SG11202012966XA - Film for protective film formation, composite sheet for protective film formation, test method, and identification method - Google Patents

Film for protective film formation, composite sheet for protective film formation, test method, and identification method

Info

Publication number
SG11202012966XA
SG11202012966XA SG11202012966XA SG11202012966XA SG11202012966XA SG 11202012966X A SG11202012966X A SG 11202012966XA SG 11202012966X A SG11202012966X A SG 11202012966XA SG 11202012966X A SG11202012966X A SG 11202012966XA SG 11202012966X A SG11202012966X A SG 11202012966XA
Authority
SG
Singapore
Prior art keywords
protective film
film formation
composite sheet
test method
identification method
Prior art date
Application number
SG11202012966XA
Other languages
English (en)
Inventor
Rikiya Kobashi
Yasunobu NAKAISHI
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of SG11202012966XA publication Critical patent/SG11202012966XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG11202012966XA 2018-09-11 2019-08-23 Film for protective film formation, composite sheet for protective film formation, test method, and identification method SG11202012966XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018169591 2018-09-11
PCT/JP2019/032962 WO2020054355A1 (ja) 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法

Publications (1)

Publication Number Publication Date
SG11202012966XA true SG11202012966XA (en) 2021-02-25

Family

ID=69776737

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202012966XA SG11202012966XA (en) 2018-09-11 2019-08-23 Film for protective film formation, composite sheet for protective film formation, test method, and identification method

Country Status (6)

Country Link
JP (1) JP6686241B1 (ko)
KR (1) KR102596665B1 (ko)
CN (1) CN112154536A (ko)
SG (1) SG11202012966XA (ko)
TW (1) TWI790400B (ko)
WO (1) WO2020054355A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202137308A (zh) * 2020-03-27 2021-10-01 日商琳得科股份有限公司 半導體裝置製造用片的製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP3841060B2 (ja) * 2003-04-03 2006-11-01 松下電器産業株式会社 半導体装置およびその製造方法
JP2007193271A (ja) * 2006-01-23 2007-08-02 Lintec Corp 防眩性フィルムの製造方法及び防眩性フィルム
JP4499761B2 (ja) * 2007-04-12 2010-07-07 カシオマイクロニクス株式会社 半導体装置
JP5124778B2 (ja) * 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
JP6600872B2 (ja) * 2014-01-08 2019-11-06 リンテック株式会社 保護膜形成用複合シート
JP6453773B2 (ja) 2014-01-22 2019-01-16 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
KR102509165B1 (ko) * 2015-06-05 2023-03-10 린텍 가부시키가이샤 보호막 형성용 복합 시트
CN108243616B (zh) * 2016-03-04 2022-10-28 琳得科株式会社 半导体加工用片
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Also Published As

Publication number Publication date
JPWO2020054355A1 (ja) 2020-10-22
KR102596665B1 (ko) 2023-11-01
KR20210057703A (ko) 2021-05-21
WO2020054355A1 (ja) 2020-03-19
TWI790400B (zh) 2023-01-21
TW202025264A (zh) 2020-07-01
CN112154536A (zh) 2020-12-29
JP6686241B1 (ja) 2020-04-22

Similar Documents

Publication Publication Date Title
EP3719678A4 (en) IDENTITY VERIFICATION APPARATUS AND METHOD
EP3905078A4 (en) IDENTITY VERIFICATION PROCESS AND SYSTEM THEREOF
EP3723399A4 (en) IDENTITY VERIFICATION METHOD AND DEVICE
EP3522072A4 (en) DOCUMENT AND IDENTITY VERIFICATION METHOD AND APPARATUS
EP3635937A4 (en) SYSTEM AND PROCEDURE FOR BIOMETRIC IDENTIFICATION
GB2559164B (en) Method and system for measuring coating thicknesses
SG11201600687SA (en) Protective film-forming film, sheet for forming protective film, and inspection method.
SG11201605781WA (en) Protective film-forming film, sheet for forming protective film, complex sheet for forming protective film, and inspection method
EP3444562B8 (en) Elongate sheet material thickness measuring method and thickness measuring system
EP3444998A4 (en) NETWORK VERIFICATION METHOD AND RELATED DEVICE AND SYSTEM
EP3410106A4 (en) Thickness measurement method, thickness measurement device, defect detection method, and defect detection device
EP3720191A4 (en) INFORMATION DISCLOSURE PROCEDURE AND DEVICE
IL245623B (en) System and method for detecting forgeries
EP3664345A4 (en) INFORMATION DISCLOSURE PROCEDURE AND DEVICE
GB2593087B (en) Train identification system and method, and train safety inspection system and method
EP3560616A4 (en) METHOD FOR COOLING A STEEL SHEET, COOLING DEVICE FOR A STEEL SHEET AND METHOD FOR MANUFACTURING A STEEL SHEET
EP3537144A4 (en) DEVICE FOR DETECTING THICKNESS LOSS, SYSTEM FOR DETECTING THICKNESS LOSS, METHOD FOR DETECTING THICKNESS LOSS AND PROGRAM
SG11202011629WA (en) Stick-on ticket system and method
EP3396559A4 (en) METHOD AND DEVICE FOR ASSOCIATION OF NETWORK ELEMENT AND ASSOCIATION INFORMATION CALCULATION
EP3593318A4 (en) BIOMETRIC IDENTIFICATION SYSTEM AND METHOD
GB2593828B (en) Method, system and apparatus for auxiliary label detection and association
EP3858570C0 (en) METHOD FOR MOLDING AND DEVICE FOR MOLDING A COMPOSITE SHEET
GB2591376B (en) System and method for item facing recommendation
EP3779739A4 (en) OBJECT VERIFICATION METHOD, DEVICE AND SYSTEM
EP3631703A4 (en) DEVICE, SYSTEM AND METHOD FOR ASSESSING SOCIAL SUITABILITY