WO2018012313A1 - Wire saw device and method for cutting workpiece - Google Patents

Wire saw device and method for cutting workpiece Download PDF

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Publication number
WO2018012313A1
WO2018012313A1 PCT/JP2017/024063 JP2017024063W WO2018012313A1 WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1 JP 2017024063 W JP2017024063 W JP 2017024063W WO 2018012313 A1 WO2018012313 A1 WO 2018012313A1
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Prior art keywords
wire
workpiece
saw device
cutting
wire saw
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PCT/JP2017/024063
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French (fr)
Japanese (ja)
Inventor
佳宏 宇佐美
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信越半導体株式会社
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Application filed by 信越半導体株式会社 filed Critical 信越半導体株式会社
Priority to JP2018527513A priority Critical patent/JP6729697B2/en
Priority to KR1020187033668A priority patent/KR102382752B1/en
Priority to CN201780027731.7A priority patent/CN109153104B/en
Publication of WO2018012313A1 publication Critical patent/WO2018012313A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a wire saw cutting technique, and more particularly to a wire saw apparatus and a workpiece cutting method that can be applied to a wafer cutting step of slicing a workpiece such as a silicon semiconductor single crystal ingot into a wafer.
  • a plurality of silicon semiconductor wafers are obtained by thinly cutting a silicon semiconductor single crystal ingot pulled up by a single crystal pulling apparatus in the direction perpendicular to the axis with an inner peripheral slicer.
  • a cutting method using a wire saw has attracted attention in recent years.
  • a workpiece is pressed against a wire row spirally wound between a plurality of main rollers (wire guides), and the wire is moved while supplying slurry to a contact portion between the workpiece and the wire.
  • a method of cutting a workpiece into a wafer shape for example, Patent Document 1).
  • a large number of wafers for example, several hundred wafers
  • a vibration meter is attached to the holding portion of the grooved roller and used for detecting disconnection, and as in Patent Document 3, vibration is applied to the bearing housing of the reel bobbin or the bracket of the bearing housing.
  • the present invention has been made in view of the above-mentioned problems, and before cutting a workpiece, it is possible to determine a state in which the tension of the wire is disturbed or abnormal vibration of the wire saw device occurs, and the workpiece is cut out from the workpiece. It is an object of the present invention to provide a wire saw apparatus and a workpiece cutting method that can prevent quality deterioration of a wafer.
  • a wire supply reel extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, and the wire
  • a wire saw device that performs cutting by pressing, Provided is a wire saw device comprising: a vibration sensor attached to the work holding unit; and a load cell for detecting a tension of the wire.
  • a method for cutting a workpiece using the wire saw device of the present invention Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values; There is provided a workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
  • Such a workpiece cutting method uses the above-described wire saw device of the present invention, and therefore can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
  • Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, It is preferable that the work is cut after maintenance of the wire saw device is performed until the value falls within the control value limit.
  • the state of the wire saw device can be grasped before the workpiece is cut, and maintenance is performed in the case of an abnormal condition outside the control value limit. The occurrence of defects due to quality deterioration can be reduced.
  • a method of cutting a workpiece using the wire saw device of the present invention wherein the wire is moved forward and backward at least in a state where the workpiece is not in contact with the wire before the workpiece is cut.
  • the standard deviation of the tension of the wire detected by the load cell is 0.45 N or less and the vibration detected by the vibration sensor is 1.0 mm / sec or less while repeatedly running more than once.
  • the workpiece cutting method is characterized in that the workpiece is cut.
  • the wire saw device of the present invention Before the workpiece is cut, at least one of the tension of the wire detected by the load cell and the vibration detected by the vibration sensor is measured, and the normal value of the wire saw device is measured using this measurement value. Alternatively, an abnormality can be determined. Therefore, if it is determined that the wire saw device is normal, the quality of the wafer cut out from the workpiece can be prevented from being deteriorated by cutting the workpiece.
  • the warp quality is deteriorated when the workpiece is cut in a state where the wire tension cannot be kept constant and is greatly violated or abnormal vibration occurs. It can be seen. Further, when the abnormality is noticed during the cutting of the workpiece and the apparatus is stopped for maintenance, the Warp quality deteriorates due to the temperature change. In either case, since a large number of wafers are cut out at a time, there is a problem that it is likely to lead to a large number of defects.
  • the present inventor has intensively studied to solve such problems.
  • the wire saw device includes a vibration sensor attached to a part that holds the workpiece and a load cell that detects wire tension
  • the wire tension and vibration sensor detected by the load cell before cutting the workpiece It is possible to measure at least one of the detected vibrations and use this measurement value to determine whether the wire saw device is normal or abnormal.
  • the workpiece is cut. For example, it has been conceived that quality deterioration of a wafer cut out from a workpiece can be prevented. And the best form for implementing these was scrutinized and the present invention was completed.
  • a wire saw device 13 of the present invention includes a wire supply reel 1 that extends a wire 8 and a wire array that is spirally wound around a plurality of wire guides 6. 9, a wire take-up reel 7 for winding the wire 8, and a work holding part 10 for holding the work W to be cut, and the work holding part on the wire array 9 that travels at least once forward and backward.
  • the workpiece W held by 10 is pressed and cut.
  • the wire saw device 13 includes a vibration sensor (vibrometer) 11 attached to the work holding unit 10 and a load cell 5 that detects the tension of the wire 8.
  • the wire 8 passes from the wire supply reel 1 through the long roller 2, the traverser 3, and the plurality of pulleys P and is wound around the wire guide 6 in parallel at a predetermined pitch to form a wire row 9.
  • the work W is cut by lowering the work W held by the work holding unit 10 to the wire row 9.
  • the wire 8 exiting the wire guide 6 passes through the plurality of pulleys P and the traverser 3 and is taken up by the wire take-up reel 7.
  • a load cell 5 and a tension mechanism 4 are provided between the wire supply reel 1 and the wire guide 6 and between the wire guide 6 and the wire take-up reel 7, respectively, and the tension detected by the load cell 5. Based on the above, the tension of the wire 8 is controlled by the tension mechanism 4.
  • a vibration sensor 11 is attached to the work holding unit 10.
  • the vibration sensor 11 can be configured to directly attach to the plate to which the workpiece W in the workpiece holding unit 10 is bonded, and monitor the vibration.
  • the load cell 5 and the vibration sensor 11 are connected to the monitoring PC 12 and can constantly monitor the detection values output from the load cell 5 and the vibration sensor 11.
  • the wire 8 is detected by the load cell 5 while the wire 8 is repeatedly moved at least once forward and backward while the workpiece W is not in contact with the wire 8.
