WO2018012313A1 - ワイヤソー装置及びワークの切断方法 - Google Patents

ワイヤソー装置及びワークの切断方法 Download PDF

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Publication number
WO2018012313A1
WO2018012313A1 PCT/JP2017/024063 JP2017024063W WO2018012313A1 WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1 JP 2017024063 W JP2017024063 W JP 2017024063W WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1
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WO
WIPO (PCT)
Prior art keywords
wire
workpiece
saw device
cutting
wire saw
Prior art date
Application number
PCT/JP2017/024063
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
佳宏 宇佐美
Original Assignee
信越半導体株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越半導体株式会社 filed Critical 信越半導体株式会社
Priority to JP2018527513A priority Critical patent/JP6729697B2/ja
Priority to CN201780027731.7A priority patent/CN109153104B/zh
Priority to KR1020187033668A priority patent/KR102382752B1/ko
Publication of WO2018012313A1 publication Critical patent/WO2018012313A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a wire saw cutting technique, and more particularly to a wire saw apparatus and a workpiece cutting method that can be applied to a wafer cutting step of slicing a workpiece such as a silicon semiconductor single crystal ingot into a wafer.
  • a plurality of silicon semiconductor wafers are obtained by thinly cutting a silicon semiconductor single crystal ingot pulled up by a single crystal pulling apparatus in the direction perpendicular to the axis with an inner peripheral slicer.
  • a cutting method using a wire saw has attracted attention in recent years.
  • a workpiece is pressed against a wire row spirally wound between a plurality of main rollers (wire guides), and the wire is moved while supplying slurry to a contact portion between the workpiece and the wire.
  • a method of cutting a workpiece into a wafer shape for example, Patent Document 1).
  • a large number of wafers for example, several hundred wafers
  • a vibration meter is attached to the holding portion of the grooved roller and used for detecting disconnection, and as in Patent Document 3, vibration is applied to the bearing housing of the reel bobbin or the bracket of the bearing housing.
  • the present invention has been made in view of the above-mentioned problems, and before cutting a workpiece, it is possible to determine a state in which the tension of the wire is disturbed or abnormal vibration of the wire saw device occurs, and the workpiece is cut out from the workpiece. It is an object of the present invention to provide a wire saw apparatus and a workpiece cutting method that can prevent quality deterioration of a wafer.
  • a wire supply reel extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, and the wire
  • a wire saw device that performs cutting by pressing, Provided is a wire saw device comprising: a vibration sensor attached to the work holding unit; and a load cell for detecting a tension of the wire.
  • a method for cutting a workpiece using the wire saw device of the present invention Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values; There is provided a workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
  • Such a workpiece cutting method uses the above-described wire saw device of the present invention, and therefore can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
  • Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, It is preferable that the work is cut after maintenance of the wire saw device is performed until the value falls within the control value limit.
  • the state of the wire saw device can be grasped before the workpiece is cut, and maintenance is performed in the case of an abnormal condition outside the control value limit. The occurrence of defects due to quality deterioration can be reduced.
  • a method of cutting a workpiece using the wire saw device of the present invention wherein the wire is moved forward and backward at least in a state where the workpiece is not in contact with the wire before the workpiece is cut.
  • the standard deviation of the tension of the wire detected by the load cell is 0.45 N or less and the vibration detected by the vibration sensor is 1.0 mm / sec or less while repeatedly running more than once.
  • the workpiece cutting method is characterized in that the workpiece is cut.
  • the wire saw device of the present invention Before the workpiece is cut, at least one of the tension of the wire detected by the load cell and the vibration detected by the vibration sensor is measured, and the normal value of the wire saw device is measured using this measurement value. Alternatively, an abnormality can be determined. Therefore, if it is determined that the wire saw device is normal, the quality of the wafer cut out from the workpiece can be prevented from being deteriorated by cutting the workpiece.
