JP6671537B2 - 封止フィルム - Google Patents
封止フィルム Download PDFInfo
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- JP6671537B2 JP6671537B2 JP2019503886A JP2019503886A JP6671537B2 JP 6671537 B2 JP6671537 B2 JP 6671537B2 JP 2019503886 A JP2019503886 A JP 2019503886A JP 2019503886 A JP2019503886 A JP 2019503886A JP 6671537 B2 JP6671537 B2 JP 6671537B2
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- Prior art keywords
- layer
- sealing
- organic electronic
- electronic device
- sealing layer
- Prior art date
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- 238000007789 sealing Methods 0.000 title claims description 239
- 239000010410 layer Substances 0.000 claims description 299
- 229920005989 resin Polymers 0.000 claims description 100
- 239000011347 resin Substances 0.000 claims description 100
- 229910052751 metal Inorganic materials 0.000 claims description 83
- 239000002184 metal Substances 0.000 claims description 82
- 238000005520 cutting process Methods 0.000 claims description 40
- 239000000203 mixture Substances 0.000 claims description 34
- 239000003463 adsorbent Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 23
- 150000001875 compounds Chemical class 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 13
- 230000009477 glass transition Effects 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 239000013307 optical fiber Substances 0.000 claims description 5
- 239000002356 single layer Substances 0.000 claims description 5
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229910003437 indium oxide Inorganic materials 0.000 claims description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 2
- 229910000484 niobium oxide Inorganic materials 0.000 claims description 2
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
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- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- 229910001887 tin oxide Inorganic materials 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000000806 elastomer Substances 0.000 description 60
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- 238000001723 curing Methods 0.000 description 30
- -1 polypropylene Polymers 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 21
- 239000003795 chemical substances by application Substances 0.000 description 18
- 125000000524 functional group Chemical group 0.000 description 17
- 239000003999 initiator Substances 0.000 description 17
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- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 14
- 239000000178 monomer Substances 0.000 description 12
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 10
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- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 229920002367 Polyisobutene Polymers 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- XJHCXCQVJFPJIK-UHFFFAOYSA-M caesium fluoride Chemical compound [F-].[Cs+] XJHCXCQVJFPJIK-UHFFFAOYSA-M 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 4