  • a determination step of measuring at least one of the tension of 8 and the vibration detected by the vibration sensor 11 and determining whether the wire saw device 13 is normal or abnormal is performed using the measured value. Then, in this determination step, when it is determined that the wire saw device 13 is normal, a cutting step for cutting the workpiece W is performed.
  • the wire 8 is moved forward and backward at least once in a state where the workpiece W does not contact the wire row 9.
  • This operation is referred to as warm-up operation (SP1).
  • SP2 at least one of tension and vibration is measured
  • SP3 a determination step for determining whether the wire saw device 13 is normal or abnormal from the measured value (measured value) is performed. If normal, warm-up is continued (SP4), and then the workpiece W is cut as it is (SP5). On the other hand, if abnormal, the wire saw device 13 is stopped (SP6), and maintenance such as replacement of the pulley P is performed (SP7). Thereafter, the warm-up operation is performed again (SP1), and this flow can be continued until normal.
  • control chart management (SP8) is performed using the measured values, and when the measured values are outside the control value limit, it is determined that the wire saw device 13 is abnormal (SP9).
  • the wire saw device 13 is stopped before the workpiece W is cut, and the workpiece W can be cut after maintenance of the wire saw device 13 is performed until the workpiece W is within the control value limit.
  • the state of the wire saw device 13 can be grasped before the work W is cut, and maintenance is performed in the case of an abnormal state outside the control value limit, so that the wafer cut out from the work W can be obtained.
  • the occurrence of defects due to quality deterioration or quality deterioration can be reduced.
  • tension variation ⁇ that can be calculated using a measured value of the tension of the wire 8 detected by the load cell 5 during one forward and backward cycle during warm-up. If the vibration amplitude that can be calculated by using the vibration measurement value detected by the vibration sensor 11 is managed in the control chart (SP8), the control limit line (within the control value limit) is normal, or is out ( There is a method (SP9) that judges that the value is outside the control value limit).
  • Cutting can be done. That is, a case where this condition is satisfied is determined to be normal, and a case where this condition is not satisfied is determined to be abnormal.
  • Such a workpiece cutting method using the wire saw device of the present invention can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece
  • Example 1 Using the wire saw device of the present invention as shown in FIG. 1, the workpiece was cut according to the workpiece cutting method of the present invention. In addition, an ingot having a diameter of 300 mm manufactured by the CZ method (Czochralski method) was used as the workpiece W.
  • CZ method Czochralski method
  • the load cell 5 detects the workpiece 8 while repeatedly running (warming up) the wire 8 at least once forward and backward, with the workpiece W not in contact with the wire 8 (wire row 9). The tension of the wire 8 to be measured was measured.
  • FIG. 3 is a management chart of the tension variation ⁇ during one forward and backward cycle during warm-up. Each point in FIG. 3 indicates a tension variation ⁇ during one cycle of forward and backward movement during warm-up.
  • the tension variation ⁇ is within the control limit line (within the control value limit) of UCL (Upper Control Limit: upper control limit line) and LCL (Lower Control Limit: lower control limit line)
  • UCL Upper Control Limit: upper control limit line
  • LCL Lower Control Limit
  • Example 1 As a result, as shown in FIG. 4B, in Example 1, the Warp quality averaged 6.8 ⁇ m.
  • Comparative Example 1 As Comparative Example 1, when the tension variation ⁇ as shown by the down arrow (a) in FIG. Went. The tension variation ⁇ indicated by the down arrow (a) in FIG. 3 was 0.46 N that deviated from the control limit line. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
  • Example 2 Using the measured value obtained by measuring the vibration detected by the vibration sensor, the average value of the vibration amplitude during one forward and backward cycle during warm-up was calculated. Then, the workpiece was cut in the same manner as in Example 1 except that control chart management was performed using the average value of the vibration amplitude.
  • the wire 8 is repeatedly moved forward and backward at least once (warm-up operation) while the vibration detected by the vibration sensor 11 is detected. Measurements were made.
  • FIG. 5 is a management chart of the average value of the vibration amplitude during one forward and backward cycle during warm-up. Each point in FIG. 5 indicates the average value of the vibration amplitude during one forward and backward cycle during warm-up.
  • the wire saw device was determined to be normal, and when the average value was outside (the control value limit), the wire saw device was determined to be abnormal.
  • CL in FIG. 5 indicates a center line.
  • Example 2 As a result, as shown in FIG. 6B, in Example 2, the Warp quality averaged 7.1 ⁇ m.
  • Comparative Example 2 As Comparative Example 2, when the average value of the vibration amplitude as shown by the down arrow (a) in FIG. 5 is out of the control limit line and is determined to be abnormal, maintenance is not performed and the workpiece W is left as it is. Was cut.
  • the vibration at the position indicated by the down arrow (a) in FIG. 5 was 1.2 mm / sec. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
  • the present invention is not limited to the above embodiment.
  • the above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
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  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
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  • Mechanical Treatment Of Semiconductor (AREA)
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Abstract

The present invention is a wire saw device that includes: a wire feed reel that lets out wire; wire rows formed of the wire spirally wound around a plurality of wire guides; a wire winding reel on which the wire is wound; and a workpiece holding part that holds a workpiece to be cut, wherein the wire saw device performs cutting by pressing the workpiece held by the workpiece holding part against the wire rows travelling while repeating advancing and retracting at least once. The wire saw device is characterized by having a vibration sensor that is attached to the workpiece holding part and a load cell that detects the tension of the wire. This provides a wire saw device and a method for cutting a workpiece with which it is possible to determine, before cutting the workpiece, a condition in which violent movement of the wire due to tension is occurring or in which an abnormal vibration of the wire saw device is occurring and with which it is possible to prevent degradation of the quality of wafers cut out from the workpiece.

Description

ワイヤソー装置及びワークの切断方法Wire saw device and workpiece cutting method
　本発明は、ワイヤソー切断技術に関し、ワーク、例えばシリコン半導体単結晶インゴットをウェーハ状にする（スライスする）ウェーハ切断工程等に適用可能なワイヤソー装置及びワークの切断方法に関する。 The present invention relates to a wire saw cutting technique, and more particularly to a wire saw apparatus and a workpiece cutting method that can be applied to a wafer cutting step of slicing a workpiece such as a silicon semiconductor single crystal ingot into a wafer.
　例えば、半導体製造分野においては、単結晶引上装置によって引き上げられたシリコン半導体単結晶インゴットを内周刃スライサーによって軸直角方向に薄く切断することによって複数のシリコン半導体ウェーハを得ている。 For example, in the semiconductor manufacturing field, a plurality of silicon semiconductor wafers are obtained by thinly cutting a silicon semiconductor single crystal ingot pulled up by a single crystal pulling apparatus in the direction perpendicular to the axis with an inner peripheral slicer.
