JP6669144B2 - 発光素子の製造方法 - Google Patents
発光素子の製造方法 Download PDFInfo
- Publication number
- JP6669144B2 JP6669144B2 JP2017171833A JP2017171833A JP6669144B2 JP 6669144 B2 JP6669144 B2 JP 6669144B2 JP 2017171833 A JP2017171833 A JP 2017171833A JP 2017171833 A JP2017171833 A JP 2017171833A JP 6669144 B2 JP6669144 B2 JP 6669144B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- light emitting
- nitride semiconductor
- layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/021—Singulating, e.g. dicing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/032—Manufacture or treatment of electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/034—Manufacture or treatment of coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
Priority Applications (18)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/842,655 US10505072B2 (en) | 2016-12-16 | 2017-12-14 | Method for manufacturing light emitting element |
| AU2017276283A AU2017276283B2 (en) | 2016-12-16 | 2017-12-14 | Method for manufacturing light emitting element |
| EP22181047.6A EP4086976B1 (en) | 2016-12-16 | 2017-12-15 | Light emitting element |
| EP17207634.1A EP3336907B1 (en) | 2016-12-16 | 2017-12-15 | Method for manufacturing light emitting element and light emitting element |
| EP21160607.4A EP3848982B1 (en) | 2016-12-16 | 2017-12-15 | Method for manufacturing light emitting element |
| TW112137806A TWI900899B (zh) | 2016-12-16 | 2017-12-15 | 發光元件之製造方法、及發光元件 |
| MYPI2017704845A MY198985A (en) | 2016-12-16 | 2017-12-15 | Method for manufacturing light emitting element |
| CN201711347059.8A CN108206226B (zh) | 2016-12-16 | 2017-12-15 | 发光元件的制造方法及发光元件 |
| TW111106289A TWI816308B (zh) | 2016-12-16 | 2017-12-15 | 發光元件之製造方法、及發光元件 |
| KR1020170173095A KR102438948B1 (ko) | 2016-12-16 | 2017-12-15 | 발광소자의 제조 방법 |
| BR102017027106-4A BR102017027106B1 (pt) | 2016-12-16 | 2017-12-15 | Método para fabricar uma pluralidade de elementos emissores de luz, e, elemento emissor de luz |
| TW106144121A TWI759384B (zh) | 2016-12-16 | 2017-12-15 | 發光元件之製造方法、及發光元件 |
| CN202211539888.7A CN115863494A (zh) | 2016-12-16 | 2017-12-15 | 发光元件的制造方法及发光元件 |
| US16/677,287 US11056612B2 (en) | 2016-12-16 | 2019-11-07 | Light emitting element |
| US17/338,446 US11855238B2 (en) | 2016-12-16 | 2021-06-03 | Light emitting element |
| KR1020220106758A KR102549581B1 (ko) | 2016-12-16 | 2022-08-25 | 발광소자의 제조 방법 |
| US18/507,177 US12218271B2 (en) | 2016-12-16 | 2023-11-13 | Light emitting element |
| US19/003,702 US20250324819A1 (en) | 2016-12-16 | 2024-12-27 | Light emitting element |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016243899 | 2016-12-16 | ||
| JP2016243899 | 2016-12-16 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019181932A Division JP7144684B2 (ja) | 2016-12-16 | 2019-10-02 | 発光素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018101771A JP2018101771A (ja) | 2018-06-28 |
