JP6716704B2 - 薄膜トランジスタアレイパネル及び導電構造 - Google Patents
薄膜トランジスタアレイパネル及び導電構造 Download PDFInfo
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- JP6716704B2 JP6716704B2 JP2018536260A JP2018536260A JP6716704B2 JP 6716704 B2 JP6716704 B2 JP 6716704B2 JP 2018536260 A JP2018536260 A JP 2018536260A JP 2018536260 A JP2018536260 A JP 2018536260A JP 6716704 B2 JP6716704 B2 JP 6716704B2
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- zinc
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- 239000010409 thin film Substances 0.000 title claims description 31
- 239000000463 material Substances 0.000 claims description 88
- 229910052738 indium Inorganic materials 0.000 claims description 87
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 87
- 239000011701 zinc Substances 0.000 claims description 68
- 229910052725 zinc Inorganic materials 0.000 claims description 65
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 64
- 238000005530 etching Methods 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 19
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- 239000011787 zinc oxide Substances 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910044991 metal oxide Inorganic materials 0.000 claims description 8
- 150000004706 metal oxides Chemical class 0.000 claims description 8
- MGRWKWACZDFZJT-UHFFFAOYSA-N molybdenum tungsten Chemical compound [Mo].[W] MGRWKWACZDFZJT-UHFFFAOYSA-N 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 4
- DZLPZFLXRVRDAE-UHFFFAOYSA-N [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] Chemical compound [O--].[O--].[O--].[O--].[Al+3].[Zn++].[In+3] DZLPZFLXRVRDAE-UHFFFAOYSA-N 0.000 claims description 3
- HRHKULZDDYWVBE-UHFFFAOYSA-N indium;oxozinc;tin Chemical compound [In].[Sn].[Zn]=O HRHKULZDDYWVBE-UHFFFAOYSA-N 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 2
- 241001101998 Galium Species 0.000 claims 1
- 239000010410 layer Substances 0.000 description 226
- 238000000034 method Methods 0.000 description 25
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- 230000008054 signal transmission Effects 0.000 description 20
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- 238000000151 deposition Methods 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000002800 charge carrier Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 239000003989 dielectric material Substances 0.000 description 10
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 9
- 239000011572 manganese Substances 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 7
- -1 polyethylene Polymers 0.000 description 7
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000002161 passivation Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 235000012239 silicon dioxide Nutrition 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 5
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052779 Neodymium Inorganic materials 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910000449 hafnium oxide Inorganic materials 0.000 description 4
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 229910052748 manganese Inorganic materials 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
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- 239000005020 polyethylene terephthalate Substances 0.000 description 4
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- 239000000377 silicon dioxide Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 229910052735 hafnium Inorganic materials 0.000 description 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
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- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007736 thin film deposition technique Methods 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052693 Europium Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- 229910052765 Lutetium Inorganic materials 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 2
- 229910052777 Praseodymium Inorganic materials 0.000 description 2
- 229910052772 Samarium Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052771 Terbium Inorganic materials 0.000 description 2
- 229910052775 Thulium Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910052769 Ytterbium Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 2
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- 238000000137 annealing Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
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- 229910052733 gallium Inorganic materials 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- NJWNEWQMQCGRDO-UHFFFAOYSA-N indium zinc Chemical compound [Zn].[In] NJWNEWQMQCGRDO-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
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- 229910052712 strontium Inorganic materials 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
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- 239000010937 tungsten Substances 0.000 description 2
- 238000001429 visible spectrum Methods 0.000 description 2
