JP6645396B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP6645396B2 JP6645396B2 JP2016199127A JP2016199127A JP6645396B2 JP 6645396 B2 JP6645396 B2 JP 6645396B2 JP 2016199127 A JP2016199127 A JP 2016199127A JP 2016199127 A JP2016199127 A JP 2016199127A JP 6645396 B2 JP6645396 B2 JP 6645396B2
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- G—PHYSICS
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- G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
- G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
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- G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
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- General Physics & Mathematics (AREA)
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- Inverter Devices (AREA)
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Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
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| JP2016199127A JP6645396B2 (ja) | 2016-10-07 | 2016-10-07 | 半導体装置 |
| CN201780060940.1A CN109791926A (zh) | 2016-10-07 | 2017-09-27 | 半导体装置 |
| PCT/JP2017/034829 WO2018066420A1 (ja) | 2016-10-07 | 2017-09-27 | 半導体装置 |
| US16/360,341 US10998295B2 (en) | 2016-10-07 | 2019-03-21 | Semiconductor device |
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| JP2018060966A5 JP2018060966A5 (enExample) | 2018-12-20 |
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| DE102018207308B4 (de) * | 2018-05-09 | 2020-07-02 | Infineon Technologies Ag | Halbleiterbauteil mit integriertem shunt-widerstand und verfahren zu dessen herstellung |
| JP2020047725A (ja) * | 2018-09-18 | 2020-03-26 | トヨタ自動車株式会社 | 半導体装置 |
| JP7338204B2 (ja) * | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | 半導体装置 |
| JP7479759B2 (ja) * | 2020-06-02 | 2024-05-09 | 三菱電機株式会社 | 半導体装置の製造方法、および、半導体装置 |
| US11555832B2 (en) * | 2021-03-02 | 2023-01-17 | Allegro Microsystems, Llc | Integrated shunt and magnetic field current sensor |
| EP4443734A1 (en) * | 2023-04-06 | 2024-10-09 | Hamilton Sundstrand Corporation | Shoot-through protection and current monitoring scheme for multilevel power converters |
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| WO2015099794A1 (en) * | 2013-12-27 | 2015-07-02 | Intel Corporation | Power delivery system for an electronic device |
| JP6384112B2 (ja) * | 2014-04-25 | 2018-09-05 | 三菱マテリアル株式会社 | パワーモジュール用基板及びヒートシンク付パワーモジュール用基板 |
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| US20190221549A1 (en) | 2019-07-18 |
| WO2018066420A1 (ja) | 2018-04-12 |
| JP2018060966A (ja) | 2018-04-12 |
| CN109791926A (zh) | 2019-05-21 |
| US10998295B2 (en) | 2021-05-04 |
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