　ところが、近年の半導体ウェーハの大直径化の傾向は、従来からの内周刃スライサーによるインゴットの切断を困難にしている。又、内周刃スライサーによる切断方法は、ウェーハを１枚ずつ切り出すために非効率で生産性が悪いという問題がある。 However, the recent trend of increasing the diameter of semiconductor wafers makes it difficult to cut an ingot with a conventional inner blade slicer. Further, the cutting method using the inner peripheral edge slicer has a problem that it is inefficient and productivity is low because the wafers are cut out one by one.
　そこで、ワイヤソー（特に、マルチワイヤソー）による切断方法が近年注目されている。この切断方法は、複数本のメインローラ（ワイヤガイド）間に螺旋状に巻回されたワイヤ列にワークを押圧し、該ワークとワイヤとの接触部にスラリーを供給しながらワイヤを移動させることによってワークをウェーハ状に切断する方法である（例えば、特許文献１）。このような切断方法によって、一度に多数枚（例えば数１００枚）のウェーハを切り出すことができる。 Therefore, a cutting method using a wire saw (particularly, a multi-wire saw) has attracted attention in recent years. In this cutting method, a workpiece is pressed against a wire row spirally wound between a plurality of main rollers (wire guides), and the wire is moved while supplying slurry to a contact portion between the workpiece and the wire. Is a method of cutting a workpiece into a wafer shape (for example, Patent Document 1). By such a cutting method, a large number of wafers (for example, several hundred wafers) can be cut out at a time.
　また、特許文献２のように、溝付きローラーの保持部に振動計を取り付け、断線検知に用いているものや、特許文献３のように、リールボビンの軸受ハウジング又は該軸受ハウジングのブラケットに振動計を取り付け、リールボビンの異常回転検知に振動センサが用いられているものがある。 Further, as in Patent Document 2, a vibration meter is attached to the holding portion of the grooved roller and used for detecting disconnection, and as in Patent Document 3, vibration is applied to the bearing housing of the reel bobbin or the bracket of the bearing housing. Some have a meter and a vibration sensor is used to detect abnormal rotation of the reel bobbin.
特開平１１－１５６６９４号公報Japanese Patent Laid-Open No. 11-156694 特開２０１３－０３５０８０号公報JP 2013-035080 A 特開２０００－１９０１９６号公報JP 2000-190196 A
　しかしながら、上記のようなワイヤソーを用いた切断方法において、ワイヤ張力が一定に保てず、大きく暴れている状態や、異常な振動が起きている状態でワークを切断した場合、Ｗａｒｐ品質に悪化が見られる。また、ワークの切断途中に前記異常に気付き、メンテナンスの為に装置を停止すると、今度は温度変化によりＷａｒｐ品質が悪化する。どちらにおいても一度に多数枚のウェーハを切り出すため、大量不良に繋がる可能性が高いという問題があった。 However, in the cutting method using the wire saw as described above, when the workpiece is cut in a state where the wire tension cannot be kept constant and is greatly violated or abnormal vibration occurs, the Warp quality is deteriorated. It can be seen. Further, when the abnormality is noticed during the cutting of the workpiece and the apparatus is stopped for maintenance, the Warp quality deteriorates due to the temperature change. In either case, since a large number of wafers are cut out at a time, there is a problem that it is likely to lead to a large number of defects.
　本発明は前述のような問題に鑑みてなされたもので、ワークの切断前に、ワイヤの張力暴れや、ワイヤソー装置の異常な振動が起きている状態を判断することが可能で、ワークから切り出されたウェーハの品質悪化を防ぐことができるワイヤソー装置及びワークの切断方法を提供することを目的とする。 The present invention has been made in view of the above-mentioned problems, and before cutting a workpiece, it is possible to determine a state in which the tension of the wire is disturbed or abnormal vibration of the wire saw device occurs, and the workpiece is cut out from the workpiece. It is an object of the present invention to provide a wire saw apparatus and a workpiece cutting method that can prevent quality deterioration of a wafer.
　上記目的を達成するために、本発明によれば、ワイヤを延出するワイヤ供給リールと、複数のワイヤガイドの周囲に螺旋状に巻回された前記ワイヤによって形成されるワイヤ列と、前記ワイヤを巻き取るワイヤ巻き取りリールと、切断対象のワークを保持するワーク保持部とを有し、少なくとも前進後退を１回以上繰り返して走行する前記ワイヤ列に前記ワーク保持部に保持された前記ワークを押しつけて切断加工を行うワイヤソー装置において、
　前記ワーク保持部に取り付けられた振動センサと、前記ワイヤの張力を検出するロードセルとを備えることを特徴とするワイヤソー装置を提供する。 In order to achieve the above object, according to the present invention, a wire supply reel extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, and the wire A wire take-up reel and a work holding part that holds a work to be cut, and the work held by the work holding part in the wire row that travels at least once forward and backward. In a wire saw device that performs cutting by pressing,
Provided is a wire saw device comprising: a vibration sensor attached to the work holding unit; and a load cell for detecting a tension of the wire.
　このようなものであれば、ワークの切断前に、ロードセルによって検出されるワイヤの張力、及び振動センサによって検出される振動の少なくとも一方の測定を行い、この測定値を用いてワイヤソー装置の正常又は異常の判断を行うことができる。従って、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行えば、ワークから切り出されるウェーハの品質悪化を防ぐことができる。 In such a case, before the workpiece is cut, at least one of the tension of the wire detected by the load cell and the vibration detected by the vibration sensor is measured, and the normal value of the wire saw device or Abnormality can be judged. Therefore, if it is determined that the wire saw device is normal, the quality of the wafer cut out from the workpiece can be prevented from being deteriorated by cutting the workpiece.
　また本発明によれば、上記本発明のワイヤソー装置を用いてワークを切断する方法であって、
　前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退１回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力、及び前記振動センサによって検出される振動の少なくとも一方の測定を行い、該測定された測定値を用いて前記ワイヤソー装置の正常又は異常の判断を行う判断工程と、
　前記ワイヤソー装置が正常であると判断された場合に、前記ワークの切断を行う切断工程を有することを特徴とするワークの切断方法を提供する。 According to the present invention, there is provided a method for cutting a workpiece using the wire saw device of the present invention,
Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values;
There is provided a workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
　このようなワークの切断方法は、上記の本発明のワイヤソー装置を用いるので、ワークの切断前に、ワイヤソー装置の正常又は異常の判断を行うことができる。そして、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行うので、ワークから切り出されるウェーハの品質悪化を防ぐことができる。 Such a workpiece cutting method uses the above-described wire saw device of the present invention, and therefore can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece | work is cut | disconnected, the quality deterioration of the wafer cut out from a workpiece | work can be prevented.