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- 229910052727 yttrium Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- 229910003781 PbTiO3 Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 230000008859 change Effects 0.000 description 1
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- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
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- 150000002825 nitriles Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/441—Deposition of conductive or insulating materials for electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
- H01L21/441—Deposition of conductive or insulating materials for electrodes
- H01L21/443—Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/4763—Deposition of non-insulating, e.g. conductive -, resistive -, layers on insulating layers; After-treatment of these layers
- H01L21/47635—After-treatment of these layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/477—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Description
に、一つの実施例において、導電層105は一つまたは複数の追加のサブレイヤを設置してもよい。例えば、本実施例において、導電層105はさらに第一サブレイヤ105−1と第二サブレイヤ105−2との間に設置されている追加サブレイヤ105−4が設置されている。追加サブレイヤ105−4もインジウム及び亜鉛を含む金属酸化物層により構成されてもよく、追加サブレイヤ105−4中の亜鉛の原子含有量に対するインジウムの原子含有量の比率は第三サブレイヤ105−3中の亜鉛の原子含有量に対するインジウムの原子含有量の比率より大きい(また、第一サブレイヤ105−1中の亜鉛の原子含有量に対するインジウムの原子含有量の比率より小さい)。BBL中に追加のサブレイヤを挿入することにより、第二レベル導電層(例、層105)中のエッチング特性を保留でき、比較的高いインジウム含有量はBBLの最低層のサブレイヤ中(例えば、サブレイヤ105−1)に使用されて、導電層105とチャネル層104との間の接触界面部分の電気的性能(例、オーミック接触の減少に用いられる)をさらに改善する。したがって、一つの実施例において、第一サブレイヤ105−1中のインジウム含有量は、追加サブレイヤ105−4中のインジウム含有量より大きい。一つの実施例において、第一サブレイヤ105−1中のインジウム含有量と追加サブレイヤ105−4中のインジウム含有量の比率は約1〜1.5の範囲内にある。BBL中に、二つ以上の追加のサブレイヤを提供するその他の実施例において、さらに第一層105−1に近接する追加サブレイヤ中の一つにおけるインジウム含有量(または、一つの状況下における亜鉛の原子含有量に対するインジウムの原子含有量の比率)は、原因は上述した内容と同様に、第一層105−1から離れるどの追加サブレイヤ中のインジウム原子含有量より高くなければならない。
Claims (22)
- 薄膜トランジスタアレイパネルであって、
ゲート電極を含む第一導電層と、
前記ゲート電極の上方に設置され且つこれと絶縁されているチャネル層と、
前記チャネル層上に設置された第二導電層と、を含み、前記第二導電層は、ソース電極とドレイン電極を定義する多層部分を含み、前記第二導電層の前記多層部分は少なくとも、
前記チャネル層と電気接続するように設置された第一サブレイヤと、
前記第一サブレイヤ上に設置された第二サブレイヤと、
前記第二サブレイヤ上に設置された第三サブレイヤと、を備え、
前記各第三及び前記第一サブレイヤには、インジウム及び亜鉛を含む金属酸化物材料が含まれ、
前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率より大きく、
前記第一と前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は、前記第二導電層における前記ソース電極と前記ドレイン電極との間に形成される間隙に関連する側面のエッチングプロファイルに影響し、
前記第三サブレイヤ中の関連する間隙の幅は前記第一サブレイヤ中の間隙の幅より広いことを特徴とする薄膜トランジスタアレイパネル。 - 前記第一と前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は20%より大きいことを特徴とする請求項1に記載の薄膜トランジスタアレイパネル。
- 前記第一と前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は、前記ソース電極と前記ドレイン電極との間で定義されている基本的に平滑で且つ次第に細くなっている側面のエッチングプロファイルの形成に影響することを特徴とする請求項2に記載の薄膜トランジスタアレイパネル。
- 前記ソース電極と前記ドレイン電極との間を限定する間隙に関連する側面のプロファイルは、前記チャネル層により限定された表面に対して、約40度〜85度の範囲内の円錐角に対応することを特徴とする請求項3に記載の薄膜トランジスタアレイパネル。
- 前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約25%〜約80%の範囲内であることを特徴とする請求項2に記載の薄膜トランジスタアレイパネル。
- 前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約45%〜約70%の範囲内であることを特徴とする請求項5に記載の薄膜トランジスタアレイパネル。
- 前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約5%〜約40%の範囲内であることを特徴とする請求項2に記載の薄膜トランジスタアレイパネル。
- 前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約10%〜約35%の範囲内であることを特徴とする請求項7に記載の薄膜トランジスタアレイパネル。
- 前記第二サブレイヤは金属及び金属合金材料中の少なくとも一種を含むことを特徴とする請求項1に記載の薄膜トランジスタアレイパネル。
- 前記第二サブレイヤは、アルミニウム、銅、マンガン、モリブデンタングステン(MoW)材料中の少なくとも一種を含むことを特徴とする請求項9に記載の薄膜トランジスタアレイパネル。
- 前記チャネル層は、アモルファス、結晶及び多結晶状態中の少なくとも一種の酸化物半導体、元素半導体、化合物半導体及び合金半導体材料中の少なくも一種を含むことを特徴とする請求項1に記載の薄膜トランジスタアレイパネル。
- 前記チャネル層は、インジウム−ガリウム−亜鉛酸化物(IGZO)、インジウム−亜鉛−錫酸化物(IZTO)、IGTO(indium gallium tin oxide)、IAZO(indium aluminum zinc oxide)材料中の少なくとも一種を含むことを特徴とする請求項11に記載の薄膜トランジスタアレイパネル。
- 導電構造であって、
基板の上方に設置され、並びに側面が前記基板上に定義された第一と第二接続エリアとの間を交差する導電層を含み、前記導電層は多層部分を含み、前記導電層の多層部分は、少なくとも、
前記基板上に設置された第一サブレイヤと、
前記第一サブレイヤ上に設置された第二サブレイヤと、
前記第二サブレイヤ上に設置された第三サブレイヤと、を含み、
前記各第一及び前記第三サブレイヤにはインジウム及び亜鉛を含む金属酸化物層が含まれ、
前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率より大きく、
前記第一サブレイヤと前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は、前記導電層における間隙に関連する側面のエッチングプロファイルに影響し、並びに、
前記第三サブレイヤ中の関連する間隙の幅は前記第一サブレイヤ中の間隙の幅より広いことを特徴とする導電構造。 - 前記第一と前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は20%より大きいことを特徴とする請求項13に記載の導電構造。
- 前記第一と前記第三サブレイヤとの間の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率の差異は、前記第一接続エリアと前記第二接続エリアとの間で定義されている基本的に平滑で且つ次第に細くなっている側面のエッチングプロファイルの形成に影響することを特徴とする請求項14に記載の導電構造。
- 前記間隙に関連する側面のプロファイルは、前記基板により限定された表面に対して、約40度〜85度の範囲内の円錐角に対応することを特徴とする請求項15記載の導電構造。
- 前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約25%〜約80%の範囲内であることを特徴とする請求項14に記載の導電構造。
- 前記第一サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約45%〜約70%の範囲内であることを特徴とする請求項17に記載の導電構造。
- 前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約5%〜約40%の範囲内であることを特徴とする請求項14に記載の導電構造。
- 前記第三サブレイヤ中の前記亜鉛の原子含有量に対する前記インジウムの原子含有量の比率は、約10%〜約35%の範囲内であることを特徴とする請求項19に記載の導電構造。
- 前記第二サブレイヤは金属及び金属合金材料中の少なくとも一種を含むことを特徴とする請求項13に記載の導電構造。
- 前記第二サブレイヤは、アルミニウム、銅、マンガン、モリブデンタングステン(MoW)材料中の少なくとも一種を含むことを特徴とする請求項21に記載の導電構造。
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