TWI727299B - Plate unit, cutting device for cutting the same, and method for manufacturing and processing the same - Google Patents

Abstract

A plate unit is provided. The plate unit comprises a substrate and a first protective film. The substrate has a first substrate surface, a second substrate surface and a substrate side. The substrate side is between the first substrate surface and the second substrate surface. The first protective film is on the first substrate surface and has a first film side. The substrate side and the first film side are at the same side of the plate unit, and the substrate side is on the outside of the first film side and has a distance from the first film side. The distance is from 0.1mm to 5mm.

Description

Plate unit, cutting device for cutting it, and its manufacturing and processing method

The present invention relates to a sheet unit, and more particularly to a sheet unit including a protective film and a substrate, a cutting device for cutting the sheet unit, and manufacturing and processing methods thereof.

When cutting a sheet with a protective film, the cutting tool can easily pull the protective film, causing the edge of the protective film to be lifted off, so that the debris generated during the cutting process easily enters the lift film area, causing the production of the sheet Poor quality increases the complexity of subsequent processing processes. In addition, in the process of transporting and stacking the plates, the debris in the lifting area is likely to scratch or crush the protective film surface of the plates, reducing the protective effect of the protective film. Therefore, the current plate cutting process has the problems of hiding chips, lifting film, burrs, and crushing.

The invention provides a plate unit that can improve the conventional problems of chip hiding, film lifting, burrs, and crushing, thereby improving the quality of the plate unit.

According to the first aspect of the present invention, a board unit is provided. The plate unit includes a substrate and a first protective film. The substrate has a first substrate surface, a second substrate surface, and a substrate side, and the substrate side is between the first substrate surface and the second substrate surface. The first protective film is located on the surface of the first substrate and has a first film side. The side of the substrate and the side of the first film are located on the same side of the sheet unit, and the side of the substrate is located outside of the side of the first film and a distance from the side of the first film, and the distance is between 0.1 and 5 mm.

According to another aspect of the present invention, a cutting device for a plate unit is provided. The cutting device of the plate unit is used to cut a plate to obtain the plate unit according to the first aspect of the present invention. The board includes a base material and a first protective layer. The cutting device includes a supporting table, two film cutting knives and a cutting saw. The support table has an opening, and the ratio of the size of the opening to the thickness of the plate unit is less than or equal to 4.5. The second film cutter is used to cut the first protective layer of the plate. The cutting saw is used for cutting the board after the two film knives cut the first protective layer.

According to another aspect of the present invention, a method for manufacturing a plate unit is provided. The manufacturing method includes the following steps: providing a board; and using a cutting device to cut the board to obtain the board unit according to the first aspect of the present invention.

According to another aspect of the present invention, a method for processing a plate unit is provided. This processing method includes the following steps: cutting, polishing, or a combination of the above processing on the plate unit described in the first aspect of the present invention.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

100: sheet unit

100’: Plate

110: substrate

110s1: the first substrate surface

110s2: second substrate surface

110’: Substrate

111: substrate side

120: The first protective film

120’: The first protective layer

120a’: The first protective layer of the separated part

121: side of the first film

130: second protective film

130’: The second protective layer

131: second film side

200: Cutting device

210: support table

211: open

220: film cutting knife

230: cutting saw

A1: Direction

D1: Spacing

Figure 1 is a schematic side view of a plate unit according to an embodiment of the present invention.

FIG. 1A is a schematic top view of a plate unit according to another embodiment of the present invention.

Figure 2 is a schematic side view of a plate unit according to another embodiment of the present invention.

Fig. 3 is a schematic side view of the manufacturing method and cutting device of the plate unit related to the embodiment of the present invention.

FIG. 3A is a schematic side view of the manufacturing method of the plate unit in FIG. 3. FIG.

FIG. 4 is a schematic side view of a method for manufacturing a plate unit and a cutting device according to another embodiment of the present invention.

FIG. 4A is a schematic side view of the manufacturing method of the plate unit in FIG. 4. FIG.

