JP6678570B2 - トレイ移送装置、トレイを移送するための選別機及びトレイを移送するためのエンドエフェクタ - Google Patents

トレイ移送装置、トレイを移送するための選別機及びトレイを移送するためのエンドエフェクタ Download PDF

Info

Publication number
JP6678570B2
JP6678570B2 JP2016501853A JP2016501853A JP6678570B2 JP 6678570 B2 JP6678570 B2 JP 6678570B2 JP 2016501853 A JP2016501853 A JP 2016501853A JP 2016501853 A JP2016501853 A JP 2016501853A JP 6678570 B2 JP6678570 B2 JP 6678570B2
Authority
JP
Japan
Prior art keywords
tray
end effector
grip
slide
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016501853A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016514376A5 (enExample
JP2016514376A (ja
Inventor
アンソニー シー ボノラ
アンソニー シー ボノラ
ブライアン コンピアン
ブライアン コンピアン
ジェフ ピー ヘンダーソン
ジェフ ピー ヘンダーソン
ロバート ダブリュ カールソン
ロバート ダブリュ カールソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Azenta Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Azenta Inc filed Critical Azenta Inc
Publication of JP2016514376A publication Critical patent/JP2016514376A/ja
Publication of JP2016514376A5 publication Critical patent/JP2016514376A5/ja
Application granted granted Critical
Publication of JP6678570B2 publication Critical patent/JP6678570B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34—Sorting according to other particular properties
    • B07C5/3412—Sorting according to other particular properties according to a code applied to the object which indicates a property of the object, e.g. quality class, contents or incorrect indication
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0028—Gripping heads and other end effectors with movable, e.g. pivoting gripping jaw surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/02—Gripping heads and other end effectors servo-actuated
    • B25J15/0206—Gripping heads and other end effectors servo-actuated comprising articulated grippers
    • B25J15/022—Gripping heads and other end effectors servo-actuated comprising articulated grippers actuated by articulated links
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/902—Devices for picking-up and depositing articles or materials provided with drive systems incorporating rotary and rectilinear movements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G61/00—Use of pick-up or transfer devices or of manipulators for stacking or de-stacking articles not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C2501/00—Sorting according to a characteristic or feature of the articles or material to be sorted
    • B07C2501/0063—Using robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0267—Pallets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • G01N2035/0401—Sample carriers, cuvettes or reaction vessels
    • G01N2035/0418—Plate elements with several rows of samples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • G01N2035/0401—Sample carriers, cuvettes or reaction vessels
    • G01N2035/0418—Plate elements with several rows of samples
    • G01N2035/0425—Stacks, magazines or elevators for plates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Manipulator (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Pallets (AREA)
JP2016501853A 2013-03-14 2014-03-13 トレイ移送装置、トレイを移送するための選別機及びトレイを移送するためのエンドエフェクタ Active JP6678570B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/830,692 US9545724B2 (en) 2013-03-14 2013-03-14 Tray engine with slide attached to an end effector base
US13/830,692 2013-03-14
PCT/US2014/025447 WO2014159916A2 (en) 2013-03-14 2014-03-13 Tray engine and methods for transferring trays to and from tools and in sorters

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020002759A Division JP7053689B2 (ja) 2013-03-14 2020-01-10 ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法

Publications (3)

Publication Number Publication Date
JP2016514376A JP2016514376A (ja) 2016-05-19
JP2016514376A5 JP2016514376A5 (enExample) 2017-04-20
JP6678570B2 true JP6678570B2 (ja) 2020-04-08

Family

ID=51522729

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016501853A Active JP6678570B2 (ja) 2013-03-14 2014-03-13 トレイ移送装置、トレイを移送するための選別機及びトレイを移送するためのエンドエフェクタ
JP2020002759A Active JP7053689B2 (ja) 2013-03-14 2020-01-10 ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020002759A Active JP7053689B2 (ja) 2013-03-14 2020-01-10 ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法

Country Status (6)

Country Link
US (4) US9545724B2 (enExample)
JP (2) JP6678570B2 (enExample)
KR (3) KR102395675B1 (enExample)
CN (3) CN105121309B (enExample)
TW (1) TWI629148B (enExample)
WO (1) WO2014159916A2 (enExample)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6022285B2 (ja) * 2012-09-28 2016-11-09 シスメックス株式会社 標本収納装置、標本収納方法、及び標本検査システム
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
CN104276381B (zh) * 2013-07-05 2016-08-24 鸿富锦精密工业（深圳）有限公司 储料机构及采用该储料机构的上料装置
KR20170084240A (ko) 2014-11-14 2017-07-19 마퍼 리쏘그라피 아이피 비.브이. 리소그래피 시스템에서 기판을 이송하기 위한 로드 로크 시스템 및 방법
WO2016175989A1 (en) * 2015-04-29 2016-11-03 Applied Materials, Inc. High speed rotary sorter
US10515834B2 (en) 2015-10-12 2019-12-24 Lam Research Corporation Multi-station tool with wafer transfer microclimate systems
NL2015784B1 (en) * 2015-11-13 2017-06-02 Mapper Lithography Ip Bv Load lock system and method for transferring substrates in a lithography system.
CN106711071B (zh) * 2015-11-13 2020-06-19 北京北方华创微电子装备有限公司 装卸手
CN105522583B (zh) * 2016-01-25 2017-10-31 南京大学 一种基于rfid技术的自动式图书智能盘点上架机器人
US10566216B2 (en) 2017-06-09 2020-02-18 Lam Research Corporation Equipment front end module gas recirculation
AR112589A1 (es) 2017-07-31 2019-11-13 Monsanto Technology Llc Clasificación de semillas
CN107638263A (zh) * 2017-09-19 2018-01-30 湖南暄程科技有限公司 一种基于机器人的药物配送方法和系统
CN108082821A (zh) * 2017-12-29 2018-05-29 广东伽懋智能织造股份有限公司 一种固态样品储存机
CN108414777A (zh) * 2018-02-08 2018-08-17 前海瑞智捷自动化科技（深圳）有限公司 一种血样检验流水线及方法、出样设备
WO2019178238A1 (en) 2018-03-14 2019-09-19 Monsanto Technology Llc Seed imaging
WO2019225234A1 (ja) * 2018-05-23 2019-11-28 株式会社ダイフク ピッキングシステム（ｐｉｃｋｉｎｇ ｓｙｓｔｅｍ）
CN108862092B (zh) * 2018-05-31 2021-01-19 中航电测仪器股份有限公司 一种物流终端用小型圆柱坐标机器人
CN110554536B (zh) * 2018-05-31 2025-05-27 上海微电子装备（集团）股份有限公司 一种光配向设备以及光配向设备中灯管的更换方法
WO2019241123A1 (en) * 2018-06-11 2019-12-19 Monsanto Technology Llc Seed sorting
KR101986255B1 (ko) 2018-07-19 2019-06-05 주식회사 에스엔티 칩 캐리어 덮개 자동 결합 장치
US11348816B2 (en) * 2018-07-31 2022-05-31 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for die container warehousing
US11488848B2 (en) * 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
US10901328B2 (en) * 2018-09-28 2021-01-26 Applied Materials, Inc. Method for fast loading substrates in a flat panel tool
TWI805823B (zh) * 2018-10-31 2023-06-21 日商三星鑽石工業股份有限公司 基板供給系統及基板加工裝置
KR102663462B1 (ko) * 2018-11-07 2024-05-09 (주)테크윙 핸들러
WO2020131029A1 (en) * 2018-12-18 2020-06-25 Hewlett-Packard Development Company, L.P. Tray installation
JP7304709B2 (ja) * 2019-02-19 2023-07-07 株式会社ディスコ 被加工物の加工方法
KR102673299B1 (ko) * 2019-02-19 2024-06-10 현대자동차주식회사 구동 메커니즘과 이를 구비한 서비스 로봇
US11511283B2 (en) 2019-03-07 2022-11-29 Gen-Probe Incorporated Carrier for holding a plurality of multi-receptacle units
CN110245539B (zh) * 2019-07-09 2024-07-30 江苏安方电力科技有限公司 一种电力物资自动扫码系统
CN110281064A (zh) * 2019-07-19 2019-09-27 上海固华机械设备有限公司 自动上料机
US11305949B1 (en) * 2019-08-06 2022-04-19 Amazon Technologies, Inc. Automated tray handling systems and methods
CN110884879B (zh) * 2019-10-18 2025-03-14 曾伟章 多餐盒投放器
CN114599592A (zh) * 2019-11-13 2022-06-07 Abb瑞士股份有限公司 自动引导车辆的装卸
CN112849866B (zh) * 2019-11-27 2024-06-25 株式会社大福 物品输送装置
IL271654B2 (en) * 2019-12-22 2024-10-01 Bright Machines Ltd Mechanism for pulling a tray
CN111099235B (zh) * 2019-12-25 2021-04-23 广东电网有限责任公司 一种员工档案存取设备
US11527425B2 (en) * 2019-12-31 2022-12-13 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for tray cassette warehousing
CN111769064B (zh) * 2020-06-18 2023-07-14 无锡先导智能装备股份有限公司 上下料装置
USD946847S1 (en) 2020-07-02 2022-03-22 Gizmospring.com Dongguan Limited Scrubber
US11688618B2 (en) * 2020-12-10 2023-06-27 Applied Materials, Inc. Method and apparatus for continuous substrate cassette loading
US11955364B2 (en) * 2021-01-22 2024-04-09 Kimball Electronics Indiana, Inc. Telescoping linear extension robot
CN113000405A (zh) * 2021-02-04 2021-06-22 张传德 一种可自动回收且检测奶茶杯子的装置
KR102641278B1 (ko) * 2021-07-07 2024-02-27 세메스 주식회사 트레이 이송을 위한 승강 장치 및 이를 포함하는 테스트 핸들러
US11945660B2 (en) 2021-08-09 2024-04-02 Applied Materials, Inc. Linear sorter using vacuum belt
CN113680696B (zh) * 2021-08-25 2023-08-22 重庆市天实精工科技有限公司 送料装置以及摄像头模组测试设备
KR102448602B1 (ko) * 2021-08-25 2022-09-29 최완해 트레이 선별 시스템
WO2023063885A1 (en) * 2021-10-11 2023-04-20 Arumugam Shanmuga Sundaram Mail dispenser system with sorters
CN114160433B (zh) * 2021-11-24 2023-03-24 常州武进三晶自动化设备有限公司 一种用于端子加工的产品分拣装置
US12362213B2 (en) * 2021-11-30 2025-07-15 Stmicroelectronics (Malta) Ltd Tray carrier and corresponding method
TWI798049B (zh) * 2022-04-11 2023-04-01 京元電子股份有限公司 料盤移載裝置以及具料盤移載裝置之作業設備
TWI807784B (zh) * 2022-04-18 2023-07-01 福懋科技股份有限公司 載板供應設備及其載板供應方法
CN114914186B (zh) * 2022-04-27 2024-01-05 智汇轩田智能系统(杭州)有限公司 一种dbc板夹紧定位机构
KR20230165602A (ko) * 2022-05-27 2023-12-05 (주)테크윙 핸들러
CN114988006B (zh) * 2022-06-29 2023-11-14 歌尔科技有限公司 物料自动存取设备
CN117622799A (zh) * 2022-08-19 2024-03-01 纬联电子科技(中山)有限公司 取放设备及搬运机台
US12394647B2 (en) * 2022-09-23 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer shift detection
CN116275505A (zh) * 2023-04-13 2023-06-23 中国电子科技集团公司第四十八研究所 一种全自动激光封焊设备
CN116230818B (zh) * 2023-05-05 2023-08-01 武汉精立电子技术有限公司 一种多台led分选机联机自动化作业系统及方法
WO2025117194A1 (en) * 2023-11-28 2025-06-05 Illiakova Maria System for storage and sorting of surgical instruments
CN119882211B (zh) * 2025-02-28 2025-12-05 武汉兰丁智能医学股份有限公司 紧凑型玻片自动扫描装置

Family Cites Families (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2547080A (en) 1948-07-20 1951-04-03 Edward S Hebeler Spring clamp connector
EP0137050A1 (de) * 1977-08-31 1985-04-17 Grisebach, Hans-Theodor Stellgerät mit Kugelschraubengetriebe
US4460826A (en) * 1980-10-24 1984-07-17 Diffracto Ltd. Fiber optic based robot controls
USH65H (en) 1983-05-27 1986-05-06 At&T Bell Laboratories Dynamic optical sensing: Robotic system and manufacturing method utilizing same
US4758127A (en) * 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
US4728137A (en) * 1986-07-22 1988-03-01 American Engineering And Trade, Inc. Compound toggle robotic gripper
US5503516A (en) * 1987-08-07 1996-04-02 Canon Kabushiki Kaisha Automatic article feeding system
WO1993002952A1 (en) * 1991-08-05 1993-02-18 Symtek Systems, Inc. Input/output apparatus for electronic device handlers
JP3473116B2 (ja) * 1994-07-12 2003-12-02 ソニー株式会社 トレイ引き出し装置
JPH08227926A (ja) * 1995-02-21 1996-09-03 Sony Corp 搭載装置
US6322119B1 (en) * 1999-07-09 2001-11-27 Semitool, Inc. Robots for microelectronic workpiece handling
KR200161974Y1 (ko) * 1997-04-04 1999-12-01 윤종용 반도체 디바이스 테스트용 핸들러 시스템의 트레이 캐쳐
KR19990035554A (ko) * 1997-10-31 1999-05-15 윤종용 스토커 설비 구조
WO1999028952A2 (en) * 1997-11-28 1999-06-10 Fortrend Engineering Corporation Wafer-mapping load port interface
US6109677A (en) * 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US6188323B1 (en) 1998-10-15 2001-02-13 Asyst Technologies, Inc. Wafer mapping system
US6396072B1 (en) * 1999-06-21 2002-05-28 Fortrend Engineering Corporation Load port door assembly with integrated wafer mapper
TW444260B (en) * 2000-07-13 2001-07-01 Ind Tech Res Inst Wafer mapping method of wafer load port equipment
US6591162B1 (en) * 2000-08-15 2003-07-08 Asyst Technologies, Inc. Smart load port with integrated carrier monitoring and fab-wide carrier management system
DE60125380T2 (de) * 2000-08-23 2007-10-04 The University Of Virginia Patent Foundation Automatisiertes lagerungs- und entnahmegerät für gefrierfächer und entsprechendes verfahren
US6592324B2 (en) * 2001-02-26 2003-07-15 Irm, Llc Gripper mechanism
US7054150B2 (en) * 2001-08-29 2006-05-30 Xyratex Technology Limited Mounting for disk drive unit and method of handling
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
US7066707B1 (en) 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
US20030077153A1 (en) * 2001-10-19 2003-04-24 Applied Materials, Inc. Identification code reader integrated with substrate carrier robot
TWI288961B (en) * 2001-12-12 2007-10-21 Shinko Electric Co Ltd Substrate detection apparatus
TWI233913B (en) 2002-06-06 2005-06-11 Murata Machinery Ltd Automated guided vehicle system
US7677859B2 (en) * 2002-07-22 2010-03-16 Brooks Automation, Inc. Substrate loading and uploading station with buffer
KR100566821B1 (ko) * 2002-11-20 2006-04-03 미래산업 주식회사 트레이 이송장치
US6984839B2 (en) * 2002-11-22 2006-01-10 Tdk Corporation Wafer processing apparatus capable of mapping wafers
US20080000232A1 (en) 2002-11-26 2008-01-03 Rogers James E System for adjusting energy generated by a space-based power system
KR20040090504A (ko) * 2003-04-17 2004-10-26 삼성전자주식회사 로드락 챔버를 갖는 반도체 장비
FI20030748A0 (fi) * 2003-05-20 2003-05-20 Jl Suunnittelu Lakome Oy Menetelmä ja laitteisto monikehävarastointiin
US7192791B2 (en) * 2003-06-19 2007-03-20 Brooks Automation, Inc. Semiconductor wafer having an edge based identification feature
JP2005255327A (ja) * 2004-03-11 2005-09-22 Hitachi Kiden Kogyo Ltd 基板搬送用クレーンマストの防振装置
CN101006554A (zh) * 2004-10-29 2007-07-25 株式会社尼康 标线保护构件、标线运送装置、曝光装置及标线运送方法
KR100656155B1 (ko) * 2005-01-07 2006-12-13 (주)제이티 트레이 이송장치
US8821099B2 (en) 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
KR100740890B1 (ko) * 2005-10-11 2007-08-31 주식회사 블루코드 웨이퍼 콜렉터
KR100648920B1 (ko) * 2005-12-15 2006-11-24 (주)테크윙 테스트핸들러용 자세변환장치 및 테스트핸드러용동력전달장치
KR20070069908A (ko) * 2005-12-28 2007-07-03 동부일렉트로닉스 주식회사 웨이퍼의 안전한 이송을 위한 진공 카세트
CN101970115B (zh) * 2006-01-23 2014-03-12 纽克塞斯生物系统公司 用于储藏、取回和管理样品的自动化系统
KR100746877B1 (ko) * 2006-03-30 2007-08-07 주식회사 유니테스트 반도체 컴포넌트의 오리엔테이션이 변경 가능한 반도체컴포넌트 테스터용 반도체 컴포넌트 이송 장치
JP2007281095A (ja) * 2006-04-04 2007-10-25 Tokyo Seimitsu Co Ltd ワーク搬送装置
JP4333701B2 (ja) * 2006-06-14 2009-09-16 村田機械株式会社 搬送システム
TWI348988B (en) * 2006-08-04 2011-09-21 Hon Hai Prec Ind Co Ltd Tray locating-device
KR100848572B1 (ko) * 2006-08-31 2008-07-25 유정호 포드의 도어 오픈장치
JP4569549B2 (ja) * 2006-09-21 2010-10-27 村田機械株式会社 移載装置
JP4992906B2 (ja) * 2006-10-03 2012-08-08 株式会社Ｉｈｉ 基板搬送システム
JP2008100802A (ja) * 2006-10-18 2008-05-01 Ihi Corp 基板保管庫
US10163667B2 (en) * 2007-03-22 2018-12-25 Brooks Automation, Inc. Linear wafer drive for handling wafers during semiconductor fabrication
WO2009016757A1 (ja) * 2007-08-02 2009-02-05 Hirata Corporation 部品移送装置及び方法
DE102008023762A1 (de) * 2007-09-13 2009-03-19 Multivac Sepp Haggenmüller Gmbh & Co. Kg Vorrichtung zur Aufnahme und zum Transport eines Gutes
US8417373B2 (en) * 2007-10-29 2013-04-09 Hen S.R.L. Automatic warehouse
KR100913504B1 (ko) * 2007-11-09 2009-08-21 에이엠티 주식회사 트레이-트랜스퍼 유닛을 이용한 트레이 이송 장치 및 그방법
US7861540B2 (en) 2008-01-25 2011-01-04 Hamilton Storage Technologies, Inc. Automated storage and retrieval system for storing biological or chemical samples at ultra-low temperatures
US20100034621A1 (en) * 2008-04-30 2010-02-11 Martin Raymond S End effector to substrate offset detection and correction
US8365639B2 (en) * 2008-11-19 2013-02-05 Motoman, Inc. Gripping devices and methods thereof
JP4285708B2 (ja) * 2008-12-19 2009-06-24 大日本スクリーン製造株式会社 基板検出装置
CN201385922Y (zh) * 2009-02-24 2010-01-20 太原艺星科技有限公司 自动联体提升货柜的货叉挂接机构
JP5115501B2 (ja) * 2009-03-12 2013-01-09 株式会社Ｉｈｉ 基板仕分け装置及び基板仕分け方法
EP2433299B1 (en) * 2009-05-18 2022-10-26 Brooks Automation US, LLC Substrate container storage system
JP4878639B2 (ja) * 2009-10-29 2012-02-15 日特エンジニアリング株式会社 パレット搬送装置及びパレット搬送方法
JP2011134898A (ja) * 2009-12-24 2011-07-07 Tokyo Electron Ltd 基板処理装置、基板処理方法及び記憶媒体
JP5884267B2 (ja) * 2010-04-01 2016-03-15 株式会社ニコン 物体搬送装置、露光装置、デバイス製造方法、フラットパネルディスプレイの製造方法、及び物体搬送方法
US20120061155A1 (en) * 2010-04-09 2012-03-15 Willow Garage, Inc. Humanoid robotics system and methods
DE102010037814A1 (de) * 2010-09-28 2012-03-29 LCTech GmbH Transport- und Manipulationshalterung
JP5874950B2 (ja) * 2011-04-12 2016-03-02 株式会社東京精密 ワーク搬送装置及びワーク加工装置
JP6037372B2 (ja) * 2011-08-03 2016-12-07 株式会社ディスコ パッケージ基板分割装置
CN202352718U (zh) * 2011-10-13 2012-07-25 赵跃庆 一种夹料装置
EP2812163B9 (en) 2012-02-08 2025-06-18 Vanrx Pharmasystems Inc. Articulated arm apparatus and system
CN102658542A (zh) * 2012-05-07 2012-09-12 上海电机学院 轨道式智能搬运机器车
US9214375B2 (en) * 2012-07-10 2015-12-15 Lam Research Corporation End effector having multiple-position contact points
CN103671386B (zh) * 2012-08-31 2015-12-16 富鼎电子科技(嘉善)有限公司 贴泡棉装置及其使用的夹取机构
CN104029209B (zh) * 2013-03-05 2017-06-30 精工爱普生株式会社 机械手、机器人、以及利用机器人保持被夹持物的保持方法
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
TWI684229B (zh) * 2013-07-08 2020-02-01 美商布魯克斯自動機械公司 具有即時基板定心的處理裝置
US10115616B2 (en) * 2013-07-18 2018-10-30 Applied Materials, Inc. Carrier adapter insert apparatus and carrier adapter insert detection methods
US9305816B2 (en) * 2013-12-28 2016-04-05 Intel Corporation Methods and devices for securing and transporting singulated die in high volume manufacturing
KR20150088941A (ko) * 2014-01-24 2015-08-04 삼성전자주식회사 습식 세정 장치 및 이를 사용한 습식 세정 방법
JP6248788B2 (ja) * 2014-04-28 2017-12-20 シンフォニアテクノロジー株式会社 ウエハマッピング装置およびそれを備えたロードポート
EP3266040A1 (en) * 2015-03-03 2018-01-10 Lutz Rebstock Inspection system
DE102015004404B4 (de) * 2015-04-11 2016-11-24 Günther Zimmer Präzisionsgreifvorrichtung