　このとき、前記判断工程において、
　前記測定値を用いて管理図管理を行い、前記測定値が管理値限界外にあった場合に前記ワイヤソー装置が異常であると判断して、前記ワークの切断前に前記ワイヤソー装置を停止し、前記管理値限界内に入るまで、前記ワイヤソー装置のメンテナンスを行ってから、前記ワークを切断することが好ましい。 At this time, in the determination step,
Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, It is preferable that the work is cut after maintenance of the wire saw device is performed until the value falls within the control value limit.
　このようにすれば、管理図管理することで、ワークの切断前にワイヤソー装置の状態を把握でき、管理値限界外の異常状態の場合にメンテナンスすることで、ワークから切り出されるウェーハの品質悪化や品質悪化による不良発生を低減することができる。 In this way, by managing the control chart, the state of the wire saw device can be grasped before the workpiece is cut, and maintenance is performed in the case of an abnormal condition outside the control value limit. The occurrence of defects due to quality deterioration can be reduced.
　また本発明によれば、上記本発明のワイヤソー装置を用いてワークを切断する方法であって、前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退１回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力の標準偏差が０．４５Ｎ以下、且つ、前記振動センサによって検出される振動が１．０ｍｍ／ｓｅｃ以下であることを確認してから、前記ワークの切断を行うことを特徴とするワークの切断方法を提供する。 According to the present invention, there is also provided a method of cutting a workpiece using the wire saw device of the present invention, wherein the wire is moved forward and backward at least in a state where the workpiece is not in contact with the wire before the workpiece is cut. Check that the standard deviation of the tension of the wire detected by the load cell is 0.45 N or less and the vibration detected by the vibration sensor is 1.0 mm / sec or less while repeatedly running more than once. The workpiece cutting method is characterized in that the workpiece is cut.
　このように、ワイヤの張力の標準偏差が０．４５Ｎ以下、且つ、振動が１．０ｍｍ／ｓｅｃ以下の場合を正常と判断し、該正常とされた場合のみにワークの切断を行うことで、ワークから切り出されるウェーハの品質悪化をより確実に防ぐことができる。 Thus, when the standard deviation of the tension of the wire is 0.45 N or less and the vibration is 1.0 mm / sec or less, it is determined to be normal, and the workpiece is cut only when the normal is determined, The deterioration of the quality of the wafer cut out from the workpiece can be prevented more reliably.
　本発明のワイヤソー装置であれば、ワークの切断前に、ロードセルによって検出されるワイヤの張力、及び振動センサによって検出される振動の少なくとも一方の測定を行い、この測定値を用いてワイヤソー装置の正常又は異常の判断を行うことができる。従って、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行えば、ワークから切り出されるウェーハの品質悪化を防ぐことができる。 With the wire saw device of the present invention, before the workpiece is cut, at least one of the tension of the wire detected by the load cell and the vibration detected by the vibration sensor is measured, and the normal value of the wire saw device is measured using this measurement value. Alternatively, an abnormality can be determined. Therefore, if it is determined that the wire saw device is normal, the quality of the wafer cut out from the workpiece can be prevented from being deteriorated by cutting the workpiece.
　また、このような本発明のワイヤソー装置を用いたワークの切断方法であれば、ワークの切断前に、ワイヤソー装置の正常又は異常の判断を行うことができる。そして、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行うので、ワークから切り出されるウェーハの品質悪化を防ぐことができる。 Also, with such a workpiece cutting method using the wire saw device of the present invention, it is possible to determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece | work is cut | disconnected, the quality deterioration of the wafer cut out from a workpiece | work can be prevented.
本発明のワイヤソー装置の一例を示した概略図である。It is the schematic which showed an example of the wire saw apparatus of this invention. 本発明のワークの切断方法の一例を示した工程図である。It is process drawing which showed an example of the cutting method of the workpiece | work of this invention. 暖機時のワイヤ張力バラつきσの管理図である。It is a control chart of wire tension variation σ at the time of warm-up. 暖機時のワイヤ張力バラつきσが管理値限界外の（ａ）異常時（比較例１）と、管理値限界内の（ｂ）正常時（実施例１）において、ワークを切断したときのスライス品２５枚の平均Ｗａｒｐ品質を示したグラフである。The slice when the workpiece is cut when the wire tension variation σ during warm-up is outside the control value limit (a) when abnormal (Comparative Example 1) and within the control value limit (b) when normal (Example 1) It is the graph which showed the average Warp quality of 25 goods. 暖機時の振動振幅の平均値の管理図である。It is a management chart of the average value of the vibration amplitude at the time of warming up. 暖機時の振動振幅の平均値が管理値限界外の（ａ）異常時（比較例２）と、管理値限界内の（ｂ）正常時（実施例２）において、ワークを切断したときのスライス品２５枚の平均Ｗａｒｐ品質を示したグラフである。When the workpiece is cut when the average value of the vibration amplitude during warm-up is outside the control value limit (a) when abnormal (Comparative Example 2) and within the control value limit (b) when normal (Example 2) It is the graph which showed the average Warp quality of 25 sliced goods.
　以下、本発明について実施の形態を説明するが、本発明はこれに限定されるものではない。 Hereinafter, embodiments of the present invention will be described, but the present invention is not limited thereto.
　上記したように、ワイヤソー装置を用いた切断方法において、ワイヤ張力が一定に保てず、大きく暴れている状態や、異常な振動が起きている状態でワークを切断した場合、Ｗａｒｐ品質に悪化が見られる。また、ワークの切断途中に前記異常に気付き、メンテナンスの為に装置を停止すると、今度は温度変化によりＷａｒｐ品質が悪化する。どちらにおいても一度に多数枚のウェーハを切り出すため、大量不良に繋がる可能性が高いという問題があった。 As described above, in the cutting method using the wire saw device, the warp quality is deteriorated when the workpiece is cut in a state where the wire tension cannot be kept constant and is greatly violated or abnormal vibration occurs. It can be seen. Further, when the abnormality is noticed during the cutting of the workpiece and the apparatus is stopped for maintenance, the Warp quality deteriorates due to the temperature change. In either case, since a large number of wafers are cut out at a time, there is a problem that it is likely to lead to a large number of defects.
