JP6557701B2 - 半導体装置パッケージ及びその製造方法 - Google Patents

半導体装置パッケージ及びその製造方法 Download PDF

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JP6557701B2
JP6557701B2 JP2017091536A JP2017091536A JP6557701B2 JP 6557701 B2 JP6557701 B2 JP 6557701B2 JP 2017091536 A JP2017091536 A JP 2017091536A JP 2017091536 A JP2017091536 A JP 2017091536A JP 6557701 B2 JP6557701 B2 JP 6557701B2
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semiconductor device
isolation layer
device package
interconnect layer
layer
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JP2017204635A (ja
JP2017204635A5 (enExample
Inventor
天賜 陳
天賜 陳
光雄 陳
光雄 陳
聖民 王
聖民 王
育穎 李
育穎 李
▲ゆ▼慈 彭
▲ゆ▼慈 彭
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日月光半導体製造股▲ふん▼有限公司
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    • H10W70/093—
    • H10W70/09—
    • H10W70/60—
    • H10W90/00—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W70/095—
    • H10W70/611—
    • H10W70/635—
    • H10W70/6523—
    • H10W72/01—
    • H10W72/01204—
    • H10W72/01223—
    • H10W72/01225—
    • H10W72/0198—
    • H10W72/07307—
    • H10W72/221—
    • H10W72/225—
    • H10W72/227—
    • H10W72/234—
    • H10W72/241—
    • H10W72/242—
    • H10W72/244—
    • H10W72/252—
    • H10W72/253—
    • H10W72/823—
    • H10W72/874—
    • H10W72/884—
    • H10W72/923—
    • H10W72/932—
    • H10W72/934—
    • H10W72/9413—
    • H10W72/942—
    • H10W72/981—
    • H10W72/985—
    • H10W72/987—
    • H10W74/117—
    • H10W74/142—
    • H10W74/15—
    • H10W90/22—
    • H10W90/24—
    • H10W90/291—
    • H10W90/401—
    • H10W90/722—
    • H10W90/724—
    • H10W90/732—
    • H10W90/734—
    • H10W90/754—
    • H10W99/00—

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2017091536A 2016-05-11 2017-05-02 半導体装置パッケージ及びその製造方法 Active JP6557701B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201662334861P 2016-05-11 2016-05-11
US62/334,861 2016-05-11
US201662352299P 2016-06-20 2016-06-20
US62/352,299 2016-06-20
US15/453,656 2017-03-08
US15/453,656 US10049893B2 (en) 2016-05-11 2017-03-08 Semiconductor device with a conductive post

Publications (3)

Publication Number Publication Date
JP2017204635A JP2017204635A (ja) 2017-11-16
JP2017204635A5 JP2017204635A5 (enExample) 2018-10-18
JP6557701B2 true JP6557701B2 (ja) 2019-08-07

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JP2017091536A Active JP6557701B2 (ja) 2016-05-11 2017-05-02 半導体装置パッケージ及びその製造方法

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US (2) US10049893B2 (enExample)
JP (1) JP6557701B2 (enExample)
CN (2) CN107424970B (enExample)