  • the warp quality is deteriorated when the workpiece is cut in a state where the wire tension cannot be kept constant and is greatly violated or abnormal vibration occurs. It can be seen. Further, when the abnormality is noticed during the cutting of the workpiece and the apparatus is stopped for maintenance, the Warp quality deteriorates due to the temperature change. In either case, since a large number of wafers are cut out at a time, there is a problem that it is likely to lead to a large number of defects.
  • the present inventor has intensively studied to solve such problems.
  • the wire saw device includes a vibration sensor attached to a part that holds the workpiece and a load cell that detects wire tension
  • the wire tension and vibration sensor detected by the load cell before cutting the workpiece It is possible to measure at least one of the detected vibrations and use this measurement value to determine whether the wire saw device is normal or abnormal.
  • the workpiece is cut. For example, it has been conceived that quality deterioration of a wafer cut out from a workpiece can be prevented. And the best form for implementing these was scrutinized and the present invention was completed.
  • a wire saw device 13 of the present invention includes a wire supply reel 1 that extends a wire 8 and a wire array that is spirally wound around a plurality of wire guides 6. 9, a wire take-up reel 7 for winding the wire 8, and a work holding part 10 for holding the work W to be cut, and the work holding part on the wire array 9 that travels at least once forward and backward.
  • the workpiece W held by 10 is pressed and cut.
  • the wire saw device 13 includes a vibration sensor (vibrometer) 11 attached to the work holding unit 10 and a load cell 5 that detects the tension of the wire 8.
  • the wire 8 passes from the wire supply reel 1 through the long roller 2, the traverser 3, and the plurality of pulleys P and is wound around the wire guide 6 in parallel at a predetermined pitch to form a wire row 9.
  • the work W is cut by lowering the work W held by the work holding unit 10 to the wire row 9.
  • the wire 8 exiting the wire guide 6 passes through the plurality of pulleys P and the traverser 3 and is taken up by the wire take-up reel 7.
  • a load cell 5 and a tension mechanism 4 are provided between the wire supply reel 1 and the wire guide 6 and between the wire guide 6 and the wire take-up reel 7, respectively, and the tension detected by the load cell 5. Based on the above, the tension of the wire 8 is controlled by the tension mechanism 4.
  • a vibration sensor 11 is attached to the work holding unit 10.
  • the vibration sensor 11 can be configured to directly attach to the plate to which the workpiece W in the workpiece holding unit 10 is bonded, and monitor the vibration.
  • the load cell 5 and the vibration sensor 11 are connected to the monitoring PC 12 and can constantly monitor the detection values output from the load cell 5 and the vibration sensor 11.
  • the wire 8 is detected by the load cell 5 while the wire 8 is repeatedly moved at least once forward and backward while the workpiece W is not in contact with the wire 8.
  • a determination step of measuring at least one of the tension of 8 and the vibration detected by the vibration sensor 11 and determining whether the wire saw device 13 is normal or abnormal is performed using the measured value. Then, in this determination step, when it is determined that the wire saw device 13 is normal, a cutting step for cutting the workpiece W is performed.
  • the wire 8 is moved forward and backward at least once in a state where the workpiece W does not contact the wire row 9.
  • This operation is referred to as warm-up operation (SP1).
  • SP2 at least one of tension and vibration is measured
  • SP3 a determination step for determining whether the wire saw device 13 is normal or abnormal from the measured value (measured value) is performed. If normal, warm-up is continued (SP4), and then the workpiece W is cut as it is (SP5). On the other hand, if abnormal, the wire saw device 13 is stopped (SP6), and maintenance such as replacement of the pulley P is performed (SP7). Thereafter, the warm-up operation is performed again (SP1), and this flow can be continued until normal.
  • control chart management (SP8) is performed using the measured values, and when the measured values are outside the control value limit, it is determined that the wire saw device 13 is abnormal (SP9).
  • the wire saw device 13 is stopped before the workpiece W is cut, and the workpiece W can be cut after maintenance of the wire saw device 13 is performed until the workpiece W is within the control value limit.