　そこで、本発明者はこのような問題を解決すべく鋭意検討を重ねた。その結果、ワークを保持する部分に取り付けられた振動センサと、ワイヤ張力を検出するロードセルを備えたワイヤソー装置であれば、ワークの切断前に、ロードセルによって検出されるワイヤの張力、及び振動センサによって検出される振動の少なくとも一方の測定を行い、この測定値を用いてワイヤソー装置の正常又は異常の判断を行うことができ、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行えば、ワークから切り出されるウェーハの品質悪化を防ぐことができることに想到した。そして、これらを実施するための最良の形態について精査し、本発明を完成させた。 Therefore, the present inventor has intensively studied to solve such problems. As a result, if the wire saw device includes a vibration sensor attached to a part that holds the workpiece and a load cell that detects wire tension, the wire tension and vibration sensor detected by the load cell before cutting the workpiece It is possible to measure at least one of the detected vibrations and use this measurement value to determine whether the wire saw device is normal or abnormal. When it is determined that the wire saw device is normal, the workpiece is cut. For example, it has been conceived that quality deterioration of a wafer cut out from a workpiece can be prevented. And the best form for implementing these was scrutinized and the present invention was completed.
　まず、本発明のワイヤソー装置について、図１を参照して説明する。図１に示すように、本発明のワイヤソー装置１３は、ワイヤ８を延出するワイヤ供給リール１と、複数のワイヤガイド６の周囲に螺旋状に巻回されたワイヤ８によって形成されるワイヤ列９と、ワイヤ８を巻き取るワイヤ巻き取りリール７と、切断対象のワークＷを保持するワーク保持部１０とを有し、少なくとも前進後退を１回以上繰り返して走行するワイヤ列９にワーク保持部１０に保持されたワークＷを押しつけて切断加工を行うものである。そして、ワイヤソー装置１３は、ワーク保持部１０に取り付けられた振動センサ（振動計）１１と、ワイヤ８の張力を検出するロードセル５とを備えている。 First, the wire saw device of the present invention will be described with reference to FIG. As shown in FIG. 1, a wire saw device 13 of the present invention includes a wire supply reel 1 that extends a wire 8 and a wire array that is spirally wound around a plurality of wire guides 6. 9, a wire take-up reel 7 for winding the wire 8, and a work holding part 10 for holding the work W to be cut, and the work holding part on the wire array 9 that travels at least once forward and backward. The workpiece W held by 10 is pressed and cut. The wire saw device 13 includes a vibration sensor (vibrometer) 11 attached to the work holding unit 10 and a load cell 5 that detects the tension of the wire 8.
　このワイヤソー装置１３では、ワイヤ８がワイヤ供給リール１からロングローラー２、トラバーサ３、複数のプーリーＰを通って、ワイヤガイド６に所定のピッチで平行に巻付けられ、ワイヤ列９を形成する。そのワイヤ列９に、ワーク保持部１０に保持されたワークＷを下降させていくことでワークＷを切断する構成となっている。そして、ワイヤガイド６を出たワイヤ８は、複数のプーリーＰとトラバーサ３を通ってワイヤ巻き取りリール７に巻き取られる。 In this wire saw device 13, the wire 8 passes from the wire supply reel 1 through the long roller 2, the traverser 3, and the plurality of pulleys P and is wound around the wire guide 6 in parallel at a predetermined pitch to form a wire row 9. The work W is cut by lowering the work W held by the work holding unit 10 to the wire row 9. Then, the wire 8 exiting the wire guide 6 passes through the plurality of pulleys P and the traverser 3 and is taken up by the wire take-up reel 7.
　本実施形態のワイヤソー装置１３では、ワイヤ供給リール１とワイヤガイド６、ワイヤガイド６とワイヤ巻取りリール７の間に、それぞれロードセル５とテンション機構４が設けられており、ロードセル５で検出した張力を元にテンション機構４によってワイヤ８の張力を制御している。 In the wire saw device 13 of this embodiment, a load cell 5 and a tension mechanism 4 are provided between the wire supply reel 1 and the wire guide 6 and between the wire guide 6 and the wire take-up reel 7, respectively, and the tension detected by the load cell 5. Based on the above, the tension of the wire 8 is controlled by the tension mechanism 4.
　そして、ワーク保持部１０には、振動センサ１１が取り付けられている。振動センサ１１は、例えば、ワーク保持部１０においてのワークＷを接着しているプレートに直接取り付けて、振動をモニターする構成とすることができる。ロードセル５及び振動センサ１１は、例えば、監視ＰＣ１２に接続され、ロードセル５及び振動センサ１１から出力される検出値を常時監視することができる。 Further, a vibration sensor 11 is attached to the work holding unit 10. For example, the vibration sensor 11 can be configured to directly attach to the plate to which the workpiece W in the workpiece holding unit 10 is bonded, and monitor the vibration. For example, the load cell 5 and the vibration sensor 11 are connected to the monitoring PC 12 and can constantly monitor the detection values output from the load cell 5 and the vibration sensor 11.
　このようなワイヤソー装置１３であれば、ワークＷの切断前に、ロードセル５によって検出されるワイヤ８の張力、及び振動センサ１１によって検出される振動の少なくとも一方の測定を行い、この測定値を用いてワイヤソー装置１３の正常又は異常の判断を行うことができる。従って、ワイヤソー装置１３が正常であると判断された場合に、ワークＷの切断を行えば、ワークＷから切り出されるウェーハの品質悪化を防ぐことができる。 With such a wire saw device 13, before cutting the workpiece W, at least one of the tension of the wire 8 detected by the load cell 5 and the vibration detected by the vibration sensor 11 is measured, and this measured value is used. Therefore, it is possible to determine whether the wire saw device 13 is normal or abnormal. Therefore, if it is determined that the wire saw device 13 is normal, the quality of the wafer cut out from the workpiece W can be prevented from being deteriorated by cutting the workpiece W.
　次に、上記したような本発明のワイヤソー装置を用いた本発明のワークの切断方法について説明する。ここでは、上述した図１に示す本発明のワイヤソー装置１３を用いた場合について説明する。 Next, the work cutting method of the present invention using the wire saw apparatus of the present invention as described above will be described. Here, the case where the wire saw apparatus 13 of the present invention shown in FIG. 1 is used will be described.