Fig. 5 is a schematic top view of the manufacturing method and cutting device of the sheet unit in the embodiments of Figs. 3 and 4;

First of all, it should be noted that this disclosure does not show all possible embodiments, and other implementation aspects not mentioned in this disclosure may also be applicable. Furthermore, the size ratios in the drawings are not drawn in proportion to the actual products. Therefore, the contents of the description and the illustrations are only used to describe the embodiments, rather than to limit the protection scope of this disclosure. In addition, the descriptions in the embodiments, such as detailed structures, detailed steps, etc., are for illustrative purposes only, and do not limit the scope of the disclosure to be protected. The steps of the embodiments and the details of each structure can be changed and modified according to the needs of the actual application process without departing from the spirit and scope of the present disclosure. In the following, the same/similar symbols represent the same/similar elements for description.

Please refer to FIG. 1 of the drawings. A sheet unit 100 according to an embodiment of the present invention includes a substrate 110 and a first protective film 120. The substrate 110 has a first substrate surface 110s1, a second substrate surface 110s2, and a substrate side 111. The substrate side 111 is located between the first substrate surface 110s1 and the second substrate surface 110s2. The first protective film 120 is located on the surface of the first substrate There is a first film side 121 on the surface 110s1. The substrate side 111 and the first film side 121 are located on the same side of the sheet unit 100, and the substrate side 111 is located outside the first film side 121 and is spaced from the first film side 121 by a distance D1.

In detail, the first film side 121 of the first protective film 120 is not aligned with the substrate side 111 of the substrate 110. The first film side 121 of the first protective film 120 is opposite to the substrate side 111 of the substrate 110. Shrink some distance. It should be noted that the distance D1 in the embodiment of the present invention can be formed at least on any side of the plate unit 100; or can also be formed around the plate unit 100, that is, on each side of the plate unit 100, the first protective film 120 A film side 121 is retracted from the substrate side 111 of the substrate 110 by a certain distance. For example, in an embodiment shown in FIG. 1A of the drawing, on the four sides of the sheet unit 100, each first film side 121 of the first protective film 120 and each substrate side 111 of the corresponding substrate 110 There is a distance D1 between them.

Please refer to FIG. 2 of the drawing. In another embodiment, the plate unit 100 includes a substrate 110, a first protective film 120 and a second protective film 130. The substrate 110 has a first substrate surface 110s1, a second substrate surface 110s2, and a substrate side 111. The substrate side 111 is located between the first substrate surface 110s1 and the second substrate surface 110s2. The first protective film 120 is located on the surface 110s1 of the first substrate and has a first film side 121. The substrate side 111 and the first film side 121 are located on the same side of the sheet unit 100, and the substrate side 111 is located outside the first film side 121 and is spaced from the first film side 121 by a distance D1. The second protective film 130 is located on the surface 110s2 of the second substrate and has a second film side 131. The substrate side 111 and the second film side 131 are located on the same side of the sheet unit 100, and the second film side 131 is aligned with the substrate side 111, that is, the distance between the second film side 131 and the substrate side 111 is 0 mm. It should be noted that the spacing D1 in this embodiment can be formed at least on any side of the plate unit 100; or can also be formed around the plate unit 100, that is, on the plate On each side of the material unit 100, the first film side 121 of the first protective film 120 is retracted from the substrate side 111 of the substrate 110 by a certain distance.

In one embodiment, the distance D1 is between 0.1 and 5 mm. In another embodiment, the distance D1 is between 0.3-5 mm. In another embodiment, the distance D1 is between 0.1 and 2.5 mm. In another embodiment, the distance D1 is between 0.3 and 2.5 mm. In another embodiment, the distance D1 is between 0.1 and 1.5 mm. In another embodiment, the distance D1 is between 0.3 and 1.5 mm. In another embodiment, the distance D1 is between 0.1 mm and 0.8 mm. In another embodiment, the distance D1 is between 0.3 mm and 0.8 mm. In another embodiment, the distance D1 is between 0.1 and 0.5 mm. In another embodiment, the distance D1 is between 0.3 mm and 0.5 mm. In another embodiment, the distance D1 is between 0.1 and 0.4 mm. In another embodiment, the distance D1 is between 0.3 and 0.4 mm.

