TWI790400B - 保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法 - Google Patents

保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法 Download PDF

Info

Publication number
TWI790400B
TWI790400B TW108131209A TW108131209A TWI790400B TW I790400 B TWI790400 B TW I790400B TW 108131209 A TW108131209 A TW 108131209A TW 108131209 A TW108131209 A TW 108131209A TW I790400 B TWI790400 B TW I790400B
Authority
TW
Taiwan
Prior art keywords
protective film
film
forming
meth
semiconductor wafer
Prior art date
Application number
TW108131209A
Other languages
English (en)
Chinese (zh)
Other versions
TW202025264A (zh
Inventor
小橋力也
中石康喜
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202025264A publication Critical patent/TW202025264A/zh
Application granted granted Critical
Publication of TWI790400B publication Critical patent/TWI790400B/zh

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW108131209A 2018-09-11 2019-08-30 保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法 TWI790400B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-169591 2018-09-11
JP2018169591 2018-09-11

Publications (2)

Publication Number Publication Date
TW202025264A TW202025264A (zh) 2020-07-01
TWI790400B true TWI790400B (zh) 2023-01-21

Family

ID=69776737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108131209A TWI790400B (zh) 2018-09-11 2019-08-30 保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法

Country Status (6)

Country Link
JP (1) JP6686241B1 (ko)
KR (1) KR102596665B1 (ko)
CN (1) CN112154536B (ko)
SG (1) SG11202012966XA (ko)
TW (1) TWI790400B (ko)
WO (1) WO2020054355A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202138510A (zh) * 2020-03-27 2021-10-16 日商琳得科股份有限公司 半導體裝置製造用片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
TW201532837A (zh) * 2014-01-08 2015-09-01 Lintec Corp 保護膜形成用複合薄片

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP3841060B2 (ja) * 2003-04-03 2006-11-01 松下電器産業株式会社 半導体装置およびその製造方法
JP2007193271A (ja) * 2006-01-23 2007-08-02 Lintec Corp 防眩性フィルムの製造方法及び防眩性フィルム
JP5124778B2 (ja) 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
CN106415819A (zh) * 2014-01-22 2017-02-15 琳得科株式会社 保护膜形成膜、保护膜形成用片、保护膜形成用复合片及检查方法
CN107615454B (zh) * 2015-06-05 2020-12-18 琳得科株式会社 保护膜形成用复合片
WO2017149926A1 (ja) * 2016-03-04 2017-09-08 リンテック株式会社 半導体加工用シート
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
TW201532837A (zh) * 2014-01-08 2015-09-01 Lintec Corp 保護膜形成用複合薄片

Also Published As

Publication number Publication date
WO2020054355A1 (ja) 2020-03-19
SG11202012966XA (en) 2021-02-25
TW202025264A (zh) 2020-07-01
JP6686241B1 (ja) 2020-04-22
CN112154536B (zh) 2024-09-17
KR20210057703A (ko) 2021-05-21
JPWO2020054355A1 (ja) 2020-10-22
CN112154536A (zh) 2020-12-29
KR102596665B1 (ko) 2023-11-01

Similar Documents

Publication Publication Date Title
TWI733870B (zh) 保護膜形成用複合片
JP6298226B1 (ja) 保護膜形成用複合シート
WO2017145938A1 (ja) 保護膜形成用シート、保護膜形成用シートの製造方法及び半導体装置の製造方法
TWI743361B (zh) 樹脂膜形成用膜以及樹脂膜形成用複合片
TW202106502A (zh) 保護膜形成用複合片
TWI790400B (zh) 保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法
TWI764885B (zh) 保護膜形成用複合片
WO2019186990A1 (ja) 支持シート及び保護膜形成用複合シート
CN108778721B (zh) 保护膜形成用复合片
JP7478524B2 (ja) 保護膜形成用フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法
TWI788543B (zh) 支撐片及保護膜形成用複合片
TWI796297B (zh) 保護膜形成用複合片
TWI782911B (zh) 保護膜形成用膜及其處理方法、以及保護膜形成用複合片
JPWO2019186994A1 (ja) 保護膜形成用複合シート及びその製造方法
JP7387510B2 (ja) 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜形成フィルム付きワークの搬送方法
JP7465099B2 (ja) 保護膜形成用複合シート、及び保護膜付きチップの製造方法
JP7495355B2 (ja) 保護膜形成用複合シート、及び半導体チップの製造方法
CN108701597B (zh) 保护膜形成用复合片
JP6410386B1 (ja) 支持シート及び保護膜形成用複合シート
TW202239602A (zh) 保護膜形成膜、保護膜形成用複合片、具保護膜之工件加工物的製造方法、以及具保護膜之工件的製造方法
TW202237770A (zh) 保護膜形成膜、保護膜形成用複合片、以及晶圓之再生方法
TW202339960A (zh) 保護膜形成膜、保護膜形成用複合片、套件、以及保護膜形成膜之使用
TW202348756A (zh) 保護膜形成膜、保護膜形成用複合片、半導體裝置之製造方法、以及保護膜形成膜之使用
WO2019187014A1 (ja) 支持シート及び保護膜形成用複合シート
JP2023043538A (ja) 保護膜形成フィルム、保護膜形成用複合シート、及び保護膜付きワーク加工物の製造方法