| JP6669144B2 true JP6669144B2 (ja) | 2020-03-18 |
Family
ID=62715668
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017171833A Active JP6669144B2 (ja) | 2016-12-16 | 2017-09-07 | 発光素子の製造方法 |
| JP2019181932A Active JP7144684B2 (ja) | 2016-12-16 | 2019-10-02 | 発光素子 |
| JP2022139459A Active JP7445160B2 (ja) | 2016-12-16 | 2022-09-01 | 発光素子 |
| JP2024024363A Active JP7590680B2 (ja) | 2016-12-16 | 2024-02-21 | 発光素子の製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019181932A Active JP7144684B2 (ja) | 2016-12-16 | 2019-10-02 | 発光素子 |
| JP2022139459A Active JP7445160B2 (ja) | 2016-12-16 | 2022-09-01 | 発光素子 |
| JP2024024363A Active JP7590680B2 (ja) | 2016-12-16 | 2024-02-21 | 発光素子の製造方法 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US12218271B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP4086976B1 (cg-RX-API-DMAC7.html) |
| JP (4) | JP6669144B2 (cg-RX-API-DMAC7.html) |
| KR (2) | KR102438948B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN115863494A (cg-RX-API-DMAC7.html) |
| AU (1) | AU2017276283B2 (cg-RX-API-DMAC7.html) |
| BR (1) | BR102017027106B1 (cg-RX-API-DMAC7.html) |
| MY (1) | MY198985A (cg-RX-API-DMAC7.html) |
| TW (2) | TWI759384B (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019220723A (ja) * | 2016-12-16 | 2019-12-26 | 日亜化学工業株式会社 | 発光素子の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7339509B2 (ja) | 2019-08-02 | 2023-09-06 | 日亜化学工業株式会社 | 発光素子の製造方法 |
Family Cites Families (67)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4084116A (en) * | 1976-09-20 | 1978-04-11 | International Business Machines Corporation | Procedure for tightening tape wraps on a spindle |
| JPS5342956A (en) * | 1976-09-25 | 1978-04-18 | Toshio Uenishi | Method of stitching visor of cap |
| JPH04103666U (ja) * | 1991-02-18 | 1992-09-07 | 日亜化学工業株式会社 | 青色発光デバイスの電極 |
| JP2836685B2 (ja) * | 1993-02-02 | 1998-12-14 | 日亜化学工業株式会社 | p型窒化ガリウム系化合物半導体の製造方法 |
| JPH07235731A (ja) * | 1994-02-24 | 1995-09-05 | Fujitsu Ltd | 化合物半導体装置の製造方法 |
| JPH08306643A (ja) * | 1995-04-28 | 1996-11-22 | Sumitomo Chem Co Ltd | 3−5族化合物半導体用電極および発光素子 |
| JPH09162441A (ja) * | 1995-12-05 | 1997-06-20 | Toshiba Corp | 半導体装置及びその製造方法 |
| JPH10294531A (ja) * | 1997-02-21 | 1998-11-04 | Toshiba Corp | 窒化物化合物半導体発光素子 |
| WO1998039827A1 (en) | 1997-03-07 | 1998-09-11 | Sharp Kabushiki Kaisha | Gallium nitride semiconductor light emitting element with active layer having multiplex quantum well structure and semiconductor laser light source device |
| JP3741528B2 (ja) * | 1997-12-15 | 2006-02-01 | シャープ株式会社 | 窒化ガリウム系半導体素子の製造方法 |
| JP2000294828A (ja) * | 1999-04-07 | 2000-10-20 | Mitsubishi Cable Ind Ltd | GaN系半導体素子の製造方法 |
| JP2000353822A (ja) | 1999-06-11 | 2000-12-19 | Hitachi Ltd | 窒化ガリウム系化合物半導体発光素子およびその製造方法 |
| JP3723434B2 (ja) | 1999-09-24 | 2005-12-07 | 三洋電機株式会社 | 半導体発光素子 |
