JP6686241B1 - 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 - Google Patents

保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 Download PDF

Info

Publication number
JP6686241B1
JP6686241B1 JP2020502490A JP2020502490A JP6686241B1 JP 6686241 B1 JP6686241 B1 JP 6686241B1 JP 2020502490 A JP2020502490 A JP 2020502490A JP 2020502490 A JP2020502490 A JP 2020502490A JP 6686241 B1 JP6686241 B1 JP 6686241B1
Authority
JP
Japan
Prior art keywords
protective film
film
forming
meth
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020502490A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020054355A1 (ja
Inventor
力也 小橋
力也 小橋
康喜 中石
康喜 中石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Application granted granted Critical
Publication of JP6686241B1 publication Critical patent/JP6686241B1/ja
Publication of JPWO2020054355A1 publication Critical patent/JPWO2020054355A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2020502490A 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 Active JP6686241B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018169591 2018-09-11
JP2018169591 2018-09-11
PCT/JP2019/032962 WO2020054355A1 (ja) 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法

Publications (2)

Publication Number Publication Date
JP6686241B1 true JP6686241B1 (ja) 2020-04-22
JPWO2020054355A1 JPWO2020054355A1 (ja) 2020-10-22

Family

ID=69776737

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020502490A Active JP6686241B1 (ja) 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法

Country Status (6)

Country Link
JP (1) JP6686241B1 (ko)
KR (1) KR102596665B1 (ko)
CN (1) CN112154536B (ko)
SG (1) SG11202012966XA (ko)
TW (1) TWI790400B (ko)
WO (1) WO2020054355A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021193942A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP2004311552A (ja) * 2003-04-03 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
WO2015111632A1 (ja) * 2014-01-22 2015-07-30 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007193271A (ja) * 2006-01-23 2007-08-02 Lintec Corp 防眩性フィルムの製造方法及び防眩性フィルム
JP5124778B2 (ja) * 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
CN105899631A (zh) * 2014-01-08 2016-08-24 琳得科株式会社 保护膜形成用复合片
JP6630956B2 (ja) * 2015-06-05 2020-01-15 リンテック株式会社 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法
CN108243616B (zh) * 2016-03-04 2022-10-28 琳得科株式会社 半导体加工用片

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP2004311552A (ja) * 2003-04-03 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
WO2015111632A1 (ja) * 2014-01-22 2015-07-30 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
JPWO2020054355A1 (ja) 2020-10-22
SG11202012966XA (en) 2021-02-25
CN112154536A (zh) 2020-12-29
KR20210057703A (ko) 2021-05-21
TW202025264A (zh) 2020-07-01
WO2020054355A1 (ja) 2020-03-19
CN112154536B (zh) 2024-09-17
KR102596665B1 (ko) 2023-11-01
TWI790400B (zh) 2023-01-21

Similar Documents

Publication Publication Date Title
JP7182603B2 (ja) 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法
WO2018179475A1 (ja) 保護膜形成用複合シート
JP6298226B1 (ja) 保護膜形成用複合シート
JP6914698B2 (ja) 樹脂膜形成用複合シート
WO2019172439A1 (ja) 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法
WO2017145938A1 (ja) 保護膜形成用シート、保護膜形成用シートの製造方法及び半導体装置の製造方法
JP7044780B2 (ja) 樹脂膜形成用フィルム及び樹脂膜形成用複合シート
JP2019062108A (ja) 樹脂膜形成用複合シート
JP7290989B2 (ja) 保護膜形成用複合シート
JP7182610B2 (ja) 保護膜形成用複合シート及び保護膜付き半導体装置の製造方法
JP6686241B1 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法
JP2022089876A (ja) 保護膜形成用フィルム及び保護膜形成用複合シート
JP6445747B1 (ja) 保護膜形成用複合シート
JP7182611B2 (ja) 保護膜形成用複合シート及びその製造方法
KR20200145675A (ko) 보호막 형성용 복합 시트, 및 보호막이 형성된 반도체 칩의 제조 방법
JP7039460B2 (ja) 保護膜形成用複合シート
JP2019062107A (ja) 樹脂膜形成用複合シート
JP7465099B2 (ja) 保護膜形成用複合シート、及び保護膜付きチップの製造方法
JP7190483B2 (ja) 保護膜形成用複合シート
JP6410386B1 (ja) 支持シート及び保護膜形成用複合シート
WO2020116288A1 (ja) 保護膜形成用複合シート、及び半導体チップの製造方法
WO2019187000A1 (ja) 支持シート及びその製造方法、並びに保護膜形成用複合シート及びその製造方法
JP2022146565A (ja) 保護膜形成フィルム、保護膜形成用複合シート、及びウエハの再生方法
JPWO2019187010A1 (ja) 保護膜形成用複合シート及びその製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200117

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200117

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20200228

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200303

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200401

R150 Certificate of patent or registration of utility model

Ref document number: 6686241

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250