JP6562305B2 - 板ガラスの製造方法及び製造装置 - Google Patents
板ガラスの製造方法及び製造装置 Download PDFInfo
- Publication number
- JP6562305B2 JP6562305B2 JP2015236792A JP2015236792A JP6562305B2 JP 6562305 B2 JP6562305 B2 JP 6562305B2 JP 2015236792 A JP2015236792 A JP 2015236792A JP 2015236792 A JP2015236792 A JP 2015236792A JP 6562305 B2 JP6562305 B2 JP 6562305B2
- Authority
- JP
- Japan
- Prior art keywords
- plate glass
- processing
- glass
- standby position
- end surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015236792A JP6562305B2 (ja) | 2015-12-03 | 2015-12-03 | 板ガラスの製造方法及び製造装置 |
CN201680052737.5A CN108025415B (zh) | 2015-12-03 | 2016-11-09 | 板状玻璃的制造方法以及制造装置 |
KR1020187004034A KR102493145B1 (ko) | 2015-12-03 | 2016-11-09 | 판유리의 제조 방법 및 제조 장치 |
PCT/JP2016/083236 WO2017094462A1 (ja) | 2015-12-03 | 2016-11-09 | 板ガラスの製造方法及び製造装置 |
TW105137482A TWI683774B (zh) | 2015-12-03 | 2016-11-16 | 平板玻璃的製造方法及製造裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015236792A JP6562305B2 (ja) | 2015-12-03 | 2015-12-03 | 板ガラスの製造方法及び製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017100260A JP2017100260A (ja) | 2017-06-08 |
JP6562305B2 true JP6562305B2 (ja) | 2019-08-21 |
Family
ID=58797122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015236792A Active JP6562305B2 (ja) | 2015-12-03 | 2015-12-03 | 板ガラスの製造方法及び製造装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6562305B2 (ko) |
KR (1) | KR102493145B1 (ko) |
CN (1) | CN108025415B (ko) |
TW (1) | TWI683774B (ko) |
WO (1) | WO2017094462A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201843118A (zh) * | 2017-05-02 | 2018-12-16 | 日商日本電氣硝子股份有限公司 | 板玻璃的製造方法以及製造裝置 |
CN108057636A (zh) * | 2017-12-14 | 2018-05-22 | 北京铂阳顶荣光伏科技有限公司 | 全自动检测基板尺寸设备、基板检测线及其检测方法 |
CN109227257B (zh) * | 2018-12-12 | 2019-03-22 | 山东创惠电子科技有限责任公司 | 一种玻璃面板抛光机床及抛光方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0625010Y2 (ja) * | 1988-10-19 | 1994-06-29 | 株式会社東京精密 | ウエハの受渡し機構 |
DE4002405A1 (de) * | 1989-04-06 | 1990-10-11 | Thielenhaus Ernst Kg | Werkzeugmaschine, insbes. feinschleifmaschine |
JPH1149529A (ja) * | 1998-03-27 | 1999-02-23 | Bando Kiko Kk | ガラス板の加工装置 |
JP2002066919A (ja) * | 2000-09-04 | 2002-03-05 | Marugen Tekkosho:Kk | プリント基板の研磨装置およびその方法 |
JP4566472B2 (ja) * | 2001-07-23 | 2010-10-20 | カワサキプラントシステムズ株式会社 | 板ガラスの割断機構およびトリミング装置 |
JP4192568B2 (ja) | 2002-11-19 | 2008-12-10 | 村田機械株式会社 | 搬送システム |
TWI287528B (en) * | 2002-11-19 | 2007-10-01 | Murata Machinery Ltd | Carrier system |
CN1626310A (zh) * | 2003-12-09 | 2005-06-15 | 三星康宁精密琉璃株式会社 | 玻璃基板边缘研磨系统及其方法 |
JP2009173433A (ja) * | 2008-01-28 | 2009-08-06 | Panasonic Corp | 基板検出装置及び基板搬送装置 |
JP5434014B2 (ja) | 2008-08-22 | 2014-03-05 | 坂東機工株式会社 | ガラス板の加工方法及びガラス板加工装置 |
KR20140007370A (ko) * | 2011-02-01 | 2014-01-17 | 아사히 가라스 가부시키가이샤 | 유리판의 코너부 연삭 가공 방법 및 가공 장치 |
JP5741481B2 (ja) | 2012-02-21 | 2015-07-01 | 坂東機工株式会社 | ガラス板の両サイド加工装置 |
CN204325124U (zh) * | 2014-11-28 | 2015-05-13 | 鹤壁万里建材有限公司 | 泡沫玻璃打磨切割装置 |
CN204643248U (zh) * | 2015-02-06 | 2015-09-16 | Juki株式会社 | 基板输送装置 |
-
2015
- 2015-12-03 JP JP2015236792A patent/JP6562305B2/ja active Active
-
2016
- 2016-11-09 CN CN201680052737.5A patent/CN108025415B/zh active Active
- 2016-11-09 KR KR1020187004034A patent/KR102493145B1/ko active IP Right Grant
- 2016-11-09 WO PCT/JP2016/083236 patent/WO2017094462A1/ja active Application Filing
- 2016-11-16 TW TW105137482A patent/TWI683774B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI683774B (zh) | 2020-02-01 |
KR102493145B1 (ko) | 2023-01-30 |
KR20180091806A (ko) | 2018-08-16 |
JP2017100260A (ja) | 2017-06-08 |
TW201730082A (zh) | 2017-09-01 |
CN108025415A (zh) | 2018-05-11 |
CN108025415B (zh) | 2020-03-17 |
WO2017094462A1 (ja) | 2017-06-08 |
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