WO2020054355A1 - 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 - Google Patents

保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 Download PDF

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Publication number
WO2020054355A1
WO2020054355A1 PCT/JP2019/032962 JP2019032962W WO2020054355A1 WO 2020054355 A1 WO2020054355 A1 WO 2020054355A1 JP 2019032962 W JP2019032962 W JP 2019032962W WO 2020054355 A1 WO2020054355 A1 WO 2020054355A1
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WO
WIPO (PCT)
Prior art keywords
protective film
forming
film
meth
composition
Prior art date
Application number
PCT/JP2019/032962
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
力也 小橋
康喜 中石
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to KR1020207031114A priority Critical patent/KR102596665B1/ko
Priority to SG11202012966XA priority patent/SG11202012966XA/en
Priority to JP2020502490A priority patent/JP6686241B1/ja
Priority to CN201980032659.6A priority patent/CN112154536A/zh
Publication of WO2020054355A1 publication Critical patent/WO2020054355A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols

Definitions

  • FIG. 5 is a cross-sectional view schematically showing a composite sheet for forming a protective film according to still another embodiment of the present invention.
  • the protective film forming composite sheet 1D shown here is the same as the protective film forming composite sheet 1C shown in FIG. 4, except that the jig adhesive layer 16 is not provided. That is, in the composite sheet 1D for forming a protective film, the film 13 for forming the protective film is laminated on the first surface 11a of the base material 11, and the release film 15 is laminated on the entire surface of the first surface 13a of the film 13 for forming the protective film. Have been.
  • the transmittance of light having a wavelength of 375 nm is preferably 30% or more, more preferably 50% or more, and particularly preferably 70% or more.
  • the degree of cure of the protective film-forming film is further improved when the protective film-forming film is irradiated with energy rays (ultraviolet rays) via the support sheet.
  • the upper limit of the transmittance of light having a wavelength of 375 nm is not particularly limited, but may be, for example, 95%.
  • the optical characteristics of the pressure-sensitive adhesive layer need only satisfy the optical characteristics of the support sheet described above. That is, the pressure-sensitive adhesive layer may be transparent or may be colored according to the purpose. When the protective film-forming film has energy ray curability, it is preferable that the pressure-sensitive adhesive layer transmit energy rays.
  • thermosetting agent (B2) When a phenolic curing agent is used as the thermosetting agent (B2), the thermosetting agent (B2) preferably has a high softening point or a high glass transition temperature from the viewpoint that the releasability of the protective film from the support sheet is improved. .
  • Examples of the photopolymerization initiator (H) in the composition (III-1) include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, and benzoin dimethyl ketal.
  • the colorant (I) contained in the composition (III-1) and the film for forming a thermosetting protective film may be used alone or in combination of two or more.
  • the ratio can be arbitrarily selected.
  • the drying conditions of the composition for forming an energy ray-curable protective film are not particularly limited, but the composition for forming an energy ray-curable protective film is preferably heated and dried when it contains a solvent described below. In this case, for example, it is preferable to dry at 70 to 130 ° C. for 10 seconds to 5 minutes.
  • non-acrylic monomer examples include olefins such as ethylene and norbornene; vinyl acetate; and styrene.
  • the non-acrylic monomer constituting the acrylic polymer (a11) may be only one kind, two or more kinds, and when two or more kinds, the combination and ratio thereof can be arbitrarily selected.
  • the energy ray-curable compound (a12) preferably has 1 to 5 energy ray-curable groups in one molecule, more preferably 1 to 3 pieces.
  • acrylic monomer constituting the acrylic polymer (b-1) examples include (meth) acrylic acid alkyl ester, (meth) acrylic ester having a cyclic skeleton, glycidyl group-containing (meth) acrylic ester, Hydroxy group-containing (meth) acrylates, substituted amino group-containing (meth) acrylates and the like can be mentioned.
  • the “substituted amino group” is as described above.
  • Examples of the glycidyl group-containing (meth) acrylate include glycidyl (meth) acrylate.
  • Examples of the hydroxyl group-containing (meth) acrylate include hydroxymethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 3-hydroxy (meth) acrylate.
  • Examples of the substituted amino group-containing (meth) acrylate include N-methylaminoethyl (meth) acrylate.
  • non-acrylic monomer constituting the acrylic polymer (b-1) examples include olefins such as ethylene and norbornene; vinyl acetate; and styrene.
  • the pressure-sensitive adhesive layer is formed on the release film by drying as necessary, and the pressure-sensitive adhesive layer is formed by bonding the exposed surface of the pressure-sensitive adhesive layer to one surface of the substrate. It may be laminated on top. In any method, the release film may be removed at an arbitrary timing after the formation of the desired laminated structure.
  • all of the layers (pressure-sensitive adhesive layer and protective film-forming film) other than the base material constituting the protective film-forming composite sheet are previously formed on the release film, and are formed on the surface of the target layer. Since the layers can be laminated by a bonding method, a layer adopting such a process may be appropriately selected as necessary to produce a composite sheet for forming a protective film.
  • the image clarity of the protective film forming film of the present invention is 110 or more, since the print visibility is good, on the back surface of the semiconductor wafer or the back surface of the semiconductor chip obtained by singulating the semiconductor wafer, The semiconductor wafer or the semiconductor chip can be suitably inspected through the protective film formed by attaching the protective film forming film.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2019/032962 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法 WO2020054355A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020207031114A KR102596665B1 (ko) 2018-09-11 2019-08-23 보호막 형성용 필름, 보호막 형성용 복합 시트, 검사 방법 및 식별 방법
SG11202012966XA SG11202012966XA (en) 2018-09-11 2019-08-23 Film for protective film formation, composite sheet for protective film formation, test method, and identification method
JP2020502490A JP6686241B1 (ja) 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法
CN201980032659.6A CN112154536A (zh) 2018-09-11 2019-08-23 保护膜形成用膜、保护膜形成用复合片、检查方法及识别方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-169591 2018-09-11
JP2018169591 2018-09-11