| JP3626442B2 (ja) | 2000-09-13 | 2005-03-09 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| JP4659300B2 (ja) | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| EP1387453B1 (en) * | 2001-04-12 | 2009-11-11 | Nichia Corporation | Gallium nitride compound semiconductor element |
| JP2002009392A (ja) | 2001-06-22 | 2002-01-11 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
| JP2004088086A (ja) * | 2002-06-25 | 2004-03-18 | Toyota Central Res & Dev Lab Inc | 半導体レーザ素子とその製造方法 |
| JP4056481B2 (ja) * | 2003-02-07 | 2008-03-05 | 三洋電機株式会社 | 半導体素子およびその製造方法 |
| JP4385746B2 (ja) | 2003-11-28 | 2009-12-16 | 三菱化学株式会社 | 窒化物系半導体素子の製造方法 |
| JP3910603B2 (ja) | 2004-06-07 | 2007-04-25 | 株式会社東芝 | 熱処理装置、熱処理方法及び半導体装置の製造方法 |
| GB2432455A (en) * | 2005-11-17 | 2007-05-23 | Sharp Kk | Growth of a semiconductor layer structure |
| JP5522490B2 (ja) | 2005-11-30 | 2014-06-18 | 株式会社リコー | 面発光レーザ素子、それを備えた面発光レーザアレイ、面発光レーザ素子または面発光レーザアレイを備えた電子写真システムおよび面発光レーザ素子または面発光レーザアレイを備えた光通信システム |
| JP5194432B2 (ja) | 2005-11-30 | 2013-05-08 | 株式会社リコー | 面発光レーザ素子 |
| JP4535997B2 (ja) | 2005-12-09 | 2010-09-01 | シャープ株式会社 | 窒化物半導体レーザ素子およびその製造方法 |
| JP4940987B2 (ja) | 2006-03-20 | 2012-05-30 | 日亜化学工業株式会社 | 窒化物半導体レーザ素子及びその製造方法 |
| US20070298529A1 (en) | 2006-05-31 | 2007-12-27 | Toyoda Gosei, Co., Ltd. | Semiconductor light-emitting device and method for separating semiconductor light-emitting devices |
| JP5232375B2 (ja) | 2006-10-13 | 2013-07-10 | アイシン精機株式会社 | 半導体発光素子の分離方法 |
| JP2009176781A (ja) * | 2008-01-21 | 2009-08-06 | Mitsubishi Chemicals Corp | GaN系LEDチップおよびGaN系LEDチップの製造方法 |
| KR101205527B1 (ko) * | 2009-01-15 | 2012-11-27 | 서울옵토디바이스주식회사 | 발광 다이오드 및 그 제조 방법 |
| US20100291772A1 (en) * | 2009-05-15 | 2010-11-18 | Yang Cheng-Chung | Semiconductor Manufacturing Method |
| JP2011129765A (ja) * | 2009-12-18 | 2011-06-30 | Showa Denko Kk | 半導体発光素子の製造方法 |
| JP2011233783A (ja) | 2010-04-28 | 2011-11-17 | Mitsubishi Heavy Ind Ltd | 半導体発光素子、半導体発光素子の保護膜及びその作製方法 |
| JP2011243875A (ja) * | 2010-05-20 | 2011-12-01 | Disco Abrasive Syst Ltd | サファイアウェーハの分割方法 |
| JP2012000636A (ja) * | 2010-06-16 | 2012-01-05 | Showa Denko Kk | レーザ加工方法 |
| US8877612B2 (en) | 2010-06-16 | 2014-11-04 | Toyoda Gosei Co., Ltd. | Laser processing method |
| JP2012004313A (ja) * | 2010-06-16 | 2012-01-05 | Showa Denko Kk | レーザ加工方法 |
| JP5625522B2 (ja) * | 2010-06-16 | 2014-11-19 | 豊田合成株式会社 | レーザ加工方法 |
| JP2012028381A (ja) | 2010-07-20 | 2012-02-09 | Sharp Corp | 半導体発光素子およびその製造方法 |
| KR100988194B1 (ko) * | 2010-07-26 | 2010-10-18 | (주)더리즈 | 반도체 발광 소자 및 그 제조 방법 |
| TWI462338B (zh) * | 2010-08-16 | 2014-11-21 | Lextar Electronics Corp | A light-emitting diode with a protective layer of the region |
| JP5589942B2 (ja) | 2011-04-15 | 2014-09-17 | 豊田合成株式会社 | 半導体発光チップの製造方法 |
| KR101259483B1 (ko) | 2011-06-01 | 2013-05-06 | 서울옵토디바이스주식회사 | 반도체 발광 소자 및 그 제조 방법 |
| KR20130007030A (ko) * | 2011-06-28 | 2013-01-18 | (주)세미머티리얼즈 | 무반사막을 갖는 발광소자 및 그 제조 방법 |
