SG11201600687SA - Protective film-forming film, sheet for forming protective film, and inspection method. - Google Patents
Protective film-forming film, sheet for forming protective film, and inspection method.Info
- Publication number
- SG11201600687SA SG11201600687SA SG11201600687SA SG11201600687SA SG11201600687SA SG 11201600687S A SG11201600687S A SG 11201600687SA SG 11201600687S A SG11201600687S A SG 11201600687SA SG 11201600687S A SG11201600687S A SG 11201600687SA SG 11201600687S A SG11201600687S A SG 11201600687SA
- Authority
- SG
- Singapore
- Prior art keywords
- forming
- protective film
- film
- sheet
- inspection method
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2571/00—Protective equipment
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013159997A JP6405556B2 (en) | 2013-07-31 | 2013-07-31 | Protective film forming film, protective film forming sheet and inspection method |
PCT/JP2014/052111 WO2015015817A1 (en) | 2013-07-31 | 2014-01-30 | Protective film-forming film, sheet for protective film formation, and inspection method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201600687SA true SG11201600687SA (en) | 2016-03-30 |
Family
ID=52431370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600687SA SG11201600687SA (en) | 2013-07-31 | 2014-01-30 | Protective film-forming film, sheet for forming protective film, and inspection method. |
Country Status (7)
Country | Link |
---|---|
US (1) | US10399306B2 (en) |
JP (1) | JP6405556B2 (en) |
KR (2) | KR102232369B1 (en) |
CN (2) | CN111613564A (en) |
SG (1) | SG11201600687SA (en) |
TW (2) | TWI634187B (en) |
WO (1) | WO2015015817A1 (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015111632A1 (en) * | 2014-01-22 | 2015-07-30 | リンテック株式会社 | Protective-membrane-forming film, sheet for forming protective membrane, compound sheet for forming protective membrane, and inspection method |
JP6023737B2 (en) * | 2014-03-18 | 2016-11-09 | 信越化学工業株式会社 | Wafer processed body, temporary adhesive for wafer processing, and method for manufacturing thin wafer |
JP6415383B2 (en) * | 2015-04-30 | 2018-10-31 | 日東電工株式会社 | Back surface protective film, integrated film, film, method for manufacturing semiconductor device and method for manufacturing protective chip for protecting back surface of semiconductor element |
JP2016210837A (en) * | 2015-04-30 | 2016-12-15 | 日東電工株式会社 | Rear face protective film, film, manufacturing method of semiconductor device and manufacturing method of protective chip |
JP6078581B2 (en) * | 2015-04-30 | 2017-02-08 | 日東電工株式会社 | Integrated film, film, method for manufacturing semiconductor device, and method for manufacturing protective chip |
JP6506116B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | PROTECTIVE FILM FORMING FILM, PROTECTIVE FILM FORMING SHEET, AND METHOD OF MANUFACTURING WORK OR WORK |
JP6506117B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
JP6506118B2 (en) * | 2015-06-25 | 2019-04-24 | リンテック株式会社 | Protective film-forming film, protective film-forming sheet, method of manufacturing work or workpiece, inspection method, workpiece judged to be non-defective, and workpiece judged to be non-defective |
JP2017041633A (en) * | 2015-08-17 | 2017-02-23 | 積水化学工業株式会社 | Semiconductor device and semiconductor element protective material |
JP6721325B2 (en) | 2015-12-14 | 2020-07-15 | デクセリアルズ株式会社 | Thermosetting adhesive sheet and method for manufacturing semiconductor device |
JP6818009B2 (en) * | 2016-03-04 | 2021-01-20 | リンテック株式会社 | Composite sheet for forming a protective film |
WO2017171364A2 (en) | 2016-03-28 | 2017-10-05 | 주식회사 엘지화학 | Organic solar cell module and method for manufacturing same |