Publications (1)

Publication Number Publication Date
WO2020054355A1 true WO2020054355A1 (ja) 2020-03-19

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PCT/JP2019/032962 WO2020054355A1 (ja) 2018-09-11 2019-08-23 保護膜形成用フィルム、保護膜形成用複合シート、検査方法及び識別方法

Country Status (6)

Country Link
JP (1) JP6686241B1 (ko)
KR (1) KR102596665B1 (ko)
CN (1) CN112154536A (ko)
SG (1) SG11202012966XA (ko)
TW (1) TWI790400B (ko)
WO (1) WO2020054355A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021193913A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート、半導体装置製造用シートの製造方法、及びフィルム状接着剤付き半導体チップの製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP2004311552A (ja) * 2003-04-03 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
WO2015111632A1 (ja) * 2014-01-22 2015-07-30 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007193271A (ja) * 2006-01-23 2007-08-02 Lintec Corp 防眩性フィルムの製造方法及び防眩性フィルム
JP5124778B2 (ja) * 2008-09-18 2013-01-23 リンテック株式会社 レーザーダイシングシートおよび半導体チップの製造方法
KR102258918B1 (ko) * 2014-01-08 2021-06-02 린텍 가부시키가이샤 보호막 형성용 복합 시트
CN107615454B (zh) * 2015-06-05 2020-12-18 琳得科株式会社 保护膜形成用复合片
KR20180122317A (ko) * 2016-03-04 2018-11-12 린텍 가부시키가이샤 반도체 가공용 시트

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5146258U (ko) * 1974-10-02 1976-04-05
JP2004311552A (ja) * 2003-04-03 2004-11-04 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2007184658A (ja) * 2007-04-12 2007-07-19 Casio Micronics Co Ltd 半導体装置
WO2015111632A1 (ja) * 2014-01-22 2015-07-30 リンテック株式会社 保護膜形成フィルム、保護膜形成用シート、保護膜形成用複合シートおよび検査方法
JP6298226B1 (ja) * 2017-03-30 2018-03-20 リンテック株式会社 保護膜形成用複合シート

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021193913A1 (ja) * 2020-03-27 2021-09-30 リンテック株式会社 半導体装置製造用シート、半導体装置製造用シートの製造方法、及びフィルム状接着剤付き半導体チップの製造方法

Also Published As

Publication number Publication date
JP6686241B1 (ja) 2020-04-22
CN112154536A (zh) 2020-12-29
TWI790400B (zh) 2023-01-21
JPWO2020054355A1 (ja) 2020-10-22
SG11202012966XA (en) 2021-02-25
KR20210057703A (ko) 2021-05-21
KR102596665B1 (ko) 2023-11-01
TW202025264A (zh) 2020-07-01

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