JP6669144B2 - 発光素子の製造方法 - Google Patents

発光素子の製造方法 Download PDF

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Publication number
JP6669144B2
JP6669144B2 JP2017171833A JP2017171833A JP6669144B2 JP 6669144 B2 JP6669144 B2 JP 6669144B2 JP 2017171833 A JP2017171833 A JP 2017171833A JP 2017171833 A JP2017171833 A JP 2017171833A JP 6669144 B2 JP6669144 B2 JP 6669144B2
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Japan
Prior art keywords
substrate
light emitting
nitride semiconductor
layer
region
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JP2017171833A
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English (en)
Japanese (ja)
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JP2018101771A (ja
Inventor
俊 北濱
俊 北濱
芳樹 井上
芳樹 井上
永峰 和浩
和浩 永峰
成田 准也
准也 成田
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Nichia Corp
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Nichia Corp
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Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to AU2017276283A priority Critical patent/AU2017276283B2/en
Priority to US15/842,655 priority patent/US10505072B2/en
Priority to BR102017027106-4A priority patent/BR102017027106B1/pt
Priority to CN202211539888.7A priority patent/CN115863494A/zh
Priority to EP17207634.1A priority patent/EP3336907B1/en
Priority to EP21160607.4A priority patent/EP3848982B1/en
Priority to TW112137806A priority patent/TWI900899B/zh
Priority to MYPI2017704845A priority patent/MY198985A/en
Priority to CN201711347059.8A priority patent/CN108206226B/zh
Priority to TW111106289A priority patent/TWI816308B/zh
Priority to KR1020170173095A priority patent/KR102438948B1/ko
Priority to EP22181047.6A priority patent/EP4086976B1/en
Priority to TW106144121A priority patent/TWI759384B/zh
Publication of JP2018101771A publication Critical patent/JP2018101771A/ja
Priority to US16/677,287 priority patent/US11056612B2/en
Application granted granted Critical
Publication of JP6669144B2 publication Critical patent/JP6669144B2/ja
Priority to US17/338,446 priority patent/US11855238B2/en
Priority to KR1020220106758A priority patent/KR102549581B1/ko
Priority to US18/507,177 priority patent/US12218271B2/en
Priority to US19/003,702 priority patent/US20250324819A1/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0137Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/813Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/021Singulating, e.g. dicing
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/032Manufacture or treatment of electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/034Manufacture or treatment of coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/816Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
    • H10H20/8162Current-blocking structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/822Materials of the light-emitting regions
    • H10H20/824Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/83Electrodes
    • H10H20/831Electrodes characterised by their shape
    • H10H20/8312Electrodes characterised by their shape extending at least partially through the bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/84Coatings, e.g. passivation layers or antireflective coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
JP2017171833A 2016-12-16 2017-09-07 発光素子の製造方法 Active JP6669144B2 (ja)

Priority Applications (18)

Application Number Priority Date Filing Date Title
US15/842,655 US10505072B2 (en) 2016-12-16 2017-12-14 Method for manufacturing light emitting element
AU2017276283A AU2017276283B2 (en) 2016-12-16 2017-12-14 Method for manufacturing light emitting element
EP22181047.6A EP4086976B1 (en) 2016-12-16 2017-12-15 Light emitting element
EP17207634.1A EP3336907B1 (en) 2016-12-16 2017-12-15 Method for manufacturing light emitting element and light emitting element
EP21160607.4A EP3848982B1 (en) 2016-12-16 2017-12-15 Method for manufacturing light emitting element
TW112137806A TWI900899B (zh) 2016-12-16 2017-12-15 發光元件之製造方法、及發光元件
MYPI2017704845A MY198985A (en) 2016-12-16 2017-12-15 Method for manufacturing light emitting element
CN201711347059.8A CN108206226B (zh) 2016-12-16 2017-12-15 发光元件的制造方法及发光元件
TW111106289A TWI816308B (zh) 2016-12-16 2017-12-15 發光元件之製造方法、及發光元件
KR1020170173095A KR102438948B1 (ko) 2016-12-16 2017-12-15 발광소자의 제조 방법
BR102017027106-4A BR102017027106B1 (pt) 2016-12-16 2017-12-15 Método para fabricar uma pluralidade de elementos emissores de luz, e, elemento emissor de luz
TW106144121A TWI759384B (zh) 2016-12-16 2017-12-15 發光元件之製造方法、及發光元件
CN202211539888.7A CN115863494A (zh) 2016-12-16 2017-12-15 发光元件的制造方法及发光元件
US16/677,287 US11056612B2 (en) 2016-12-16 2019-11-07 Light emitting element
US17/338,446 US11855238B2 (en) 2016-12-16 2021-06-03 Light emitting element
KR1020220106758A KR102549581B1 (ko) 2016-12-16 2022-08-25 발광소자의 제조 방법
US18/507,177 US12218271B2 (en) 2016-12-16 2023-11-13 Light emitting element
US19/003,702 US20250324819A1 (en) 2016-12-16 2024-12-27 Light emitting element