　まず、ワイヤソー装置１３を用いて、ワークＷの切断を行う前に、ワークＷをワイヤ８に接触させない状態で、ワイヤ８を少なくとも前進後退１回以上繰り返し走行させながら、ロードセル５によって検出されるワイヤ８の張力、及び振動センサ１１によって検出される振動の少なくとも一方の測定を行い、該測定された測定値を用いてワイヤソー装置１３の正常又は異常の判断を行う判断工程を行う。そして、この判断工程で、ワイヤソー装置１３が正常であると判断された場合に、ワークＷの切断を行う切断工程を行う。 First, before the workpiece W is cut using the wire saw device 13, the wire 8 is detected by the load cell 5 while the wire 8 is repeatedly moved at least once forward and backward while the workpiece W is not in contact with the wire 8. A determination step of measuring at least one of the tension of 8 and the vibration detected by the vibration sensor 11 and determining whether the wire saw device 13 is normal or abnormal is performed using the measured value. Then, in this determination step, when it is determined that the wire saw device 13 is normal, a cutting step for cutting the workpiece W is performed.
　具体的には、図２のフローチャートに示すように、まず、ワークＷを切断する前に、ワークＷがワイヤ列９に接触しない状態で、ワイヤ８を少なくとも１回以上前進後退走行させる。この作業を暖機運転（ＳＰ１）とする。この暖機運転中に、張力と振動の少なくとも一方を計測し（ＳＰ２）、その計測値（測定値）からワイヤソー装置１３が正常か異常かを判断する判断工程（ＳＰ３）を行う。そして、正常な場合は、暖機継続（ＳＰ４）後、そのままワークＷの切断を行う（ＳＰ５）。一方、異常な場合は、ワイヤソー装置１３を停止し（ＳＰ６）、プーリーＰの交換などのメンテナンスを実施する（ＳＰ７）。その後、再び暖機運転を行い（ＳＰ１）、正常になるまでこのフローを続けることができる。 Specifically, as shown in the flowchart of FIG. 2, first, before cutting the workpiece W, the wire 8 is moved forward and backward at least once in a state where the workpiece W does not contact the wire row 9. This operation is referred to as warm-up operation (SP1). During this warm-up operation, at least one of tension and vibration is measured (SP2), and a determination step (SP3) for determining whether the wire saw device 13 is normal or abnormal from the measured value (measured value) is performed. If normal, warm-up is continued (SP4), and then the workpiece W is cut as it is (SP5). On the other hand, if abnormal, the wire saw device 13 is stopped (SP6), and maintenance such as replacement of the pulley P is performed (SP7). Thereafter, the warm-up operation is performed again (SP1), and this flow can be continued until normal.
　このとき、判断工程（ＳＰ３）において、測定値を用いて管理図管理（ＳＰ８）を行い、測定値が管理値限界外にあった場合にワイヤソー装置１３が異常であると判断（ＳＰ９）して、ワークＷの切断前にワイヤソー装置１３を停止し、管理値限界内に入るまで、ワイヤソー装置１３のメンテナンスを行ってから、ワークＷを切断することができる。 At this time, in the determination step (SP3), control chart management (SP8) is performed using the measured values, and when the measured values are outside the control value limit, it is determined that the wire saw device 13 is abnormal (SP9). The wire saw device 13 is stopped before the workpiece W is cut, and the workpiece W can be cut after maintenance of the wire saw device 13 is performed until the workpiece W is within the control value limit.
　このようにすれば、管理図管理することで、ワークＷの切断前にワイヤソー装置１３の状態を把握でき、管理値限界外の異常状態の場合にメンテナンスすることで、ワークＷから切り出されるウェーハの品質悪化や品質悪化による不良発生を低減することができる。 In this way, by managing the control chart, the state of the wire saw device 13 can be grasped before the work W is cut, and maintenance is performed in the case of an abnormal state outside the control value limit, so that the wafer cut out from the work W can be obtained. The occurrence of defects due to quality deterioration or quality deterioration can be reduced.
　正常か異常かの判断の一例として、具体的には、暖機時における前進後退１サイクル時において、ロードセル５によって検出されるワイヤ８の張力の測定値を用いて算出することができる張力バラつきσや、振動センサ１１によって検出される振動の測定値を用いて算出することができる振動の振幅を管理図管理（ＳＰ８）し、管理限界線内（管理値限界内）は正常、外れた場合（管理値限界外）は異常と判断する（ＳＰ９）方法がある。 As an example of determination of normal or abnormal, specifically, tension variation σ that can be calculated using a measured value of the tension of the wire 8 detected by the load cell 5 during one forward and backward cycle during warm-up. If the vibration amplitude that can be calculated by using the vibration measurement value detected by the vibration sensor 11 is managed in the control chart (SP8), the control limit line (within the control value limit) is normal, or is out ( There is a method (SP9) that judges that the value is outside the control value limit).
　より具体的には、ロードセルによって検出されるワイヤの張力の標準偏差が０．４５Ｎ以下、且つ、振動センサによって検出される振動が１．０ｍｍ／ｓｅｃ以下であることを確認してから、ワークの切断を行うことができる。即ち、この条件を満たす場合を正常と判断し、満たさない場合を異常と判断する。 More specifically, after confirming that the standard deviation of the tension of the wire detected by the load cell is 0.45 N or less and the vibration detected by the vibration sensor is 1.0 mm / sec or less, Cutting can be done. That is, a case where this condition is satisfied is determined to be normal, and a case where this condition is not satisfied is determined to be abnormal.
　このような本発明のワイヤソー装置を用いたワークの切断方法であれば、ワークの切断前に、ワイヤソー装置の正常又は異常の判断を行うことができる。そして、ワイヤソー装置が正常であると判断された場合に、ワークの切断を行うので、ワークから切り出されるウェーハの品質悪化を防ぐことができる。 Such a workpiece cutting method using the wire saw device of the present invention can determine whether the wire saw device is normal or abnormal before cutting the workpiece. And when it is judged that a wire saw apparatus is normal, since a workpiece | work is cut | disconnected, the quality deterioration of the wafer cut out from a workpiece | work can be prevented.
　以下、本発明の実施例及び比較例を示して本発明をより具体的に説明するが、本発明はこれらに限定されるものではない。 Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples of the present invention, but the present invention is not limited to these.
（実施例１）
　図１に示すような本発明のワイヤソー装置を用いて、本発明のワークの切断方法に従ってワークの切断を行った。なお、ＣＺ法（チョクラルスキー法）で製造された直径３００ｍｍのインゴットをワークＷとして使用した。 (Example 1)
Using the wire saw device of the present invention as shown in FIG. 1, the workpiece was cut according to the workpiece cutting method of the present invention. In addition, an ingot having a diameter of 300 mm manufactured by the CZ method (Czochralski method) was used as the workpiece W.
　まず、ワークＷの切断を行う前に、ワークＷをワイヤ８（ワイヤ列９）に接触させない状態で、ワイヤ８を少なくとも前進後退１回以上繰り返し走行（暖機運転）させながら、ロードセル５によって検出されるワイヤ８の張力の測定を行った。 First, before the workpiece W is cut, the load cell 5 detects the workpiece 8 while repeatedly running (warming up) the wire 8 at least once forward and backward, with the workpiece W not in contact with the wire 8 (wire row 9). The tension of the wire 8 to be measured was measured.