WO2017188202A1 (en) | 2016-04-28 | 2017-11-02 | リンテック株式会社 | Film for forming protective film, and composite sheet for forming protective film |
JP6579996B2 (en) * | 2016-05-10 | 2019-09-25 | 日東電工株式会社 | Sheet, tape, and semiconductor device manufacturing method |
KR101860549B1 (en) * | 2016-07-22 | 2018-05-24 | (주)엠티아이 | Protected Coating composition for processing Wafer and the Coating Material manufacturing thereof |
JP6755749B2 (en) * | 2016-08-24 | 2020-09-16 | 株式会社ディスコ | Internal crack detection method |
JP6388752B1 (en) * | 2017-02-09 | 2018-09-12 | リンテック株式会社 | Curable resin film and first protective film forming sheet |
JP7025879B2 (en) * | 2017-09-29 | 2022-02-25 | リンテック株式会社 | Resin sheet |
JP6979081B2 (en) * | 2017-10-27 | 2021-12-08 | リンテック株式会社 | A method for manufacturing a protective film forming film, a protective film forming composite sheet, and a semiconductor chip. |
WO2019131850A1 (en) * | 2017-12-28 | 2019-07-04 | 日東電工株式会社 | Semiconductor back surface adhering film |
JP7211803B2 (en) * | 2018-12-21 | 2023-01-24 | 日東電工株式会社 | Semiconductor back adhesion film |
JP7139153B2 (en) * | 2018-05-29 | 2022-09-20 | 日東電工株式会社 | Back adhesion film and dicing tape integrated back adhesion film |
JP2019110343A (en) * | 2019-03-28 | 2019-07-04 | リンテック株式会社 | Film for protection film formation, sheet for protection film formation, methods for manufacturing work or workpieces, inspection method, and work and workpiece judged as acceptable items |
JP2019110342A (en) * | 2019-03-28 | 2019-07-04 | リンテック株式会社 | Film for protection film formation, sheet for protection film formation, method for manufacturing work or workpieces, inspection method, and work and workpiece judged as acceptable items |
JP6802312B2 (en) * | 2019-03-28 | 2020-12-16 | リンテック株式会社 | Method for manufacturing protective film forming film, protective film forming sheet, and workpiece or processed product |
TWI727299B (en) * | 2019-04-03 | 2021-05-11 | 奇美實業股份有限公司 | Plate unit, cutting device for cutting the same, and method for manufacturing and processing the same |
JP7326100B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326103B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326102B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
JP7326101B2 (en) | 2019-10-07 | 2023-08-15 | リンテック株式会社 | Protective film forming film and protective film forming composite sheet |
TW202141595A (en) * | 2020-02-21 | 2021-11-01 | 日商琳得科股份有限公司 | Back-surface-protection-film forming composite, method for manufacturing first laminated body, method for manufacturing third laminated body, and method for manufacturing semiconductor device equipped with back surface protection film |
CN114292541A (en) * | 2021-12-23 | 2022-04-08 | 南通纳尔材料科技有限公司 | Optically transparent anti-fouling scratch-resistant protective film composition |
CN117070173B (en) * | 2023-10-16 | 2024-01-09 | 武汉市三选科技有限公司 | Preparation method of high-performance laminated insulating adhesive film and packaging wafer |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5446055A (en) | 1977-09-19 | 1979-04-11 | Teijin Ltd | Film with selective permeability of rays |
JPH02191353A (en) | 1989-01-19 | 1990-07-27 | Toshiba Corp | Inspection of semiconductor substrate |
JPH06347417A (en) | 1993-06-14 | 1994-12-22 | Hitachi Ltd | Screening device and semiconductor device |
US5693415A (en) | 1995-06-21 | 1997-12-02 | Hanita Coatings | Composite film for windows comprising a non-stoichiometric aluminum oxide layer |
JPH0936394A (en) | 1995-07-24 | 1997-02-07 | Sony Corp | Infrared photodetector |
JP3175766B2 (en) | 1998-09-28 | 2001-06-11 | 日本電気株式会社 | Non-destructive inspection device and non-destructive inspection method |
JP4544662B2 (en) | 1999-04-30 | 2010-09-15 | 日本真空光学株式会社 | Visible light blocking infrared transmission filter |