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016243899 2016-12-16
JP2016243899 2016-12-16

Related Child Applications (1)

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JP2019181932A Division JP7144684B2 (ja) 2016-12-16 2019-10-02 発光素子

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JP2018101771A JP2018101771A (ja) 2018-06-28
JP6669144B2 true JP6669144B2 (ja) 2020-03-18

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JP2017171833A Active JP6669144B2 (ja) 2016-12-16 2017-09-07 発光素子の製造方法
JP2019181932A Active JP7144684B2 (ja) 2016-12-16 2019-10-02 発光素子
JP2022139459A Active JP7445160B2 (ja) 2016-12-16 2022-09-01 発光素子
JP2024024363A Active JP7590680B2 (ja) 2016-12-16 2024-02-21 発光素子の製造方法

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JP2022139459A Active JP7445160B2 (ja) 2016-12-16 2022-09-01 発光素子
JP2024024363A Active JP7590680B2 (ja) 2016-12-16 2024-02-21 発光素子の製造方法

Country Status (9)

Country Link
US (2) US12218271B2 (cg-RX-API-DMAC7.html)
EP (1) EP4086976B1 (cg-RX-API-DMAC7.html)
JP (4) JP6669144B2 (cg-RX-API-DMAC7.html)
KR (2) KR102438948B1 (cg-RX-API-DMAC7.html)
CN (1) CN115863494A (cg-RX-API-DMAC7.html)
AU (1) AU2017276283B2 (cg-RX-API-DMAC7.html)
BR (1) BR102017027106B1 (cg-RX-API-DMAC7.html)
MY (1) MY198985A (cg-RX-API-DMAC7.html)
TW (2) TWI759384B (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019220723A (ja) * 2016-12-16 2019-12-26 日亜化学工業株式会社 発光素子の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339509B2 (ja) 2019-08-02 2023-09-06 日亜化学工業株式会社 発光素子の製造方法

