JP6657770B2 - 液体組成物およびこれを用いたエッチング方法 - Google Patents

液体組成物およびこれを用いたエッチング方法 Download PDF

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Publication number
JP6657770B2
JP6657770B2 JP2015208989A JP2015208989A JP6657770B2 JP 6657770 B2 JP6657770 B2 JP 6657770B2 JP 2015208989 A JP2015208989 A JP 2015208989A JP 2015208989 A JP2015208989 A JP 2015208989A JP 6657770 B2 JP6657770 B2 JP 6657770B2
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Prior art keywords
acid
liquid composition
copper
main component
etching
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JP2016108659A (ja
Inventor
秀範 竹内
秀範 竹内
邦夫 夕部
邦夫 夕部
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Mitsubishi Gas Chemical Co Inc
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Mitsubishi Gas Chemical Co Inc
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Thin Film Transistor (AREA)
JP2015208989A 2014-11-27 2015-10-23 液体組成物およびこれを用いたエッチング方法 Active JP6657770B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014239524 2014-11-27
JP2014239524 2014-11-27

Publications (2)

Publication Number Publication Date
JP2016108659A JP2016108659A (ja) 2016-06-20
JP6657770B2 true JP6657770B2 (ja) 2020-03-04

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JP2015208989A Active JP6657770B2 (ja) 2014-11-27 2015-10-23 液体組成物およびこれを用いたエッチング方法

Country Status (4)

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JP (1) JP6657770B2 (zh)
KR (1) KR102328443B1 (zh)
CN (2) CN115125536A (zh)
TW (1) TWI667373B (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105803459B (zh) * 2016-05-03 2019-01-15 苏州晶瑞化学股份有限公司 一种微电子用多层金属膜蚀刻液及其应用
CN105970225B (zh) * 2016-07-01 2018-07-13 苏州博洋化学股份有限公司 一种铝蚀刻剂及其制备方法
WO2018047210A1 (ja) * 2016-09-09 2018-03-15 パナソニックＩｐマネジメント株式会社 多層膜用エッチング液とエッチング濃縮液およびエッチング方法
CN109844910B (zh) * 2016-10-21 2023-04-28 株式会社Adeka 蚀刻液组合物和蚀刻方法
KR20180060489A (ko) 2016-11-29 2018-06-07 삼성전자주식회사 식각용 조성물 및 이를 이용한 반도체 장치 제조 방법
CN106498398A (zh) * 2016-12-01 2017-03-15 深圳市华星光电技术有限公司 用于铜/钼膜层的金属蚀刻液及其蚀刻方法
JP6850650B2 (ja) * 2017-03-27 2021-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
WO2018181896A1 (ja) 2017-03-31 2018-10-04 関東化學株式会社 チタン層またはチタン含有層のエッチング液組成物およびエッチング方法
US20190040316A1 (en) * 2017-08-04 2019-02-07 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Etching solution of igzo film layer and etching method of the same
CN107978607B (zh) * 2017-11-21 2020-04-28 深圳市华星光电半导体显示技术有限公司 背沟道蚀刻型氧化物半导体tft基板的制作方法
WO2019180915A1 (ja) * 2018-03-23 2019-09-26 パナソニックＩｐマネジメント株式会社 銅厚膜用エッチング液
US11230668B2 (en) 2018-03-26 2022-01-25 Mitsubishi Gas Chemical Company, Inc. Etchant
TWI759450B (zh) * 2018-03-27 2022-04-01 日商三菱瓦斯化學股份有限公司 蝕刻液、蝕刻方法、及顯示裝置之製造方法
CN109112545A (zh) * 2018-09-25 2019-01-01 惠州市宙邦化工有限公司 一种铜钼合金膜的化学蚀刻用组合物
KR102562490B1 (ko) * 2018-10-29 2023-08-03 솔브레인 주식회사 식각액 조성물 및 이를 이용한 금속막 식각 방법
CN109576717A (zh) * 2018-11-29 2019-04-05 广东工业大学 一种坡莫合金丝表面退铜剂及其制备方法和应用
JP6485587B1 (ja) * 2018-12-25 2019-03-20 三菱瓦斯化学株式会社 エッチング液
CN110644001A (zh) * 2019-10-22 2020-01-03 湖北兴福电子材料有限公司 一种铜蚀刻液
CN114032548A (zh) * 2021-11-11 2022-02-11 河南慧泽生物工程有限公司 一种印刷电路板铜箔蚀刻液
CN114989826A (zh) * 2022-06-06 2022-09-02 江苏和达电子科技有限公司 一种用于金属层和半导体层形态控制的蚀刻液及其应用
CN116497355B (zh) * 2023-04-10 2024-03-22 珠海市裕洲环保科技有限公司 一种酸性铜蚀刻液及其应用

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4378270A (en) * 1981-10-29 1983-03-29 Learonal, Inc. Method of etching circuit boards and recovering copper from the spent etch solutions
DE102005038414A1 (de) * 2005-08-12 2007-02-15 Basf Aktiengesellschaft Stabilisierte Ätzlösungen zum Ätzen von Cu- und Cu/Ni-Schicht
CN101952485A (zh) 2007-11-22 2011-01-19 出光兴产株式会社 蚀刻液组合物
JP5403922B2 (ja) * 2008-02-26 2014-01-29 富士フイルム株式会社 研磨液および研磨方法
CN102576170B (zh) 2009-08-20 2014-12-17 东友精细化工有限公司 制造用于液晶显示器的阵列基板的方法
EP2518759B1 (en) * 2009-12-25 2017-06-21 Mitsubishi Gas Chemical Company, Inc. Method for manufacturing semiconductor device using an etchant
US9365770B2 (en) * 2011-07-26 2016-06-14 Mitsubishi Gas Chemical Company, Inc. Etching solution for copper/molybdenum-based multilayer thin film
JP2014032998A (ja) * 2012-08-01 2014-02-20 Panasonic Liquid Crystal Display Co Ltd 薄膜トランジスタの製造方法
KR20140118492A (ko) * 2013-03-29 2014-10-08 동우 화인켐 주식회사 구리계 금속막 식각액 조성물 및 이를 이용한 배선 형성 방법
JP6531612B2 (ja) * 2014-11-27 2019-06-19 三菱瓦斯化学株式会社 液体組成物およびこれを用いたエッチング方法

Also Published As

Publication number Publication date
JP2016108659A (ja) 2016-06-20
CN115125536A (zh) 2022-09-30
TWI667373B (zh) 2019-08-01
KR20160064013A (ko) 2016-06-07
CN105648439A (zh) 2016-06-08
KR102328443B1 (ko) 2021-11-18
TW201627533A (zh) 2016-08-01

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