TW502286B (en) * | 1999-12-09 | 2002-09-11 | Koninkl Philips Electronics Nv | Semiconductor device comprising a security coating and smartcard provided with such a device |
US7534498B2 (en) * | 2002-06-03 | 2009-05-19 | 3M Innovative Properties Company | Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body |
JP4341343B2 (en) * | 2002-10-04 | 2009-10-07 | 日立化成工業株式会社 | Surface protective film and manufacturing method thereof |
JP4442171B2 (en) | 2003-09-24 | 2010-03-31 | 東京エレクトロン株式会社 | Heat treatment equipment |
JP2005191283A (en) | 2003-12-25 | 2005-07-14 | Tdk Corp | Electronic device and junction inspection method of electronic device |
JP2007042810A (en) * | 2005-08-02 | 2007-02-15 | Tokyo Seimitsu Co Ltd | Work cutting method |
JP4973062B2 (en) | 2006-08-14 | 2012-07-11 | ヤマハ株式会社 | Semiconductor chip inspection method and wafer crack inspection apparatus |
JP2010034133A (en) | 2008-07-25 | 2010-02-12 | Just:Kk | Crack detecting device for polycrystalline silicon wafer |
JP2010122145A (en) | 2008-11-21 | 2010-06-03 | Takano Co Ltd | Silicon wafer defect inspection device |
JP5640051B2 (en) | 2009-01-30 | 2014-12-10 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5507102B2 (en) | 2009-03-19 | 2014-05-28 | 大日本スクリーン製造株式会社 | Heat treatment apparatus and heat treatment method |
JP2010225645A (en) | 2009-03-19 | 2010-10-07 | Dainippon Screen Mfg Co Ltd | Heat treatment apparatus |
JP5580719B2 (en) | 2009-12-24 | 2014-08-27 | 日東電工株式会社 | Dicing tape integrated semiconductor backside film |
JP5681377B2 (en) | 2010-04-20 | 2015-03-04 | 日東電工株式会社 | Manufacturing method of semiconductor device and flip chip type semiconductor device |
JP5391158B2 (en) | 2010-06-30 | 2014-01-15 | 古河電気工業株式会社 | Wafer sticking adhesive sheet and wafer processing method using the same |
JP5668344B2 (en) | 2010-07-09 | 2015-02-12 | 大日本印刷株式会社 | Back protection sheet for solar cell module |
JP5249290B2 (en) | 2010-07-20 | 2013-07-31 | 日東電工株式会社 | Flip chip type semiconductor back film, dicing tape integrated semiconductor back film, semiconductor device manufacturing method, and flip chip type semiconductor device |
JP5432853B2 (en) * | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | Dicing tape-integrated film for semiconductor back surface, manufacturing method thereof, and manufacturing method of semiconductor device |
JP5548143B2 (en) * | 2011-01-25 | 2014-07-16 | 三星ダイヤモンド工業株式会社 | LED chip manufacturing method |
JP5592811B2 (en) | 2011-01-27 | 2014-09-17 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5743638B2 (en) | 2011-03-28 | 2015-07-01 | リンテック株式会社 | Protective film forming film and chip protective film forming sheet |
JP5727835B2 (en) | 2011-03-30 | 2015-06-03 | リンテック株式会社 | Protective film forming film, protective film forming sheet and semiconductor chip manufacturing method |
US8575758B2 (en) | 2011-08-04 | 2013-11-05 | Texas Instruments Incorporated | Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies |
JP5865045B2 (en) | 2011-12-07 | 2016-02-17 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP6034019B2 (en) | 2011-12-21 | 2016-11-30 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP5544052B2 (en) | 2011-12-26 | 2014-07-09 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
JP6006936B2 (en) * | 2011-12-26 | 2016-10-12 | リンテック株式会社 | Dicing sheet with protective film forming layer and chip manufacturing method |
-
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KR20160037174A (en) | 2016-04-05 |
KR102232369B1 (en) | 2021-03-25 |
TWI634187B (en) | 2018-09-01 |
JP2015032644A (en) | 2015-02-16 |
TW201510158A (en) | 2015-03-16 |
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