角度與搬送臂18之伸長量的關係來計算出。本實施形態中,係藉由將在搬送臂18接收從台20中心偏移的晶圓W時之叉具座標系統相對於晶圓座標系統在旋轉方向偏移之絕對值成為與搬送端之旋轉方向偏移的絕對值相同,並將叉具座標系統相對於晶圓座標系統的旋轉方向偏移之偏移方向成為與搬送端之旋轉方向偏移的偏移方向相同,便可消除在將晶圓W朝真空處理室11搬送時之搬送端的旋轉方向偏移。
根據本實施形態,係以解除搬送端之旋轉方向偏移的方式來改變在裝載室13中接收時之晶圓旋轉角度。藉此,便可防止在真空處理室11中產生晶圓W之旋轉方向偏移,並可在真空處理室11中以所欲的旋轉角度來將晶圓W正確地載置於台。
又,由於本實施形態中,係改變裝載室13中在搬送臂18接收晶圓W時之搬送臂18的伸長量,而改變接收時之晶圓旋轉角度,故無需在將晶圓W載置於台20時改變晶圓W之旋轉角度。藉此,便可無需在台20或大氣搬送臂24設置晶圓W之旋轉機構,並且可防止基板處理系統10之構成變得複雜。
進一步地,本實施形態中,亦可僅在所計算出之搬送端的旋轉方向偏移超過容許值時,改變接收時之晶圓旋轉角度。藉此,便可抑制頻繁地實行裝載室13中之晶圓W旋轉角度的改變,並可抑制晶圓W搬送的產率下降。
又,本實施形態中,為了解除搬送端之旋轉方向偏移,係讓晶圓旋轉
角度不在定位器23而是在裝載室13中被改變。亦即,在藉由搬送臂18之晶圓W搬送之前改變晶圓旋轉角度。藉此,即便例如在將晶圓W從定位器23搬送至裝載室13的期間併入追加之工序,仍不會使得用以解除搬送端之旋轉方向偏移的晶圓旋轉角度的改變精度下降。其結果,便可增加晶圓W之搬送工序的設計自由度。
以上,雖已使用實施形態,就本發明來加以說明,但本發明並不限定於上述實施形態。
例如,雖使用感應器單元19來計算出晶圓W相對於叉具28的位置偏移或搬送臂18的熱膨脹量,但亦可藉由在真空搬送室12內部設置照相機,而藉由該照相機來特定出搬送中之晶圓W邊緣的位置,或是,特定出叉具28邊緣的位置,來計算出晶圓W相對於叉具28的位置偏移或搬送臂18之熱膨脹量。又,亦可藉由使用非接觸溫度感應器來測定搬送臂18之溫度,而計算出搬送臂18之熱膨脹量。
又,由於叉具28在握持晶圓W時,會因為晶圓W而被覆蓋大部分,故以感應器單元19來特定叉具28邊緣的位置會有些困難。對應於此,如圖7所示,亦可以不被晶圓W覆蓋的方式來對叉具28設置突起部28a,並藉由以感應器單元19來特定出突起部28a邊緣,而計算出搬送臂18之熱膨脹量。在此情況,便可抑制搬送臂18之熱膨脹量的計算誤差的產生。
進一步地,雖上述實施形態中,係改變搬送臂18之伸長量而改變接收時之晶圓旋轉角度,但亦可讓台20或大氣搬送臂24具備晶圓W的旋轉機構,而藉由以旋轉機構讓晶圓W旋轉並載置於台20,來改變接收時之晶圓旋轉角度。
又,雖搬送臂18係1節式之搬送臂,但即便搬送臂18為2節式之無向型或多關節型之搬送臂,只要能在搬送晶圓W時旋轉的話,便可適用於本發明。
又,本發明之目的係藉由將記錄有實現上述實施形態之機能的軟體之程式碼的記憶媒體供給至控制器15等所具備之電腦(未圖示),且讓電腦的CPU讀取記憶媒體所儲存的程式碼而實行來加以達成。
在此情況,藉由從記憶媒體所讀取出之程式碼本身會實現上述實施形
態之機能,程式碼及記憶有該程式碼的記憶媒體便會構成本發明。