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4084116A (en) * 1976-09-20 1978-04-11 International Business Machines Corporation Procedure for tightening tape wraps on a spindle
JPS5342956A (en) * 1976-09-25 1978-04-18 Toshio Uenishi Method of stitching visor of cap
JPH04103666U (ja) * 1991-02-18 1992-09-07 日亜化学工業株式会社 青色発光デバイスの電極
JP2836685B2 (ja) * 1993-02-02 1998-12-14 日亜化学工業株式会社 p型窒化ガリウム系化合物半導体の製造方法
JPH07235731A (ja) * 1994-02-24 1995-09-05 Fujitsu Ltd 化合物半導体装置の製造方法
JPH08306643A (ja) * 1995-04-28 1996-11-22 Sumitomo Chem Co Ltd 3−5族化合物半導体用電極および発光素子
JPH09162441A (ja) * 1995-12-05 1997-06-20 Toshiba Corp 半導体装置及びその製造方法
JPH10294531A (ja) * 1997-02-21 1998-11-04 Toshiba Corp 窒化物化合物半導体発光素子
WO1998039827A1 (en) 1997-03-07 1998-09-11 Sharp Kabushiki Kaisha Gallium nitride semiconductor light emitting element with active layer having multiplex quantum well structure and semiconductor laser light source device
JP3741528B2 (ja) * 1997-12-15 2006-02-01 シャープ株式会社 窒化ガリウム系半導体素子の製造方法
JP2000294828A (ja) * 1999-04-07 2000-10-20 Mitsubishi Cable Ind Ltd GaN系半導体素子の製造方法
JP2000353822A (ja) 1999-06-11 2000-12-19 Hitachi Ltd 窒化ガリウム系化合物半導体発光素子およびその製造方法
JP3723434B2 (ja) 1999-09-24 2005-12-07 三洋電機株式会社 半導体発光素子
JP3626442B2 (ja) 2000-09-13 2005-03-09 浜松ホトニクス株式会社 レーザ加工方法
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
EP1387453B1 (en) * 2001-04-12 2009-11-11 Nichia Corporation Gallium nitride compound semiconductor element
JP2002009392A (ja) 2001-06-22 2002-01-11 Matsushita Electric Ind Co Ltd 半導体発光素子およびその製造方法
JP2004088086A (ja) * 2002-06-25 2004-03-18 Toyota Central Res & Dev Lab Inc 半導体レーザ素子とその製造方法
JP4056481B2 (ja) * 2003-02-07 2008-03-05 三洋電機株式会社 半導体素子およびその製造方法
JP4385746B2 (ja) 2003-11-28 2009-12-16 三菱化学株式会社 窒化物系半導体素子の製造方法
JP3910603B2 (ja) 2004-06-07 2007-04-25 株式会社東芝 熱処理装置、熱処理方法及び半導体装置の製造方法
GB2432455A (en) * 2005-11-17 2007-05-23 Sharp Kk Growth of a semiconductor layer structure
JP5522490B2 (ja) 2005-11-30 2014-06-18 株式会社リコー 面発光レーザ素子、それを備えた面発光レーザアレイ、面発光レーザ素子または面発光レーザアレイを備えた電子写真システムおよび面発光レーザ素子または面発光レーザアレイを備えた光通信システム
JP5194432B2 (ja) 2005-11-30 2013-05-08 株式会社リコー 面発光レーザ素子
JP4535997B2 (ja) 2005-12-09 2010-09-01 シャープ株式会社 窒化物半導体レーザ素子およびその製造方法
JP4940987B2 (ja) 2006-03-20 2012-05-30 日亜化学工業株式会社 窒化物半導体レーザ素子及びその製造方法
US20070298529A1 (en) 2006-05-31 2007-12-27 Toyoda Gosei, Co., Ltd. Semiconductor light-emitting device and method for separating semiconductor light-emitting devices
JP5232375B2 (ja) 2006-10-13 2013-07-10 アイシン精機株式会社 半導体発光素子の分離方法
JP2009176781A (ja) * 2008-01-21 2009-08-06 Mitsubishi Chemicals Corp GaN系LEDチップおよびGaN系LEDチップの製造方法
KR101205527B1 (ko) * 2009-01-15 2012-11-27 서울옵토디바이스주식회사 발광 다이오드 및 그 제조 방법
US20100291772A1 (en) * 2009-05-15 2010-11-18 Yang Cheng-Chung Semiconductor Manufacturing Method
JP2011129765A (ja) * 2009-12-18 2011-06-30 Showa Denko Kk 半導体発光素子の製造方法
JP2011233783A (ja) 2010-04-28 2011-11-17 Mitsubishi Heavy Ind Ltd 半導体発光素子、半導体発光素子の保護膜及びその作製方法
JP2011243875A (ja) * 2010-05-20 2011-12-01 Disco Abrasive Syst Ltd サファイアウェーハの分割方法