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EP3449502B1 (en) 2016-04-26 2021-06-30 Linear Technology LLC Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits
US10049893B2 (en) * 2016-05-11 2018-08-14 Advanced Semiconductor Engineering, Inc. Semiconductor device with a conductive post
JP2019040924A (ja) * 2017-08-22 2019-03-14 新光電気工業株式会社 配線基板及びその製造方法と電子装置
US10741482B2 (en) * 2017-12-29 2020-08-11 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US10497635B2 (en) 2018-03-27 2019-12-03 Linear Technology Holding Llc Stacked circuit package with molded base having laser drilled openings for upper package
US11735570B2 (en) * 2018-04-04 2023-08-22 Intel Corporation Fan out packaging pop mechanical attach method
TWI672791B (zh) * 2018-05-07 2019-09-21 財團法人工業技術研究院 晶片封裝結構及其製造方法
US11410977B2 (en) 2018-11-13 2022-08-09 Analog Devices International Unlimited Company Electronic module for high power applications
US11477559B2 (en) * 2019-07-31 2022-10-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and acoustic device having the same
US11235404B2 (en) * 2020-03-21 2022-02-01 International Business Machines Corporation Personalized copper block for selective solder removal
US12501548B2 (en) 2020-05-26 2025-12-16 Lg Innotek Co., Ltd. Package substrate
US11844178B2 (en) 2020-06-02 2023-12-12 Analog Devices International Unlimited Company Electronic component
US11476128B2 (en) 2020-08-25 2022-10-18 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
CN117199053A (zh) * 2022-06-01 2023-12-08 长鑫存储技术有限公司 封装结构及其制作方法、半导体器件
WO2025121102A1 (ja) * 2023-12-04 2025-06-12 株式会社村田製作所 回路モジュール

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JP3361881B2 (ja) * 1994-04-28 2003-01-07 株式会社東芝 半導体装置とその製造方法
US5912510A (en) * 1996-05-29 1999-06-15 Motorola, Inc. Bonding structure for an electronic device
JP4564113B2 (ja) * 1998-11-30 2010-10-20 株式会社東芝 微粒子膜形成方法
TW464927B (en) * 2000-08-29 2001-11-21 Unipac Optoelectronics Corp Metal bump with an insulating sidewall and method of fabricating thereof
US6683375B2 (en) * 2001-06-15 2004-01-27 Fairchild Semiconductor Corporation Semiconductor die including conductive columns
US20030006062A1 (en) * 2001-07-06 2003-01-09 Stone William M. Interconnect system and method of fabrication
JP2003069181A (ja) * 2001-08-28 2003-03-07 Mitsubishi Electric Corp 電子機器装置及びその製造方法
TWI245402B (en) * 2002-01-07 2005-12-11 Megic Corp Rod soldering structure and manufacturing process thereof
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US8383457B2 (en) * 2010-09-03 2013-02-26 Stats Chippac, Ltd. Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
WO2011148658A1 (ja) * 2010-05-24 2011-12-01 シャープ株式会社 走査信号線駆動回路およびそれを備えた表示装置
US8580607B2 (en) * 2010-07-27 2013-11-12 Tessera, Inc. Microelectronic packages with nanoparticle joining
TWI538071B (zh) * 2010-11-16 2016-06-11 星科金朋有限公司 具連接結構之積體電路封裝系統及其製造方法
US8610285B2 (en) * 2011-05-30 2013-12-17 Taiwan Semiconductor Manufacturing Company, Ltd. 3D IC packaging structures and methods with a metal pillar
US8535983B2 (en) * 2011-06-02 2013-09-17 Infineon Technologies Ag Method of manufacturing a semiconductor device
US20130099371A1 (en) 2011-10-21 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package having solder jointed region with controlled ag content
TW201401456A (zh) * 2012-06-19 2014-01-01 矽品精密工業股份有限公司 基板結構與封裝結構
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TWI517318B (zh) 2013-06-14 2016-01-11 日月光半導體製造股份有限公司 具金屬柱組之基板及具金屬柱組之封裝結構
TWI567902B (zh) 2013-06-14 2017-01-21 日月光半導體製造股份有限公司 具定位組之基板組
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US10049893B2 (en) * 2016-05-11 2018-08-14 Advanced Semiconductor Engineering, Inc. Semiconductor device with a conductive post

Also Published As

Publication number Publication date
US20170330870A1 (en) 2017-11-16
US10446411B2 (en) 2019-10-15
CN107424970A (zh) 2017-12-01
JP2017204635A (ja) 2017-11-16
CN110571158B (zh) 2021-12-21
US10049893B2 (en) 2018-08-14
CN110571158A (zh) 2019-12-13
US20180350626A1 (en) 2018-12-06
CN107424970B (zh) 2019-09-20

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