In an embodiment, the substrate 110 may be at least one of a styrenic polymer, an acrylate polymer, an olefin polymer, a cyclic olefin polymer, an ionomer, or other polymers Formed. The above-mentioned styrenic polymers include, but are not limited to, methyl methacrylate-styrene copolymer (MS), polystyrene (PS), acrylonitrile-styrene copolymer (AS), acrylonitrile-butadiene-benzene Ethylene copolymer (ABS) and acrylonitrile-styrene-acrylate copolymer (ASA). The above-mentioned acrylate-based polymers include, but are not limited to, polymethyl methacrylate (PMMA). The aforementioned olefin polymers include, but are not limited to, polyethylene (PE) and polypropylene (PP). The aforementioned cyclic olefin polymers include, but are not limited to, copolymers of ethylene and norbornene. The ionomer described above includes but is not limited to polystyrene sulfonate. The other polymers mentioned above include but are not limited to polyethylene terephthalate (PET), polyvinyl chloride (PVC) and polycarbonate (PC). In another embodiment, the substrate 110 is preferably made of methyl methacrylate-styrene copolymer (MS), polystyrene (PS), or polymethyl methacrylate (PMMA). Or polycarbonate (PC) formed. In another embodiment, the substrate 110 is more preferably formed of methyl methacrylate-styrene copolymer (MS), polymethyl methacrylate (PMMA) or polycarbonate (PC). In another embodiment, the substrate 110 may be formed of the aforementioned materials, for example, a single-layer board, a double-layer board, a multi-layer board, or a composite board. In an embodiment, the first protective film 120 or the second protective film 130 may be polyvinyl chloride (PVC), polyethylene (PE), polypropylene (PP) or polyethylene terephthalate (PET). Formed by at least one of. In another embodiment, the first protective film 120 or the second protective film 130 is preferably formed of polyethylene (PE) or polypropylene (PP). In another embodiment, the first protective film 120 or the second protective film 130 is more preferably formed of polyethylene (PE). In another embodiment, the first protective film 120 or the second protective film 130 may be formed of the aforementioned materials, for example, a single-layer protective film or a multi-layer protective film.

In an embodiment, the thickness of the plate unit 100 is between 0.3 mm and 6 cm. In another embodiment, the thickness of the plate unit 100 is between 0.4 and 4 mm. In another embodiment, the thickness of the plate unit 100 is between 1.5-3 mm. In another embodiment, the thickness of the plate unit 100 is between 1.5 mm and 2.5 mm. In another embodiment, the thickness of the plate unit 100 is between 0.3 mm and 0.7 mm. In another embodiment, the thickness of the plate unit 100 is between 0.5 mm and 0.8 mm.

Please refer to FIGS. 3, 3A and 5 of the drawings, which illustrate a method for manufacturing a plate unit 100 and a cutting device 200 according to an embodiment of the present invention. The cutting device 200 includes a supporting table 210, two film cutting knives 220 and a cutting saw 230, wherein the supporting table 210 has an opening 211. In one embodiment, the two film cutting knives 220 and the cutting saw 230 are arranged within the distance range of the opening 211, the cutting saw 230 is located within the distance range between the two film cutting knives 220, and the two film cutting knives 220 are along the Z axis. The direction is set in front of the cutting saw 230. In one embodiment, the second film cutter 220 is a blade with a disc-shaped structure, a single piece and a toothed edge In the form of a plate, two plate-shaped blades arranged at intervals, or a serrated blade. In an embodiment, the cutting saw 230 is a saw-toothed saw blade.

The manufacturing method of the plate unit 100 includes: providing a plate 100', which includes a base material 110' and a first protective layer 120', wherein the plate 100' is provided on the support table 210 of the cutting device 200. Next, the cutting device 200 is used to cut the sheet material 100' to obtain the sheet material unit 100 in the embodiment shown in FIG. In an embodiment, the plate 100' may be, for example, a light guide plate, a diffuser plate, a cover plate, or building materials. The light guide plate can control the scattering direction of light. The above-mentioned diffuser can uniformly diffuse the light. The above-mentioned cover plate is, for example, a front cover of a mobile phone, a back plate of a mobile phone or a cover plate of a car panel. The above-mentioned building materials are, for example, indoor or outdoor decorations to enhance the beauty and use functions of the building. In another embodiment, the thickness of the light guide plate is between 0.4 and 3 mm. In another embodiment, the thickness of the diffuser plate is between 0.5 mm and 2.5 mm. In another embodiment, the thickness of the cover plate is between 0.5-2 mm. In another embodiment, the thickness of the building material is between 4 mm and 6 cm.