JP2012000636A (ja) * 2010-06-16 2012-01-05 Showa Denko Kk レーザ加工方法
US8877612B2 (en) 2010-06-16 2014-11-04 Toyoda Gosei Co., Ltd. Laser processing method
JP2012004313A (ja) * 2010-06-16 2012-01-05 Showa Denko Kk レーザ加工方法
JP5625522B2 (ja) * 2010-06-16 2014-11-19 豊田合成株式会社 レーザ加工方法
JP2012028381A (ja) 2010-07-20 2012-02-09 Sharp Corp 半導体発光素子およびその製造方法
KR100988194B1 (ko) * 2010-07-26 2010-10-18 (주)더리즈 반도체 발광 소자 및 그 제조 방법
TWI462338B (zh) * 2010-08-16 2014-11-21 Lextar Electronics Corp A light-emitting diode with a protective layer of the region
JP5589942B2 (ja) 2011-04-15 2014-09-17 豊田合成株式会社 半導体発光チップの製造方法
KR101259483B1 (ko) 2011-06-01 2013-05-06 서울옵토디바이스주식회사 반도체 발광 소자 및 그 제조 방법
KR20130007030A (ko) * 2011-06-28 2013-01-18 (주)세미머티리얼즈 무반사막을 갖는 발광소자 및 그 제조 방법
GB2494008A (en) * 2011-08-23 2013-02-27 Oclaro Technology Ltd semiconductor laser device and a method for manufacturing a semiconductor laser device
US20140225062A1 (en) 2011-10-05 2014-08-14 Sharp Kabushiki Kaisha Nitride semiconductor light emitting element and method for manufacturing nitride semiconductor light emitting element
JP6125176B2 (ja) * 2012-08-27 2017-05-10 シャープ株式会社 高透過率保護膜作製方法および半導体発光素子の製造方法
US9276170B2 (en) * 2012-10-23 2016-03-01 Toyoda Gosei Co., Ltd. Semiconductor light emitting element and method of manufacturing semiconductor light emitting element
JP5920186B2 (ja) * 2012-11-20 2016-05-18 豊田合成株式会社 半導体発光素子の製造方法および半導体発光素子
JP5929705B2 (ja) 2012-10-23 2016-06-08 豊田合成株式会社 半導体発光素子および半導体発光素子の製造方法
JP6068091B2 (ja) 2012-10-24 2017-01-25 スタンレー電気株式会社 発光素子
JP2014216470A (ja) 2013-04-25 2014-11-17 スタンレー電気株式会社 半導体発光素子
DE102013104270A1 (de) * 2013-04-26 2014-10-30 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP2015082612A (ja) 2013-10-23 2015-04-27 旭化成株式会社 窒化物発光素子および窒化物発光素子の製造方法
JP6187156B2 (ja) * 2013-10-29 2017-08-30 日亜化学工業株式会社 窒化物半導体素子の製造方法
JP2015130470A (ja) * 2013-12-05 2015-07-16 豊田合成株式会社 Iii族窒化物半導体発光素子およびその製造方法
JP6136908B2 (ja) * 2013-12-12 2017-05-31 豊田合成株式会社 発光素子の製造方法
JP6561367B2 (ja) 2014-02-26 2019-08-21 学校法人 名城大学 npn型窒化物半導体発光素子の製造方法
JP5907210B2 (ja) 2014-05-26 2016-04-26 株式会社リコー 半導体装置の製造方法
CN104409585B (zh) * 2014-11-28 2017-11-24 杭州士兰明芯科技有限公司 一种垂直led结构及其制作方法
JP6476854B2 (ja) 2014-12-26 2019-03-06 日亜化学工業株式会社 発光素子の製造方法
JP6146455B2 (ja) * 2015-03-24 2017-06-14 日亜化学工業株式会社 発光素子の製造方法
US9873170B2 (en) * 2015-03-24 2018-01-23 Nichia Corporation Method of manufacturing light emitting element
JP2017107921A (ja) * 2015-12-07 2017-06-15 株式会社ディスコ ウエーハの加工方法
US10505072B2 (en) 2016-12-16 2019-12-10 Nichia Corporation Method for manufacturing light emitting element
JP6669144B2 (ja) * 2016-12-16 2020-03-18 日亜化学工業株式会社 発光素子の製造方法
JP6504194B2 (ja) * 2017-03-31 2019-04-24 日亜化学工業株式会社 発光素子の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019220723A (ja) * 2016-12-16 2019-12-26 日亜化学工業株式会社 発光素子の製造方法
JP7144684B2 (ja) 2016-12-16 2022-09-30 日亜化学工業株式会社 発光素子
JP2022164879A (ja) * 2016-12-16 2022-10-27 日亜化学工業株式会社 発光素子の製造方法
JP7445160B2 (ja) 2016-12-16 2024-03-07 日亜化学工業株式会社 発光素子

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