Also Published As

Publication number Publication date
CN107458796B (zh) 2020-01-07
US11077466B2 (en) 2021-08-03
CN105121309B (zh) 2017-09-26
CN105121309A (zh) 2015-12-02
US20210346915A1 (en) 2021-11-11
US20170100750A1 (en) 2017-04-13
KR102298612B1 (ko) 2021-09-03
KR20150128955A (ko) 2015-11-18
CN107458796A (zh) 2017-12-12
US10092929B2 (en) 2018-10-09
US20180361433A1 (en) 2018-12-20
KR102395675B1 (ko) 2022-05-06
WO2014159916A3 (en) 2014-11-27
JP2020065077A (ja) 2020-04-23
CN111056199A (zh) 2020-04-24
KR20210109666A (ko) 2021-09-06
TWI629148B (zh) 2018-07-11
CN111056199B (zh) 2022-04-05
WO2014159916A2 (en) 2014-10-02
JP7053689B2 (ja) 2022-04-12
US9545724B2 (en) 2017-01-17
KR20210000330A (ko) 2021-01-04
JP2016514376A (ja) 2016-05-19
TW201505793A (zh) 2015-02-16
US20140262979A1 (en) 2014-09-18
KR102196965B1 (ko) 2020-12-31

Similar Documents

Publication Publication Date Title
JP7053689B2 (ja) ツールへかつツールから及び選別機内でトレイを移送するためのトレイエンジン及び方法
US10899002B2 (en) Article movement apparatus, article movement method, and article movement control program
US10417521B2 (en) Material handling system and method
US20190344974A1 (en) Method and system for manipulating articles
CN119858790A (zh) 货品验证的控制设备和方法
JP2010520076A (ja) 対象物を認識、回収および再配置する方法および装置
CN108885222B (zh) 运输装置
CN208377625U (zh) 一种物料智能料仓系统
JP6647597B2 (ja) 紙幣格納容器取扱いシステム
CN117068611B (zh) 一种卷烟库存盘点架及盘点方法
CN210823887U (zh) 智能仓储设备
KR101432493B1 (ko) 분류 시스템
CN221758027U (zh) 血袋检测装置及智能贴标系统
CN206066030U (zh) 刀具自动供应设备
CN212531479U (zh) 物料自动分类收纳装置
JP7177856B2 (ja) 作業ロボット
US20250353692A1 (en) Adjustable tray stacker/destacker assembly
CN113333334B (zh) 一种分类装置
CN120871527A (zh) 一种光罩存储机台的控制系统
JPH01264794A (ja) 物体把持装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170313

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170313

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20170419

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180226

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180525

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180702

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20190110

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20190409

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190523

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20190912

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200110

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20200121

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20200309

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20200317

R150 Certificate of patent or registration of utility model

Ref document number: 6678570

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250