In an embodiment, when the cutting device 200 moves along a direction A1 on the Z axis, the two film cutting knives 220 will contact the sheet 100' and cut the first protective layer 120' of the sheet 100'. Next, the cutting saw 230 contacts the board 100' and cuts the board 100' after the first protective layer 120' is cut by the second film cutter 220, so as to obtain the aforementioned board unit 100. Since the second film cutter 220 has already cut the first protective layer 120' first, and cut out the separated part of the first protective layer 120a', and the cutting saw 230 corresponds to the separated part of the first protective layer 120a' During cutting, the cutting saw 230 will not pull the first protective layer 120' when cutting the sheet 100'.

It should be noted that in the step of using the cutting device 200 to cut the sheet material 100', the position of the cutting device 200 can also be fixed so that the sheet material 100' moves in a direction opposite to the direction A1 on the Z axis, that is, The sheet 100' moves toward the cutting device 200 for cutting. The present invention is not limited to this, as long as both the cutting device 200 and the plate 100' can move relatively during the cutting process. In addition, the cutting device 200 of the present invention can cut the plate 100' along the direction A1, and can also cut vertically. Cut the sheet 100' straight in the direction A1. In addition, the second film cutting knife 220 is not limited to being arranged in front of the cutting saw 230 along the Z-axis direction, as long as the second film cutting knife 220 first cuts the sheet 100' before the cutting saw 230 cuts the sheet 100'. The protective layer 120' can be cut.

In the above description, the cutting saw 230 of the cutting device 200 rotates and cuts from top to bottom, that is, due to the rotation direction of the cutting saw 230, the cutting saw 230 is relative to the first protective layer in a top-down direction. 120' performs cutting. Therefore, the first protective layer 120' located below is easily pulled by the cutting saw 230, so the second film cutter 220 is preferably installed under the sheet 100'. Assuming that the rotation direction of the cutting saw 230 is opposite, and the arrangement of the plate 100' is upside down, the first protective layer 120' located above is easily pulled and lifted off by the cutting saw 230, and the second film cutter 220 is installed It is better to be above the board 100', and the illustration will not be matched.

In addition, it should be noted that the size of the opening 211 of the support table 210 needs to be greater than the distance between the two film cutting knives 220, so that the two film cutting knives 220 can pass through the opening 211 to the first protective layer 120' of the plate 100' Perform cutting. In an embodiment, the size of the opening 211 of the support platform 210 is greater than or equal to 1 mm. In addition, it has been found through experiments that the size of the opening 211 of the support table 210 should be less than or equal to 9mm to prevent the opening 211 from being too large (for example, greater than 9mm), resulting in fewer supported parts of the board 100', resulting in the cutting process of the cutting saw 230 , The amplitude of the up and down vibration of the plate 100' is increased, which makes the plate 100' more powerful when it collides with the cutting saw 230. Therefore, the cutting surface of the plate 100' will be broken to produce irregular lumps with large particles. Irregular lumps may damage or crush the plate units 100 stacked and transported. In addition, the cut surface of the irregular block with large particles is prone to cracks extending toward the interior or surface of the plate unit 100. In addition, the cut surface of the irregular block with large particles has a stress concentration problem, which makes the plate unit 100 easy to break during the subsequent processing. In another embodiment, the size of the opening 211 of the support table 210 is between 1 and 9 mm. In another embodiment, the size of the opening 211 of the supporting table 210 is between 6 and 9 mm. In another embodiment, the opening of the support table 210 The size of the mouth 211 is between 7 and 8 mm. In another embodiment, the size of the opening 211 of the support table 210 is between 2 mm and 3 mm.

In addition, the ratio of the size of the opening 211 of the support table 210 to the thickness of the plate unit 100 (ie, the size of the opening 211 of the support table 210 divided by the thickness of the plate unit 100) may be less than or equal to 4.5. In another embodiment, the ratio of the size of the opening 211 of the support platform 210 to the thickness of the plate unit 100 is less than or equal to 4. In another embodiment, the ratio of the size of the opening 211 of the support platform 210 to the thickness of the plate unit 100 is less than or equal to 3.5. If the above ratio is too large, it means that the opening 211 is too large, the part of the plate 100' being protected is less, and the plate 100' is too thin, resulting in a large vibration during the cutting process, causing the cutting saw 230 and the plate 100' to collide with each other Since the cutting surface is easily broken to produce large irregular masses (diameter greater than 1 mm), which can damage or crush the stacked plate unit 100. In addition, the cut surface where large irregular masses are generated is not only prone to cracks extending toward the surface or the inside, but also prone to stress concentration problems, which makes the plate unit 100 easy to crack during subsequent processing.

In addition, in an embodiment, the ratio of the distance D1 to the thickness of the plate unit 100 (ie, the distance D1 divided by the thickness of the plate unit 100) is greater than or equal to 0.05 and less than or equal to 2.5. In another embodiment, the ratio of the distance D1 to the thickness of the plate unit 100 is greater than or equal to 0.15 and less than or equal to 1. If the above ratio is too large, it means that the distance D1 is too large, which causes the size of the opening 211 of the support table 210 to increase accordingly, and the part of the plate 100' to be protected becomes less, and the plate 100' is too thin, which is easy to cut during the cutting process. A large-scale vibration is generated, which makes the cutting saw 230 and the board 100' more powerful, so the cutting surface is easily broken to produce large irregular blocks (diameter greater than 1mm), which will damage or crush the stacked board units 100. In addition, the cut surface where large irregular masses are generated is not only prone to cracks extending toward the surface or inside, but also prone to stress concentration problems, which makes the plate unit 100 easy to crack during subsequent processing. In addition, if the above ratio is too small, it means that the distance D1 is too small, and the distance between the two film cutters 220 is small, so the first part of the separated part can be cut out. The protective layer 120a' has a small range, and because the sheet 100' is too thick, a thicker cutting saw 230 is needed for cutting, and the cutting saw 230 is prone to offset in the subsequent cutting process, resulting in the cutting saw 230 not being completely The first protective layer 120a' corresponding to the separated part is cut, so the cutting saw 230 is still easy to lift the first protective film 120 and cause the protective film to be lifted, resulting in serious hidden debris, lifted film, burrs, crushing, etc. problem.

In addition, referring to FIGS. 4, 4A, and 5 of the drawings, in another embodiment of the method for manufacturing the plate unit 100, the provided plate 100' may include a substrate 110', a first protective layer 120', and A second protective layer 130'. The plate 100' is provided on a supporting table 210 of a cutting device 200, and the supporting table 210 has an opening 211. Next, similar to the manufacturing method of the foregoing embodiment, the cutting device 200 is used to cut the board 100' to obtain the board unit 100 in the embodiment shown in FIG. The features of the above-mentioned cutting device 200 are similar to those of the previous embodiment, and will not be repeated here.

In this embodiment, when the cutting device 200 moves along a direction A1 on the Z axis, the second film cutter 220 will contact the sheet 100' and cut the first protective layer 120' of the sheet 100'. Next, the cutting saw 230 contacts the sheet 100' after the first protective layer 120' is cut by the second film cutter 220 and cuts the sheet 100' to obtain the aforementioned sheet unit 100. Since the second film cutter 220 has already cut the first protective layer 120' first, and cut out the separated part of the first protective layer 120a', and the cutting saw 230 corresponds to the separated part of the first protective layer 120a' During cutting, the cutting saw 230 will not pull the first protective layer 120' when cutting the sheet 100'. It should be noted that the direction of rotation of the cutting saw 230 makes the direction of movement of the cutting saw 230 relative to the second protective layer 130' from top to bottom. At this time, there is a substrate 110 under the second protective layer 130'. 'Support, so when the cutting saw 230 cuts the second protective layer 130', the second protective layer 130' will not be pulled to lift the film, and the second film side 131 of the second protective film 130 of the obtained sheet unit 100 The substrate side 111 of the substrate 110 can be aligned.

In the above description, the cutting saw 230 of the cutting device 200 rotates from top to bottom for cutting, that is, the direction of rotation of the cutting saw 230 makes the cutting saw 230 relative to the first protective layer 120' The direction of movement is from top to bottom. Therefore, the first protective layer 120' located below is easy to be pulled by the cutting saw 230. Therefore, the second film cutter 220 is preferably installed below the sheet 100'. Assuming that the direction of rotation of the cutting saw 230 is opposite, at this time the upper second protective layer 130' is easily pulled or lifted off by the cutting saw 230, the second film cutter 220 is better to be installed on the top of the sheet 100' and no longer cooperates. Schematic description. In addition, the present invention is not limited to this, and the cutting device 200 may also include two two film cutting knives 220 arranged up and down to respectively cut the first protective layer 120' and the second protective layer 130'.

In addition to the above-mentioned features, the cutting device 200 of the present application can also be as disclosed in the cutting device in Taiwan Patent I496668, which is incorporated herein by reference. In addition to the above-mentioned features, the manufacturing method of the plate unit 100 of the present application may also adopt the manufacturing method disclosed in Taiwan Patent I496668, which is incorporated herein by reference.

Please refer to Table 1, which lists the embodiments and comparative examples of the present invention. Among them, the thickness of the plate unit in the example in Table 1 and the comparison is 2 mm.

Please refer to Table 2, which lists examples in which the ratio of the size of the opening of the support table to the thickness of the plate unit in the embodiments of the present invention is less than or equal to 4.5, and comparative examples outside the above range.

The substrate 110 of the embodiment in Table 1 and Table 2 is formed of polymethyl methacrylate (PMMA), the first protective film 120 is formed of polyethylene (PE), and the second protective film 130 is formed of polyethylene ( PE) formed. As shown in Table 1, since the distance D1 of Comparative Example 1 is small, which means that the distance between the two film cutters 220 is small, the separated part of the first protective layer 120a' can be cut out. The range of the cutting saw 230 is small, and the cutting saw 230 is prone to offset during the subsequent cutting process, resulting in the cutting saw 230 not completely corresponding to the separated part of the first protective layer 120a' for cutting, so the cutting saw 230 is still easy to lift the first protective layer. A protective film 120 causes the protective film to be lifted, which further causes serious problems such as hiding debris, lifting the film, burrs, and crushing. In contrast, in Table 1, the embodiment with the distance D1 equal to or greater than 0.1 mm has a larger distance between the two film cutters 220, so the range of the first protective layer 120a' that can cut the separated part is larger. Therefore, even if the cutting saw 230 is offset in the subsequent cutting process, the cutting saw 230 can still cut the part of the first protective layer 120a' that has been separated, so the cutting saw 230 does not lift the first protective film 120 and can improve Or even completely avoid the problems of hiding chips, film lifting, burrs, crushing, etc. during the cutting process of the plate unit, thereby improving the quality of the plate unit.

It should be noted that in Comparative Examples 2 to 3 in Table 1 where the distance D1 is greater than 5 mm, the distance D1 becomes larger, so the distance between the two film knives 220 also needs to be increased, so that the opening 211 of the support table 210 is also increased. It needs to be enlarged accordingly (for example, greater than 9mm), but the opening 211 is too large, resulting in fewer parts of the plate 100' being supported. As a result, during the cutting process of the cutting saw 230, the amplitude of the up and down vibration of the plate 100' becomes larger, making the plate The impact of 100' on the cutting saw 230 is stronger, so the cutting surface will be broken to produce large irregular lumps (diameter greater than 1mm), and these large irregular lumps will not only in the plate unit 100 in the subsequent During stacking and transportation, the plate unit 100 is severely damaged or crushed, and the cracked part of the cutting surface has a stress concentration problem, which makes the plate unit 100 easy to break during subsequent processing (such as cutting or polishing). In addition, the fractured part of the cutting surface is also prone to cracks extending toward the inside of the plate unit 100. Compared with Comparative Examples 2 to 3 in Table 1, the distance D1 of Comparative Example 1 and Examples 1 to 10 in Table 1 is smaller, so the distance between the two film cutters 220 can be reduced, and the opening 211 of the support table 210 is also The size of the opening 211 will become smaller, which will increase the number of supported parts of the plate 100'. Therefore, during the cutting process of the cutting saw 230, the amplitude of the up and down vibrations of the plate 100' will be smaller, causing the plate 100' to collide with the cutting saw. 230 The power becomes weaker, so the cutting surface can produce smaller-sized irregular lumps (for example, small irregular lumps with a diameter of less than 0.3mm or medium-grained irregular lumps with a diameter of 0.3~1mm) , It can improve or even not damage or crush the stacked plate unit 100 at all, and there is no problem of cracks or easy breakage in the subsequent processing.