又,用以供給程式碼之記憶媒體只要為例如RAM、NV-RAM、軟碟片(註冊商標)、硬碟、磁光碟、CD-ROM、CD-R、CD-RW、DVD(DVD-ROM、DVD-RAM、DVD-RW、DVD+RW)等的光碟、磁帶、非揮發性記憶卡、其他的ROM等的可記憶上述程式碼者即可。或著,該程式碼亦可藉由從網路、商用網路或區域網路等所連接之未圖示的其他電腦或資料庫等下載來供給至電腦。
又,藉由實行電腦所讀取出之程式碼,不僅會實現上述實施形態之機能,亦包含有基於該程式碼之指示而使得CPU上所驅動的OS(操作系統)等會進行實際處理的一部分或全部,而進行該處理來實現上述實施形態之機能的情況。
進一步地,亦包含有在從記憶媒體所讀取出之程式碼被寫入至插入於電腦的機能擴充卡或連接於電腦之機能擴充單元所具備的記憶體後,基於該程式碼的指示,而使得該機能擴充卡或機能擴充單元所具備之CPU等會進行實際處理的一部分或全部,並藉由該處理來實現上述實施形態之機能的情況。
上述程式碼的形態亦可由藉由目的碼、解碼器來實行的程式碼以及供給至OS的指令碼資料等的形態所構成。
18‧‧‧搬送臂
20‧‧‧台
W‧‧‧晶圓
N‧‧‧切凹
Lc、Ld‧‧‧伸長量
Claims (10)
- 一種基板搬送方法,係基板處理系統之基板搬送方法,該基板處理系統係具備有從搬送端來接收基板且朝搬送目的地搬送之搬送系統,該搬送系統係具有握持該基板之握持部,且為了搬送該基板,在該搬送系統伸長時,該搬送系統會讓該握持部旋轉,該基板搬送方法係具有:第1步驟,係計算出該搬送目的地之該基板的旋轉方向偏移;以及第2步驟,係以解決該計算出之基板的旋轉方向偏移之方式,來改變在該搬送系統於該搬送端中接收該基板時,該基板相對於該握持部之旋轉角度。
- 如申請專利範圍第1項之基板搬送方法,其係在該計算出之基板的旋轉方向偏差超過容許值時,實行第2步驟。
- 如申請專利範圍第1項之基板搬送方法,其中該第2步驟係改變在搬送系統於搬送端接收該基板時之該搬送系統的伸長量。
- 如申請專利範圍第2項之基板搬送方法,其中該第2步驟係改變在搬送系統於搬送端接收該基板時之該搬送系統的伸長量。
- 如申請專利範圍第1至4項中任一項之基板搬送方法,其中該第1步驟係在為了對應起因於該基板處理系統之各構成要素的熱膨脹所導致之該基板的搬送距離改變而改變該搬送系統之伸長量時,計算出起因於該搬送系統之伸長量改變所導致之該搬送目的地的該基板之旋轉方向偏移。
- 如申請專利範圍第1至4項中任一項之基板搬送方法,其中該第1步驟係在為了對應於伴隨著該基板相對於該握持部之位置偏移修正的該基板之搬送距離改變,而改變該搬送基板之伸長量時,計算出起因於該搬送系統之伸長量改變所導致之該搬送目的地的該基板之旋轉方向偏移。
- 如申請專利範圍第1至4項中任一項之基板搬送方法,其中該搬送系統係1節式的搬送臂。
- 如申請專利範圍第5項之基板搬送方法,其中該搬送系統係1節式的搬送臂。
- 如申請專利範圍第6項之基板搬送方法,其中該搬送系統係1節式的 搬送臂。
- 一種基板處理系統,係具備有將基板從搬送端接收且朝搬送目的地搬送之搬送系統以及控制部,該搬送系統係具有握持該基板之握持部,為了搬送該基板,而在該搬送系統伸長時,該搬送系統會讓該握持部旋轉之基板處理系統;該控制部會計算出該搬送目的地之該基板的旋轉方向偏移,且進一步地以解決所計算出之該基板的旋轉方向偏移之方式來改變該搬送系統在該搬送端接收該基板時,該基板相對於該握持部之旋轉角度。
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