　そして、この測定値を用いて算出した張力バラつきσの管理図管理を行った。図３は、暖機時における前進後退１サイクル時の張力バラつきσの管理図である。図３の各点は、暖機時における前進後退１サイクル時の張力バラつきσを示している。このとき、張力バラつきσが、ＵＣＬ（Ｕｐｐｅｒ　Ｃｏｎｔｒｏｌ　Ｌｉｍｉｔ：上方管理限界線）及びＬＣＬ（Ｌｏｗｅｒ　Ｃｏｎｔｒｏｌ　Ｌｉｍｉｔ：下方管理限界線）の管理限界線内（管理値限界内）の場合はワイヤソー装置が正常、外れた場合（管理値限界外）はワイヤソー装置が異常と判断した。なお、図３中のＣＬ（Ｃｅｎｔｒａｌ　Ｌｉｎｅ）は中心線を示す。 And the control chart management of the tension variation σ calculated using this measured value was performed. FIG. 3 is a management chart of the tension variation σ during one forward and backward cycle during warm-up. Each point in FIG. 3 indicates a tension variation σ during one cycle of forward and backward movement during warm-up. At this time, if the tension variation σ is within the control limit line (within the control value limit) of UCL (Upper Control Limit: upper control limit line) and LCL (Lower Control Limit: lower control limit line), the wire saw device is normal. When it was off (outside the control value limit), it was judged that the wire saw device was abnormal. In addition, CL (Central Line) in FIG. 3 shows a center line.
　そして、図３の下矢印（ｂ）が示すような張力バラつきσが管理値限界内で、正常と判断された場合において、ワークＷの切断を行った。このときのスライス品２５枚の平均Ｗａｒｐ品質を測定した結果を図４（ｂ）に示した。Ｗａｒｐ品質の測定には、ＳＢＷ-３３０（コベルコ科研製）を使用した。なお、図４中のエラーバーは、測定したスライス品２５枚のＷａｒｐの標準偏差（ＳＤ：ｓｔａｎｄａｒｄ　ｄｅｖｉａｔｉｏｎ）を示す。 When the tension variation σ as indicated by the down arrow (b) in FIG. 3 is within the control value limit and is determined to be normal, the workpiece W was cut. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG. For measurement of Warp quality, SBW-330 (manufactured by Kobelco Research Institute) was used. In addition, the error bar in FIG. 4 shows the standard deviation (SD: standard deviation) of 25 measured slices.
　その結果、図４（ｂ）に示すように、実施例１では、Ｗａｒｐ品質が平均６．８μｍであった。 As a result, as shown in FIG. 4B, in Example 1, the Warp quality averaged 6.8 μm.
（比較例１）
　比較例１として、図３の下矢印（ａ）が示すような、張力バラつきσが管理限界線を外れており、異常と判断された場合において、メンテナンスを実施せず、そのまま、ワークＷの切断を行った。図３の下矢印（ａ）が示す張力バラつきσは管理限界線を外れた０．４６Ｎであった。このときのスライス品２５枚の平均Ｗａｒｐ品質を測定した結果を図４（ａ）に示した。 (Comparative Example 1)
As Comparative Example 1, when the tension variation σ as shown by the down arrow (a) in FIG. Went. The tension variation σ indicated by the down arrow (a) in FIG. 3 was 0.46 N that deviated from the control limit line. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
　その結果、図４（ａ）に示すように、比較例１では、Ｗａｒｐ品質が平均９．７μｍであった。このように、張力バラつきσが０．４５Ｎを超えた場合にワークＷの切断を行ったため、Ｗａｒｐ品質が悪化してしまった。 As a result, as shown in FIG. 4A, in Comparative Example 1, the Warp quality averaged 9.7 μm. Thus, since the workpiece W was cut when the tension variation σ exceeded 0.45 N, the Warp quality was deteriorated.
（実施例２）
　振動センサによって検出される振動の測定を行って得られた測定値を用いて、暖機時における前進後退１サイクル時の振動振幅の平均値を算出した。そして、この振動振幅の平均値を用いて、管理図管理を行ったこと以外は、実施例１と同様にしてワークの切断を行った。 (Example 2)
Using the measured value obtained by measuring the vibration detected by the vibration sensor, the average value of the vibration amplitude during one forward and backward cycle during warm-up was calculated. Then, the workpiece was cut in the same manner as in Example 1 except that control chart management was performed using the average value of the vibration amplitude.
　まず、ワークＷの切断を行う前に、ワークＷをワイヤ８に接触させない状態で、ワイヤ８を少なくとも前進後退１回以上繰り返し走行（暖機運転）させながら、振動センサ１１によって検出される振動の測定を行った。 First, before cutting the workpiece W, while the workpiece W is not in contact with the wire 8, the wire 8 is repeatedly moved forward and backward at least once (warm-up operation) while the vibration detected by the vibration sensor 11 is detected. Measurements were made.
　そして、この測定値を用いて算出した振動振幅の平均値の管理図管理を行った。図５は、暖機時における前進後退１サイクル時の振動振幅の平均値の管理図である。また、図５の各点は、暖機時における前進後退１サイクル時の振動振幅の平均値を示している。このとき、振動振幅の平均値が、ＵＣＬ及びＬＣＬの管理限界線内（管理値限界内）の場合はワイヤソー装置が正常、外れた場合（管理値限界外）はワイヤソー装置が異常と判断した。なお、図５中のＣＬは中心線を示す。 And the control chart management of the average value of the vibration amplitude calculated using this measured value was performed. FIG. 5 is a management chart of the average value of the vibration amplitude during one forward and backward cycle during warm-up. Each point in FIG. 5 indicates the average value of the vibration amplitude during one forward and backward cycle during warm-up. At this time, when the average value of the vibration amplitude was within the control limit line (within the control value limit) of UCL and LCL, the wire saw device was determined to be normal, and when the average value was outside (the control value limit), the wire saw device was determined to be abnormal. Note that CL in FIG. 5 indicates a center line.
　そして、図５の下矢印（ｂ）が示すような振動振幅の平均値が管理値限界内で、正常と判断された場合において、ワークＷの切断を行った。このときのスライス品２５枚の平均Ｗａｒｐ品質を実施例１と同様にして測定した結果を図６（ｂ）に示した。なお、図６中のエラーバーは、測定したスライス品２５枚のＷａｒｐの標準偏差（ＳＤ）を示す。 Then, when the average value of the vibration amplitude as indicated by the down arrow (b) in FIG. 5 is within the control value limit and is determined to be normal, the workpiece W was cut. The average Warp quality of the 25 sliced products at this time was measured in the same manner as in Example 1, and the result is shown in FIG. In addition, the error bar in FIG. 6 shows the standard deviation (SD) of Warp of the 25 sliced products measured.