In addition, compared with Comparative Examples 2 and 3 in Table 1, the distance D1 between Examples 1 to 10 in Table 1 is smaller, so that the ratio of the distance D1 to the thickness of the plate unit 100 is less than or equal to 2.5, and the opening 211 of the support table 210 As the distance D1 decreases, the part of the board 100' that is protected becomes more, and the vibration amplitude generated during the cutting process becomes smaller, which can reduce the force of the cutting saw 230 and the board 100' to collide with each other, so the cutting surface is not only It is less prone to produce large and irregular lumps, and it is also less prone to cracks or breakage during subsequent processing. In addition, compared with Comparative Example 1 in Table 1, the distance D1 between Examples 1 to 10 in Table 1 is larger, so that the ratio of the distance D1 to the thickness of the sheet unit 100 is greater than or equal to 0.05, and the distance between the two film cutters 220 Also as the distance D1 becomes larger, the range of the first protective layer 120a' that can be cut out of the separated part is larger. Even if the cutting saw 230 is offset in the subsequent cutting process, the cutting saw 230 can still correspond to the separated part. Part of the first protective layer 120a' is cut so that the cutting saw 230 will not lift the first protective film 120 and further improve or even no hidden debris, lifted film, burrs, crushing and other problems.

In addition, according to the content of Table 1, because the plate unit 100 of Comparative Example 1 of Table 1 (the pitch D1 is less than 0.1mm) has serious problems such as hiding chips, lifting film, burrs, crushing, etc., it needs to be cut and polished. Post-processing can be applied to downstream products (such as but not limited to displays, electronic product back covers, rain shelters, lighting hoods or aquariums). If the spacing D1 of the plate unit 100 is between 0.1 and 0.5 mm (Examples 1 to 4 in Table 1), only polishing can be applied to downstream products in the post-processing treatment, which can save a post-cutting process , Thereby reducing production costs. In Examples 5 to 10 and Comparative Examples 2 to 3 in Table 1, when the pitch D1 of the plate unit 100 is greater than 0.5 mm, it indicates the base The range of the board 110 that is not protected by the first protective film 120 has increased. Because the unprotected parts of the substrate 110 are easily damaged or crushed during the stacking and transportation process, it still needs to undergo post-processing such as cutting and polishing before it can be applied. Downstream products.

In addition, as shown in Table 2, in Examples 3, 5, 7, 9, 11 to 16, the distance D1 is small, so the opening 211 of the support table 210 can also be reduced accordingly, so that the support table The ratio of the size of the opening 211 of the 210 to the thickness of the plate unit 100 decreases, which means that the part of the plate 100' that is protected becomes more, and the plate 100' is thicker, and the vibration amplitude generated during the cutting process is smaller, which can reduce the cutting The force of the impact between the saw 230 and the plate 100' can produce smaller irregular blocks on the cutting surface (for example, small irregular blocks with a diameter of less than 0.3mm or medium-size blocks with a diameter of 0.3~1mm). Irregular lumps) can improve or even not damage or crush the stacked plate unit 100 at all, and there is no problem of cracks or easy breakage in subsequent processing. Compared with the embodiment in Table 2, the distance D1 of Comparative Examples 2 to 4 in Table 2 is larger, so the opening 211 of the support table 210 also needs to be enlarged accordingly, so that the size of the opening 211 of the support table 210 is the same as that of the plate unit 100. The increase in the ratio of thickness means that the part of the board 100' that is protected is less, and the board 100' is too thin, resulting in a large vibration during the cutting process, which makes the cutting saw 230 and the board 100' stronger to collide with each other. The cutting surface is not only easy to break to produce large-size irregular blocks, which may damage or crush the stacked plate unit 100, but also easy to crack, and even breaks easily during subsequent processing.

