JP6729697B2 - ワイヤソー装置及びワークの切断方法 - Google Patents

ワイヤソー装置及びワークの切断方法 Download PDF

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Publication number
JP6729697B2
JP6729697B2 JP2018527513A JP2018527513A JP6729697B2 JP 6729697 B2 JP6729697 B2 JP 6729697B2 JP 2018527513 A JP2018527513 A JP 2018527513A JP 2018527513 A JP2018527513 A JP 2018527513A JP 6729697 B2 JP6729697 B2 JP 6729697B2
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JP
Japan
Prior art keywords
work
wire
cutting
saw device
wire saw
Prior art date
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Active
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JP2018527513A
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English (en)
Japanese (ja)
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JPWO2018012313A1 (ja
Inventor
佳宏 宇佐美
佳宏 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
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Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of JPWO2018012313A1 publication Critical patent/JPWO2018012313A1/ja
Application granted granted Critical
Publication of JP6729697B2 publication Critical patent/JP6729697B2/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2018527513A 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法 Active JP6729697B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016138535 2016-07-13
JP2016138535 2016-07-13
PCT/JP2017/024063 WO2018012313A1 (ja) 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法

Publications (2)

Publication Number Publication Date
JPWO2018012313A1 JPWO2018012313A1 (ja) 2019-02-21
JP6729697B2 true JP6729697B2 (ja) 2020-07-22

Family

ID=60952389

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018527513A Active JP6729697B2 (ja) 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法

Country Status (5)

Country Link
JP (1) JP6729697B2 (zh)
KR (1) KR102382752B1 (zh)
CN (1) CN109153104B (zh)
TW (1) TWI737757B (zh)
WO (1) WO2018012313A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022003800T5 (de) 2021-08-03 2024-06-20 Komatsu Ntc Ltd. Vorrichtung und verfahren zur diagnose von drahtsägenanomalien

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727603A (ja) * 1993-07-09 1995-01-31 Hitachi Electron Eng Co Ltd 可動部の異常振動検査装置
JPH1024411A (ja) * 1996-07-12 1998-01-27 Nippei Toyama Corp ワイヤソーの加工制御方法及び装置
JPH11156694A (ja) 1997-12-01 1999-06-15 Hitachi Ltd ワイヤーソー切断方法および装置
JP4049900B2 (ja) * 1998-08-20 2008-02-20 株式会社スーパーシリコン研究所 ワイヤソー切断装置
JP2000190196A (ja) * 1998-12-28 2000-07-11 Nippei Toyama Corp ワイヤソ―のリ―ルボビンの異常回転検知構造
JP4684323B2 (ja) * 2008-09-11 2011-05-18 コマツＮｔｃ株式会社 ワイヤソーおよびワーク加工方法
JP5201086B2 (ja) * 2009-06-10 2013-06-05 信越半導体株式会社 ワークの切断方法
JP2011104688A (ja) * 2009-11-16 2011-06-02 Takatori Corp ワイヤソー
CN201625917U (zh) * 2009-11-26 2010-11-10 上海日进机床有限公司 金刚线开方机的张力调整机构
US8881716B2 (en) * 2010-02-08 2014-11-11 Toyo Advanced Technologies Co., Ltd. Wire saw with tension detecting means and guide roller speed control
EP2535143B1 (en) * 2010-02-08 2018-08-08 Toyo Advanced Technologies Co., Ltd. Method of cutting workpiece with wire saw, and wire saw
TWI488725B (zh) * 2010-02-11 2015-06-21 Toyo Advanced Tech Co Cutting method and wire sawing by wire saw
CN103052468B (zh) * 2010-09-27 2015-07-08 小松Ntc株式会社 用于检测线锯中的断线的方法和设备
JP5494558B2 (ja) * 2011-04-20 2014-05-14 信越半導体株式会社 ワイヤソーの運転再開方法及びワイヤソー
JP5155428B2 (ja) * 2011-07-15 2013-03-06 コマツＮｔｃ株式会社 ワイヤソー
JP5875277B2 (ja) 2011-08-04 2016-03-02 トーヨーエイテック株式会社 ワイヤソー
WO2015188859A1 (en) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Wire saw system
EP2954965A1 (en) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Method and system for sawing an ingot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112022003800T5 (de) 2021-08-03 2024-06-20 Komatsu Ntc Ltd. Vorrichtung und verfahren zur diagnose von drahtsägenanomalien

Also Published As

Publication number Publication date
WO2018012313A1 (ja) 2018-01-18
KR102382752B1 (ko) 2022-04-05
TW201801851A (zh) 2018-01-16
KR20190026653A (ko) 2019-03-13
CN109153104A (zh) 2019-01-04
TWI737757B (zh) 2021-09-01
JPWO2018012313A1 (ja) 2019-02-21
CN109153104B (zh) 2021-03-16

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