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- 239000003566 sealing material Substances 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical class C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
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- 150000002148 esters Chemical class 0.000 description 3
- 238000009775 high-speed stirring Methods 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000003698 laser cutting Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
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- 239000004800 polyvinyl chloride Substances 0.000 description 3
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- 238000005096 rolling process Methods 0.000 description 3
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- 239000000377 silicon dioxide Substances 0.000 description 3
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- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
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- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
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- B32B2307/724—Permeability to gases, adsorption
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7244—Oxygen barrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/724—Permeability to gases, adsorption
- B32B2307/7242—Non-permeable
- B32B2307/7246—Water vapor barrier
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
- B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
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- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2581/00—Seals; Sealing equipment; Gaskets
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- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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Description
本出願は、2016年4月12日付韓国特許出願第10−2016−0044519号および2016年4月12日付韓国特許出願第10−2016−0044520号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示されたすべての内容は、本明細書の一部として含まれる。
本出願は、封止フィルム、前記封止フィルムの製造方法、これを含む有機電子装置およびこれを利用した有機電子装置の製造方法に関する。
0.95≦a/b≦25
(1)封止層における第2層溶液の製造
常温で反応器にポリイソブテン樹脂(重量平均分子量45万)60gおよび粘着付与剤として水素化されたジシクロペンタジエン系樹脂(軟化点125℃)40gを投入した後、多官能性アクリルモノマー(TMPTA)20g、光開始剤1gをトルエンで固形分が25重量%程度になるように希釈した。
水分吸着剤として焼成ドロマイト(calcined dolomite)100gおよび溶剤としてトルエンを固形分50重量%の濃度で投入し、水分吸着剤溶液を製造した。常温で反応器にポリイソブテン樹脂(重量平均分子量45万)70gおよび粘着付与剤として水素化されたジシクロペンタジエン系樹脂(軟化点125℃)30gを投入した後、多官能性アクリルモノマー(TMPTA)30g、光開始剤2gをトルエンで固形分が25重量%程度になるように希釈した。これにあらかじめ作っておいた水分吸着剤溶液を混ぜて均質化した。
前記で準備しておいた(1)の第2層溶液を離型PETの離型面に塗布し、110℃で10分間乾燥し、厚さが10μmの層を形成した。
前記で製造された封止層の離型処理されたPETを剥離させ、あらかじめ準備されたメタル層(Invar)の一面に前記(2)の第2層が当接するように封止層を結合した。
実施例1の(2)の第2層溶液として、ポリイソブテン樹脂を60g、粘着付与剤を40g、多官能性アクリルモノマーを20gおよび光開始剤を1g投入したことを除いて、実施例1と同じ方法で(2)の第2層溶液を製造した。
実施例1の(1)の第2層溶液の代わりに、下記の第1層溶液を製造したことを除いて、実施例1と同じ方法で各層溶液を製造した。
(1)封止層における第1層溶液の製造
実施例3と同じ方法で第1層溶液を製造した。
水分吸着剤として焼成ドロマイト(calcined dolomite)100gおよび溶剤としてメチルエチルケトンを固形分50重量%の濃度で投入し、水分吸着剤溶液を製造した。常温で反応器にエポキシ樹脂(KSR177、KUKDO化学)50g、エポキシ樹脂YD−014(KUKDO化学)50gおよびフェノキシ樹脂(YP−55、DONGDO化成)50gをメチルエチルケトンで希釈した溶液(固形分70%)を製造した後、溶液を均質化した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)3gを投入した後、1時間高速撹拌し、第1層の溶液を製造した。これにあらかじめ作っておいた水分吸着剤溶液を混ぜて均質化した。
ギャップaが4μm、傾斜部の幅dが1μmであることを除いて、実施例1と同じ方法で封止フィルムを製造した。
封止フィルムの形成時、ギャップaが15μm、傾斜部の幅dが5μmであることを除いて、実施例3と同じ方法で封止フィルムを製造した。
(1)封止層における第1層溶液の製造
水分吸着剤として焼成ドロマイト(calcined dolomite)100gおよび溶剤としてメチルエチルケトンを固形分50重量%の濃度で投入し、水分吸着剤溶液を製造した。常温で反応器にエポキシ樹脂(KSR177、KUKDO化学)80g、エポキシ樹脂(YD−014、KUKDO化学)4gおよびフェノキシ樹脂(PKHA、Gabrel Phenoxyresin)30gをメチルエチルケトンで希釈した溶液(固形分70%)を製造した後、溶液を均質化した。前記均質化された溶液に硬化剤であるイミダゾール(四国化成)3gを投入した後、1時間高速撹拌し、第1層の溶液を製造した。これにあらかじめ作っておいた水分吸着剤溶液を混ぜて均質化した。
封止フィルムの形成時、ギャップaが1100μm、傾斜部の幅dが100μmであることを除いて、実施例4と同じ方法で封止フィルムを製造した。
封止フィルムの形成時、ギャップaが1200μm、傾斜部の幅dが1100μmであることを除いて、実施例3と同じ方法で封止フィルムを製造した。
ガラス基板上に有機電子素子を蒸着した後、前記実施例および比較例で製造された封止フィルムを真空合着機を利用して50℃、真空度50mtorr、0.4MPaの条件で前記素子上に合着した後、100℃で3時間の硬化工程を経て有機電子パネルを製造した。メタル層の末端部から外側に封止層がオーバーフロによって汚染が発生するか否かを判断した。
TA社のARESを通じて実施例および比較例で製造された封止層のムーニー粘度を測定した。8mm直径の平板ジグを利用して5%ストレーン、1Hzの周波数および100℃の温度でせん断応力によってムーニー粘度を測定した。
11 メタル層
111 第1面
112 第2面
12 封止層
121 封止層の第1層または第2層
122 封止層の第1層または第2層
a ギャップのサイズ(幅)
b 封止層の厚さ
c 硬化部のサイズ(幅)
d 傾斜部のサイズ(幅)
e 突出部のサイズ
13 接着層
14 保護層
2 基板
21 有機電子素子
Claims (20)
- 第1面と前記第1面と反対方向の第2面とを有するメタル層と、
前記メタル層の前記第1面に設けられ、且つ、第1面と第2面とを有する封止層であって、前記封止層の前記第2面は、前記封止層の前記第1面と反対方向に位置するとともに前記メタル層の前記第1面に向かう面であり、前記封止層の少なくとも一部領域の端部は、前記封止層の前記第1面の端部と前記メタル層の前記第1面の端部との間に20μm〜1000μmのギャップが形成されるように前記メタル層の前記第1面の端部より内側に位置し、前記封止層の前記一部領域の端部が傾斜部を有することにより、前記封止層の前記一部領域において、前記封止層の前記第2面の端部は、前記封止層の前記第1面の端部より前記メタル層の前記第1面の端部とさらに近い、封止層と、を含む有機電子素子の封止フィルム。 - 前記傾斜部の幅dは、2μm〜1000μmの範囲内にある、請求項1に記載の有機電子素子の封止フィルム。
- 前記封止層は、5%ストレーン、1Hzの周波数および100℃の温度でせん断応力によって測定したムーニー粘度η*が、2.0×10Pa・s〜108Pa・sの範囲内にある、請求項1に記載の有機電子素子の封止フィルム。
- 前記封止層は、一部領域の端部に硬化部を有する、請求項1に記載の有機電子素子の封止フィルム。
- 前記硬化部の幅は、10μm〜1100μmの範囲内にある、請求項4に記載の有機電子素子の封止フィルム。
- 前記メタル層は、金属、酸化金属、窒化金属、炭化金属、オキシ窒化金属、オキシホウ化金属、およびその配合物のうちいずれか一つを含む、請求項1に記載の有機電子素子の封止フィルム。
- 前記メタル層は、鉄、アルミニウム、銅、ニッケル、酸化シリコン、酸化アルミニウム、酸化チタン、酸化インジウム、酸化スズ、酸化スズインジウム、酸化タンタル、酸化ジルコニウム、酸化ニオビウム、およびそれらの配合物のうちいずれか一つを含む、請求項1に記載の有機電子素子の封止フィルム。
- 前記メタル層の第2面に設けられる保護層と、
前記メタル層と前記保護層との間に設けられる接着層と、をさらに含む、請求項1に記載の有機電子素子の封止フィルム。 - 前記封止層は、単一層あるいは2以上の層で形成される、請求項1に記載の有機電子素子の封止フィルム。
- 前記封止層は、ガラス転移温度が85℃以上の封止樹脂を含む第1層を備える、請求項1に記載の有機電子素子の封止フィルム。
- 前記封止層は、ガラス転移温度が0℃以下の封止樹脂を含む第2層を備える、請求項1に記載の有機電子素子の封止フィルム。
- 前記封止層は、水分吸着剤を含む、請求項1に記載の有機電子素子の封止フィルム。
- 封止層の側面を切断する段階を含む請求項1に記載の封止フィルムの製造方法。
- メタル層の側面を切断する段階を含む、請求項13に記載の封止フィルムの製造方法。
- 前記封止層の側面を切断する段階は、CO2レーザーまたは光ファイバーレーザーで切断することを含む、請求項13に記載の封止フィルムの製造方法。
- 前記メタル層の側面を切断する段階は、CO2レーザー、光ファイバーレーザーまたはナイフカッターを利用して切断することを含む、請求項14に記載の封止フィルムの製造方法。
- 前記封止層の側面を切断する段階は、50μm〜500μmのサイズを有するレーザービームで切断することを含む、請求項13に記載の封止フィルムの製造方法。
- 前記メタル層の側面を切断する段階は、1μm〜30μmのサイズを有するレーザービームで切断することを含む、請求項14に記載の封止フィルムの製造方法。
- 基板と、前記基板上に形成された有機電子素子と、前記有機電子素子を全面封止する請求項1に記載の封止フィルムと、を含む有機電子装置。
- 上部に有機電子素子が形成された基板に請求項1に記載の封止フィルムが前記有機電子素子をカバーするように適用する段階と、前記封止フィルムを硬化する段階と、を含む有機電子装置の製造方法。
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US10593908B2 (en) | 2020-03-17 |
WO2017179906A1 (ko) | 2017-10-19 |
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CN109155373B (zh) | 2021-02-02 |
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JP2019514175A (ja) | 2019-05-30 |
US10937990B2 (en) | 2021-03-02 |
JP6783873B2 (ja) | 2020-11-11 |
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