In addition, in an embodiment, the processing method of the plate unit 100 includes the following steps: cutting the plate unit 100. In another embodiment, the processing method of the plate unit 100 includes the following steps: polishing the plate unit 100. In another embodiment, the processing method of the plate unit 100 includes the following steps: cutting and polishing the plate unit 100. Sheet unit 100 The above processing method can be applied to downstream products (such as but not limited to displays, electronic product back covers, rain shelters, lighting hoods or aquariums).

In summary, the first protective layer of the board is cut by two film cutters, and then the board is cut by a cutting saw to obtain the board units of the foregoing embodiments of the present invention, wherein the board of the board of these board units is passed through The side edge is located on the outside of the first film side edge of the first protective film and is at a distance between 0.1~5mm, thereby improving the hiding of debris, lifting film, burrs, and burrs during the cutting process of the conventional sheet unit. Problems such as crushing can improve the quality of the plate unit to facilitate the subsequent process application of the plate unit.

To sum up, although the present invention has been disclosed as above by embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to those defined by the attached patent scope.

100: sheet unit

110: substrate

110s1: the first substrate surface

110s2: second substrate surface

111: substrate side

120: The first protective film

121: side of the first film

D1: Spacing

Claims (11)

A plate unit, comprising: a substrate suitable for cutting with a cutting saw, having a first substrate surface, a second substrate surface and a substrate side, the substrate side being on the first substrate surface and the second substrate surface Between the surfaces of the substrates, where the substrate is at least one of styrene polymers, acrylate polymers, olefin polymers, cyclic olefin polymers, ionomers or other polymers Is formed, wherein the substrate is basically composed of a light guide plate, a diffuser plate or a cover plate; a first protective film located on the surface of the first substrate and having a first film side; and a second protective film located on The second substrate has a second film side on the surface; wherein the substrate side and the second film side are located on the same side of the plate unit, and the second film side is aligned with the substrate side; wherein , The side of the substrate and the side of the first film are located on the same side of the plate unit, the side of the substrate is located outside the side of the first film and a distance from the side of the first film, the distance is between 0.1 ~0.4mm, and the ratio of the spacing to the thickness of the plate unit is greater than or equal to 0.15 and less than or equal to 1. As described in the first item of the scope of patent application, the substrate is made of methyl methacrylate-styrene copolymer (MS), polystyrene (PS), polymethyl methacrylate (PMMA) or polymethylmethacrylate (PMMA). Formed by at least one of carbonates (PC). The sheet unit described in item 1 of the scope of patent application, wherein the first protective film or the second protective film is at least one of polyvinyl chloride, polyethylene, polypropylene, or polyethylene terephthalate Formed. For the sheet unit described in item 1 of the scope of patent application, when the sheet unit is a light guide plate, the thickness of the sheet unit is between 0.4mm and 3mm; when the sheet unit is a cover plate, the thickness of the sheet unit is Between 0.5mm~2mm. For the sheet unit described in item 1 of the scope of patent application, the spacing is between 0.3mm~0.4mm. A cutting device for a sheet unit is used to cut a sheet to obtain a sheet unit as described in item 1 of the scope of patent application, wherein the sheet includes a base material and a first protective layer, and the cutting device includes: A support table has an opening, wherein the ratio of the size of the opening to the thickness of the plate unit is less than or equal to 4.5; two film cutters are used to cut the first protective layer; and a cutting saw is used to cut the two After the film cutter cuts the first protective layer, the board is cut. For the cutting device of the sheet unit described in item 6 of the scope of patent application, the size of the opening is less than or equal to 9mm. A method for manufacturing a plate unit includes: providing a plate, the plate including a base material and a first protective layer; and A cutting device is used to cut the board to obtain a board unit as described in item 1 of the scope of patent application, wherein the cutting device includes a cutting saw for cutting the board. The method for manufacturing a plate unit according to item 8 of the scope of patent application, wherein the cutting device includes a support table having an opening, and the ratio of the size of the opening to the thickness of the plate unit is less than or equal to 4.5 . According to the manufacturing method of the plate unit described in item 8 of the scope of patent application, the cutting device includes a support table, the support table has an opening, and the size of the opening is less than or equal to 9 mm. A method for processing a plate unit includes: cutting, polishing, or a combination of the above processing treatments on the plate unit as described in item 1 of the scope of the patent application.

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