  • the state of the wire saw device 13 can be grasped before the work W is cut, and maintenance is performed in the case of an abnormal state outside the control value limit, so that the wafer cut out from the work W can be obtained.
  • the occurrence of defects due to quality deterioration or quality deterioration can be reduced.
  • tension variation ⁇ that can be calculated using a measured value of the tension of the wire 8 detected by the load cell 5 during one forward and backward cycle during warm-up. If the vibration amplitude that can be calculated by using the vibration measurement value detected by the vibration sensor 11 is managed in the control chart (SP8), the control limit line (within the control value limit) is normal, or is out ( There is a method (SP9) that judges that the value is outside the control value limit).
  • Cutting can be done. That is, a case where this condition is satisfied is determined to be normal, and a case where this condition is not satisfied is determined to be abnormal.
  • Such a workpiece cutting method using the wire saw device of the present invention can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
  • Example 1 Using the wire saw device of the present invention as shown in FIG. 1, the workpiece was cut according to the workpiece cutting method of the present invention. In addition, an ingot having a diameter of 300 mm manufactured by the CZ method (Czochralski method) was used as the workpiece W.
  • CZ method Czochralski method
  • the load cell 5 detects the workpiece 8 while repeatedly running (warming up) the wire 8 at least once forward and backward, with the workpiece W not in contact with the wire 8 (wire row 9). The tension of the wire 8 to be measured was measured.
  • FIG. 3 is a management chart of the tension variation ⁇ during one forward and backward cycle during warm-up. Each point in FIG. 3 indicates a tension variation ⁇ during one cycle of forward and backward movement during warm-up.
  • the tension variation ⁇ is within the control limit line (within the control value limit) of UCL (Upper Control Limit: upper control limit line) and LCL (Lower Control Limit: lower control limit line)
  • UCL Upper Control Limit: upper control limit line
  • LCL Lower Control Limit
  • Example 1 As a result, as shown in FIG. 4B, in Example 1, the Warp quality averaged 6.8 ⁇ m.
  • Comparative Example 1 As Comparative Example 1, when the tension variation ⁇ as shown by the down arrow (a) in FIG. Went. The tension variation ⁇ indicated by the down arrow (a) in FIG. 3 was 0.46 N that deviated from the control limit line. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
  • Example 2 Using the measured value obtained by measuring the vibration detected by the vibration sensor, the average value of the vibration amplitude during one forward and backward cycle during warm-up was calculated. Then, the workpiece was cut in the same manner as in Example 1 except that control chart management was performed using the average value of the vibration amplitude.
  • the wire 8 is repeatedly moved forward and backward at least once (warm-up operation) while the vibration detected by the vibration sensor 11 is detected. Measurements were made.
  • FIG. 5 is a management chart of the average value of the vibration amplitude during one forward and backward cycle during warm-up. Each point in FIG. 5 indicates the average value of the vibration amplitude during one forward and backward cycle during warm-up.
  • the wire saw device was determined to be normal, and when the average value was outside (the control value limit), the wire saw device was determined to be abnormal.
  • CL in FIG. 5 indicates a center line.
  • Example 2 As a result, as shown in FIG. 6B, in Example 2, the Warp quality averaged 7.1 ⁇ m.
  • Comparative Example 2 As Comparative Example 2, when the average value of the vibration amplitude as shown by the down arrow (a) in FIG. 5 is out of the control limit line and is determined to be abnormal, maintenance is not performed and the workpiece W is left as it is. Was cut.
  • the vibration at the position indicated by the down arrow (a) in FIG. 5 was 1.2 mm / sec. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
PCT/JP2017/024063 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法 WO2018012313A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2018527513A JP6729697B2 (ja) 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法
CN201780027731.7A CN109153104B (zh) 2016-07-13 2017-06-30 线锯装置及工件的切断方法
KR1020187033668A KR102382752B1 (ko) 2016-07-13 2017-06-30 와이어소 장치 및 워크의 절단방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016138535 2016-07-13
JP2016-138535 2016-07-13

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WO2018012313A1 true WO2018012313A1 (ja) 2018-01-18

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JP (1) JP6729697B2 (zh)
KR (1) KR102382752B1 (zh)
CN (1) CN109153104B (zh)
TW (1) TWI737757B (zh)
WO (1) WO2018012313A1 (zh)

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Publication number Priority date Publication date Assignee Title
JP2023022450A (ja) 2021-08-03 2023-02-15 コマツＮｔｃ株式会社 ワイヤソーの異常診断装置および方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727603A (ja) * 1993-07-09 1995-01-31 Hitachi Electron Eng Co Ltd 可動部の異常振動検査装置
JPH1024411A (ja) * 1996-07-12 1998-01-27 Nippei Toyama Corp ワイヤソーの加工制御方法及び装置
JP2000061809A (ja) * 1998-08-20 2000-02-29 Super Silicon Kenkyusho:Kk ワイヤソー切断装置
JP2000190196A (ja) * 1998-12-28 2000-07-11 Nippei Toyama Corp ワイヤソ―のリ―ルボビンの異常回転検知構造
JP2011104688A (ja) * 2009-11-16 2011-06-02 Takatori Corp ワイヤソー
WO2015188859A1 (en) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Wire saw system

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JPH11156694A (ja) 1997-12-01 1999-06-15 Hitachi Ltd ワイヤーソー切断方法および装置
JP4684323B2 (ja) * 2008-09-11 2011-05-18 コマツＮｔｃ株式会社 ワイヤソーおよびワーク加工方法
JP5201086B2 (ja) * 2009-06-10 2013-06-05 信越半導体株式会社 ワークの切断方法
CN201625917U (zh) * 2009-11-26 2010-11-10 上海日进机床有限公司 金刚线开方机的张力调整机构
US8991381B2 (en) * 2010-02-08 2015-03-31 Toyo Advanced Technologies Co., Ltd. Method of cutting workpiece with wire saw, and wire saw
MY159039A (en) * 2010-02-08 2016-12-15 Toyo Advanced Tech Co Ltd Wire saw
TWI488725B (zh) * 2010-02-11 2015-06-21 Toyo Advanced Tech Co Cutting method and wire sawing by wire saw
JP5072135B2 (ja) * 2010-09-27 2012-11-14 コマツＮｔｃ株式会社 ワイヤソーのワイヤ断線検知方法および装置
JP5494558B2 (ja) * 2011-04-20 2014-05-14 信越半導体株式会社 ワイヤソーの運転再開方法及びワイヤソー
JP5155428B2 (ja) * 2011-07-15 2013-03-06 コマツＮｔｃ株式会社 ワイヤソー
JP5875277B2 (ja) 2011-08-04 2016-03-02 トーヨーエイテック株式会社 ワイヤソー
EP2954965A1 (en) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Method and system for sawing an ingot

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727603A (ja) * 1993-07-09 1995-01-31 Hitachi Electron Eng Co Ltd 可動部の異常振動検査装置
JPH1024411A (ja) * 1996-07-12 1998-01-27 Nippei Toyama Corp ワイヤソーの加工制御方法及び装置
JP2000061809A (ja) * 1998-08-20 2000-02-29 Super Silicon Kenkyusho:Kk ワイヤソー切断装置
JP2000190196A (ja) * 1998-12-28 2000-07-11 Nippei Toyama Corp ワイヤソ―のリ―ルボビンの異常回転検知構造
JP2011104688A (ja) * 2009-11-16 2011-06-02 Takatori Corp ワイヤソー
WO2015188859A1 (en) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Wire saw system

Also Published As

Publication number Publication date
TW201801851A (zh) 2018-01-16
KR102382752B1 (ko) 2022-04-05
KR20190026653A (ko) 2019-03-13
CN109153104B (zh) 2021-03-16
JPWO2018012313A1 (ja) 2019-02-21
TWI737757B (zh) 2021-09-01
JP6729697B2 (ja) 2020-07-22
CN109153104A (zh) 2019-01-04

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