KR102382752B1 - 와이어소 장치 및 워크의 절단방법 - Google Patents

와이어소 장치 및 워크의 절단방법 Download PDF

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Publication number
KR102382752B1
KR102382752B1 KR1020187033668A KR20187033668A KR102382752B1 KR 102382752 B1 KR102382752 B1 KR 102382752B1 KR 1020187033668 A KR1020187033668 A KR 1020187033668A KR 20187033668 A KR20187033668 A KR 20187033668A KR 102382752 B1 KR102382752 B1 KR 102382752B1
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KR
South Korea
Prior art keywords
wire
workpiece
saw device
wire saw
cutting
Prior art date
Application number
KR1020187033668A
Other languages
English (en)
Korean (ko)
Other versions
KR20190026653A (ko
Inventor
요시히로 우사미
Original Assignee
신에쯔 한도타이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 신에쯔 한도타이 가부시키가이샤 filed Critical 신에쯔 한도타이 가부시키가이샤
Publication of KR20190026653A publication Critical patent/KR20190026653A/ko
Application granted granted Critical
Publication of KR102382752B1 publication Critical patent/KR102382752B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020187033668A 2016-07-13 2017-06-30 와이어소 장치 및 워크의 절단방법 KR102382752B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016138535 2016-07-13
JPJP-P-2016-138535 2016-07-13
PCT/JP2017/024063 WO2018012313A1 (ja) 2016-07-13 2017-06-30 ワイヤソー装置及びワークの切断方法

Publications (2)

Publication Number Publication Date
KR20190026653A KR20190026653A (ko) 2019-03-13
KR102382752B1 true KR102382752B1 (ko) 2022-04-05

Family

ID=60952389

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187033668A KR102382752B1 (ko) 2016-07-13 2017-06-30 와이어소 장치 및 워크의 절단방법

Country Status (5)

Country Link
JP (1) JP6729697B2 (zh)
KR (1) KR102382752B1 (zh)
CN (1) CN109153104B (zh)
TW (1) TWI737757B (zh)
WO (1) WO2018012313A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023022450A (ja) 2021-08-03 2023-02-15 コマツＮｔｃ株式会社 ワイヤソーの異常診断装置および方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061809A (ja) * 1998-08-20 2000-02-29 Super Silicon Kenkyusho:Kk ワイヤソー切断装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0727603A (ja) * 1993-07-09 1995-01-31 Hitachi Electron Eng Co Ltd 可動部の異常振動検査装置
JPH1024411A (ja) * 1996-07-12 1998-01-27 Nippei Toyama Corp ワイヤソーの加工制御方法及び装置
JPH11156694A (ja) 1997-12-01 1999-06-15 Hitachi Ltd ワイヤーソー切断方法および装置
JP2000190196A (ja) * 1998-12-28 2000-07-11 Nippei Toyama Corp ワイヤソ―のリ―ルボビンの異常回転検知構造
JP4684323B2 (ja) * 2008-09-11 2011-05-18 コマツＮｔｃ株式会社 ワイヤソーおよびワーク加工方法
JP5201086B2 (ja) * 2009-06-10 2013-06-05 信越半導体株式会社 ワークの切断方法
JP2011104688A (ja) * 2009-11-16 2011-06-02 Takatori Corp ワイヤソー
CN201625917U (zh) * 2009-11-26 2010-11-10 上海日进机床有限公司 金刚线开方机的张力调整机构
SG183130A1 (en) * 2010-02-08 2012-09-27 Toyo Advanced Tech Co Method of cutting workpiece with wire saw, and wire saw
EP2535144B1 (en) * 2010-02-08 2018-08-08 Toyo Advanced Technologies Co., Ltd. Wire saw
TWI488725B (zh) * 2010-02-11 2015-06-21 Toyo Advanced Tech Co Cutting method and wire sawing by wire saw
CN103052468B (zh) * 2010-09-27 2015-07-08 小松Ntc株式会社 用于检测线锯中的断线的方法和设备
JP5494558B2 (ja) * 2011-04-20 2014-05-14 信越半導体株式会社 ワイヤソーの運転再開方法及びワイヤソー
JP5155428B2 (ja) * 2011-07-15 2013-03-06 コマツＮｔｃ株式会社 ワイヤソー
JP5875277B2 (ja) 2011-08-04 2016-03-02 トーヨーエイテック株式会社 ワイヤソー
EP2954965A1 (en) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Method and system for sawing an ingot
WO2015188859A1 (en) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Wire saw system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061809A (ja) * 1998-08-20 2000-02-29 Super Silicon Kenkyusho:Kk ワイヤソー切断装置

Also Published As

Publication number Publication date
TW201801851A (zh) 2018-01-16
JP6729697B2 (ja) 2020-07-22
CN109153104A (zh) 2019-01-04
WO2018012313A1 (ja) 2018-01-18
KR20190026653A (ko) 2019-03-13
JPWO2018012313A1 (ja) 2019-02-21
TWI737757B (zh) 2021-09-01
CN109153104B (zh) 2021-03-16

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