　その結果、図６（ｂ）に示すように、実施例２では、Ｗａｒｐ品質が平均７．１μｍであった。 As a result, as shown in FIG. 6B, in Example 2, the Warp quality averaged 7.1 μm.
（比較例２）
　比較例２として、図５の下矢印（ａ）が示すような、振動振幅の平均値が管理限界線を外れており、異常と判断された場合において、メンテナンスを実施せず、そのまま、ワークＷの切断を行った。図５の下矢印（ａ）が示す位置での振動は１．２ｍｍ／ｓｅｃであった。このときのスライス品２５枚の平均Ｗａｒｐ品質を測定した結果を図６（ａ）に示した。 (Comparative Example 2)
As Comparative Example 2, when the average value of the vibration amplitude as shown by the down arrow (a) in FIG. 5 is out of the control limit line and is determined to be abnormal, maintenance is not performed and the workpiece W is left as it is. Was cut. The vibration at the position indicated by the down arrow (a) in FIG. 5 was 1.2 mm / sec. The result of measuring the average Warp quality of 25 sliced products at this time is shown in FIG.
　その結果、図６（ａ）に示すように、比較例２では、Ｗａｒｐ品質が平均１０．２μｍであった。このように、振動が１．０ｍｍ／ｓｅｃを超えた場合にワークＷの切断を行ったため、Ｗａｒｐ品質が悪化してしまった。 As a result, as shown in FIG. 6A, in Comparative Example 2, the Warp quality averaged 10.2 μm. Thus, since the workpiece W was cut when the vibration exceeded 1.0 mm / sec, the Warp quality was deteriorated.
　以上の結果から、本発明を実施した実施例１、２のように、ワーク切断前のワイヤソー装置において、振動と張力の少なくとも一方の測定結果を用いて、管理図管理することで、ワークＷの切断前にワイヤソー装置の状態を把握でき、管理値限界内の正常な状態を維持することで、ワークの品質悪化や品質悪化による不良発生の低減をすることができることが分かった。 From the above results, as in Examples 1 and 2 in which the present invention is implemented, in the wire saw device before cutting the workpiece, by using at least one measurement result of vibration and tension, control chart management is performed. It was found that the state of the wire saw device can be grasped before cutting, and by maintaining a normal state within the control value limit, it is possible to reduce the quality of the workpiece and the occurrence of defects due to the quality degradation.
　なお、本発明は、上記実施形態に限定されるものではない。上記実施形態は例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 Note that the present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has any configuration that has substantially the same configuration as the technical idea described in the claims of the present invention and that exhibits the same effects. Are included in the technical scope.

Claims (4)

  1. 　ワイヤを延出するワイヤ供給リールと、複数のワイヤガイドの周囲に螺旋状に巻回された前記ワイヤによって形成されるワイヤ列と、前記ワイヤを巻き取るワイヤ巻き取りリールと、切断対象のワークを保持するワーク保持部とを有し、少なくとも前進後退を１回以上繰り返して走行する前記ワイヤ列に前記ワーク保持部に保持された前記ワークを押しつけて切断加工を行うワイヤソー装置において、
    　前記ワーク保持部に取り付けられた振動センサと、前記ワイヤの張力を検出するロードセルとを備えることを特徴とするワイヤソー装置。     A wire supply reel for extending a wire, a wire row formed by the wires spirally wound around a plurality of wire guides, a wire take-up reel for winding the wire, and a workpiece to be cut A wire saw device that performs a cutting process by pressing the workpiece held by the workpiece holding portion against the wire row that travels by repeating at least one forward and backward movement at least once.
    A wire saw device comprising: a vibration sensor attached to the workpiece holding unit; and a load cell for detecting a tension of the wire.
  2. 　請求項１に記載のワイヤソー装置を用いてワークを切断する方法であって、
    　前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退１回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力、及び前記振動センサによって検出される振動の少なくとも一方の測定を行い、該測定された測定値を用いて前記ワイヤソー装置の正常又は異常の判断を行う判断工程と、
    　前記ワイヤソー装置が正常であると判断された場合に、前記ワークの切断を行う切断工程を有することを特徴とするワークの切断方法。     A method of cutting a workpiece using the wire saw device according to claim 1,
    Before the workpiece is cut, the wire tension is detected by the load cell and the vibration sensor while the wire is repeatedly moved at least once forward and backward while the workpiece is not in contact with the wire. A determination step of measuring at least one of the vibrations and determining whether the wire saw device is normal or abnormal using the measured values;
    A workpiece cutting method comprising a cutting step of cutting the workpiece when it is determined that the wire saw device is normal.
  3. 　前記判断工程において、
    　前記測定値を用いて管理図管理を行い、前記測定値が管理値限界外にあった場合に前記ワイヤソー装置が異常であると判断して、前記ワークの切断前に前記ワイヤソー装置を停止し、前記管理値限界内に入るまで、前記ワイヤソー装置のメンテナンスを行ってから、前記ワークを切断することを特徴とする請求項２に記載のワークの切断方法。     In the determination step,
    Control chart management is performed using the measured value, and when the measured value is outside the control value limit, the wire saw device is determined to be abnormal, and the wire saw device is stopped before cutting the workpiece, The work cutting method according to claim 2, wherein the work is cut after maintenance of the wire saw device is performed until the control value is within the control value limit.
  4. 　請求項１に記載のワイヤソー装置を用いてワークを切断する方法であって、
    　前記ワークの切断前に、前記ワークを前記ワイヤに接触させない状態で、前記ワイヤを少なくとも前進後退１回以上繰り返し走行させながら、前記ロードセルによって検出される前記ワイヤの張力の標準偏差が０．４５Ｎ以下、且つ、前記振動センサによって検出される振動が１．０ｍｍ／ｓｅｃ以下であることを確認してから、前記ワークの切断を行うことを特徴とするワークの切断方法。     A method of cutting a workpiece using the wire saw device according to claim 1,
    The standard deviation of the tension of the wire detected by the load cell is not more than 0.45 N while the wire is repeatedly moved at least once forward and backward, with the workpiece not in contact with the wire before cutting the workpiece And the workpiece | work cutting method characterized by cutting the said workpiece | work after confirming that the vibration detected by the said vibration sensor is 1.0 mm / sec or less.
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