| GB2494008A (en) * | 2011-08-23 | 2013-02-27 | Oclaro Technology Ltd | semiconductor laser device and a method for manufacturing a semiconductor laser device |
| US20140225062A1 (en) | 2011-10-05 | 2014-08-14 | Sharp Kabushiki Kaisha | Nitride semiconductor light emitting element and method for manufacturing nitride semiconductor light emitting element |
| JP6125176B2 (ja) * | 2012-08-27 | 2017-05-10 | シャープ株式会社 | 高透過率保護膜作製方法および半導体発光素子の製造方法 |
| US9276170B2 (en) * | 2012-10-23 | 2016-03-01 | Toyoda Gosei Co., Ltd. | Semiconductor light emitting element and method of manufacturing semiconductor light emitting element |
| JP5920186B2 (ja) * | 2012-11-20 | 2016-05-18 | 豊田合成株式会社 | 半導体発光素子の製造方法および半導体発光素子 |
| JP5929705B2 (ja) | 2012-10-23 | 2016-06-08 | 豊田合成株式会社 | 半導体発光素子および半導体発光素子の製造方法 |
| JP6068091B2 (ja) | 2012-10-24 | 2017-01-25 | スタンレー電気株式会社 | 発光素子 |
| JP2014216470A (ja) | 2013-04-25 | 2014-11-17 | スタンレー電気株式会社 | 半導体発光素子 |
| DE102013104270A1 (de) * | 2013-04-26 | 2014-10-30 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
| JP2015082612A (ja) | 2013-10-23 | 2015-04-27 | 旭化成株式会社 | 窒化物発光素子および窒化物発光素子の製造方法 |
| JP6187156B2 (ja) * | 2013-10-29 | 2017-08-30 | 日亜化学工業株式会社 | 窒化物半導体素子の製造方法 |
| JP2015130470A (ja) * | 2013-12-05 | 2015-07-16 | 豊田合成株式会社 | Iii族窒化物半導体発光素子およびその製造方法 |
| JP6136908B2 (ja) * | 2013-12-12 | 2017-05-31 | 豊田合成株式会社 | 発光素子の製造方法 |
| JP6561367B2 (ja) | 2014-02-26 | 2019-08-21 | 学校法人 名城大学 | npn型窒化物半導体発光素子の製造方法 |
| JP5907210B2 (ja) | 2014-05-26 | 2016-04-26 | 株式会社リコー | 半導体装置の製造方法 |
| CN104409585B (zh) * | 2014-11-28 | 2017-11-24 | 杭州士兰明芯科技有限公司 | 一种垂直led结构及其制作方法 |
| JP6476854B2 (ja) | 2014-12-26 | 2019-03-06 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| JP6146455B2 (ja) * | 2015-03-24 | 2017-06-14 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| US9873170B2 (en) * | 2015-03-24 | 2018-01-23 | Nichia Corporation | Method of manufacturing light emitting element |
| JP2017107921A (ja) * | 2015-12-07 | 2017-06-15 | 株式会社ディスコ | ウエーハの加工方法 |
| US10505072B2 (en) | 2016-12-16 | 2019-12-10 | Nichia Corporation | Method for manufacturing light emitting element |
| JP6669144B2 (ja) * | 2016-12-16 | 2020-03-18 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| JP6504194B2 (ja) * | 2017-03-31 | 2019-04-24 | 日亜化学工業株式会社 | 発光素子の製造方法 |
-
2017
- 2017-09-07 JP JP2017171833A patent/JP6669144B2/ja active Active
- 2017-12-14 AU AU2017276283A patent/AU2017276283B2/en active Active
- 2017-12-15 BR BR102017027106-4A patent/BR102017027106B1/pt active IP Right Grant
- 2017-12-15 TW TW106144121A patent/TWI759384B/zh active
- 2017-12-15 KR KR1020170173095A patent/KR102438948B1/ko active Active
- 2017-12-15 EP EP22181047.6A patent/EP4086976B1/en active Active
- 2017-12-15 MY MYPI2017704845A patent/MY198985A/en unknown
- 2017-12-15 CN CN202211539888.7A patent/CN115863494A/zh active Pending
- 2017-12-15 TW TW111106289A patent/TWI816308B/zh active
-
2019
- 2019-10-02 JP JP2019181932A patent/JP7144684B2/ja active Active
-
2022
- 2022-08-25 KR KR1020220106758A patent/KR102549581B1/ko active Active
- 2022-09-01 JP JP2022139459A patent/JP7445160B2/ja active Active
-
2023
- 2023-11-13 US US18/507,177 patent/US12218271B2/en active Active
-
2024
- 2024-02-21 JP JP2024024363A patent/JP7590680B2/ja active Active
- 2024-12-27 US US19/003,702 patent/US20250324819A1/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019220723A (ja) * | 2016-12-16 | 2019-12-26 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| JP7144684B2 (ja) | 2016-12-16 | 2022-09-30 | 日亜化学工業株式会社 | 発光素子 |
| JP2022164879A (ja) * | 2016-12-16 | 2022-10-27 | 日亜化学工業株式会社 | 発光素子の製造方法 |
| JP7445160B2 (ja) | 2016-12-16 | 2024-03-07 | 日亜化学工業株式会社 | 発光素子 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220123614A (ko) | 2022-09-08 |
| KR102438948B1 (ko) | 2022-08-31 |
| JP7144684B2 (ja) | 2022-09-30 |
| AU2017276283A1 (en) | 2018-07-05 |
| TWI816308B (zh) | 2023-09-21 |
| US12218271B2 (en) | 2025-02-04 |
| TW202404123A (zh) | 2024-01-16 |
| US20250324819A1 (en) | 2025-10-16 |
| CN115863494A (zh) | 2023-03-28 |
| TW202224210A (zh) | 2022-06-16 |
| BR102017027106B1 (pt) | 2023-12-12 |
| JP2019220723A (ja) | 2019-12-26 |
| US20240079517A1 (en) | 2024-03-07 |
| KR102549581B1 (ko) | 2023-06-28 |
| JP2018101771A (ja) | 2018-06-28 |
| JP7445160B2 (ja) | 2024-03-07 |
| KR20180070489A (ko) | 2018-06-26 |
| TWI759384B (zh) | 2022-04-01 |
| AU2017276283B2 (en) | 2022-05-12 |
| BR102017027106A2 (pt) | 2018-07-17 |
| JP7590680B2 (ja) | 2024-11-27 |
| EP4086976A1 (en) | 2022-11-09 |
| JP2024056981A (ja) | 2024-04-23 |
| JP2022164879A (ja) | 2022-10-27 |
| MY198985A (en) | 2023-10-06 |
| TW201830730A (zh) | 2018-08-16 |
| EP4086976B1 (en) | 2025-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7590680B2 (ja) | 発光素子の製造方法 | |
| US20130234182A1 (en) | Semiconductor light emitting device | |
| TW202044614A (zh) | 半導體發光元件以及半導體發光元件的製造方法 | |
| US10892382B2 (en) | Semiconductor light-emitting element | |
| US11855238B2 (en) | Light emitting element | |
| JP6504194B2 (ja) | 発光素子の製造方法 | |
| JP2016171141A (ja) | 窒化物発光素子および窒化物発光素子の製造方法 | |
| TWI900899B (zh) | 發光元件之製造方法、及發光元件 | |
| JP2007158130A (ja) | Iii族窒化物系化合物半導体光素子及びその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20171220 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180213 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20181129 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190108 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190308 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20190806 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191002 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200128 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200210 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6669144 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |