JP6550260B2 - 配線基板及び配線基板の製造方法 - Google Patents

配線基板及び配線基板の製造方法 Download PDF

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Publication number
JP6550260B2
JP6550260B2 JP2015091515A JP2015091515A JP6550260B2 JP 6550260 B2 JP6550260 B2 JP 6550260B2 JP 2015091515 A JP2015091515 A JP 2015091515A JP 2015091515 A JP2015091515 A JP 2015091515A JP 6550260 B2 JP6550260 B2 JP 6550260B2
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JP
Japan
Prior art keywords
layer
wiring
insulating layer
wiring layer
opening
Prior art date
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Application number
JP2015091515A
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English (en)
Japanese (ja)
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JP2016207959A5 (enExample
JP2016207959A (ja
Inventor
小林　和弘
和弘 小林
淳史 佐藤
淳史 佐藤
泰彦 草間
泰彦 草間
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2015091515A priority Critical patent/JP6550260B2/ja
Priority to US15/138,503 priority patent/US9852970B2/en
Publication of JP2016207959A publication Critical patent/JP2016207959A/ja
Publication of JP2016207959A5 publication Critical patent/JP2016207959A5/ja
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Publication of JP6550260B2 publication Critical patent/JP6550260B2/ja
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Classifications

    • H10W70/685—
    • H10W70/60—
    • H10W72/00—
    • H10W72/072—
    • H10W72/07252—
    • H10W72/075—
    • H10W72/20—
    • H10W72/227—
    • H10W72/252—
    • H10W72/354—
    • H10W72/551—
    • H10W72/884—
    • H10W72/951—
    • H10W74/00—
    • H10W74/117—
    • H10W74/15—
    • H10W90/00—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2015091515A 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法 Active JP6550260B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015091515A JP6550260B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法
US15/138,503 US9852970B2 (en) 2015-04-28 2016-04-26 Wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015091515A JP6550260B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2016207959A JP2016207959A (ja) 2016-12-08
JP2016207959A5 JP2016207959A5 (enExample) 2018-02-01
JP6550260B2 true JP6550260B2 (ja) 2019-07-24

Family

ID=57204188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015091515A Active JP6550260B2 (ja) 2015-04-28 2015-04-28 配線基板及び配線基板の製造方法

Country Status (2)

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US (1) US9852970B2 (enExample)
JP (1) JP6550260B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6393566B2 (ja) * 2014-09-17 2018-09-19 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US9969614B2 (en) * 2015-05-29 2018-05-15 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS packages and methods of manufacture thereof
KR102679250B1 (ko) * 2018-09-12 2024-06-28 엘지이노텍 주식회사 연성 회로기판 및 이를 포함하는 칩 패키지, 및 이를 포함하는 전자 디바이스
US11101840B1 (en) * 2020-02-05 2021-08-24 Samsung Electro-Mechanics Co., Ltd. Chip radio frequency package and radio frequency module
US11183765B2 (en) 2020-02-05 2021-11-23 Samsung Electro-Mechanics Co., Ltd. Chip radio frequency package and radio frequency module
CN112349687B (zh) * 2020-09-28 2023-06-16 中国电子科技集团公司第二十九研究所 一种六层布线任意层互联lcp封装基板、制造方法及多芯片系统级封装结构
CN112349692B (zh) * 2020-09-28 2023-06-23 中国电子科技集团公司第二十九研究所 一种气密高导热lcp封装基板及多芯片系统级封装结构
KR102904048B1 (ko) * 2020-11-17 2025-12-26 삼성전자주식회사 반도체 패키지
JP7646495B2 (ja) 2021-08-17 2025-03-17 キオクシア株式会社 半導体装置およびその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4079927B2 (ja) * 2004-09-16 2008-04-23 Ｔｄｋ株式会社 多層基板及びその製造方法
JP2008529283A (ja) * 2005-01-24 2008-07-31 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド 誘電体の表面に埋め込まれた金属トレースを有する相互接続要素を作る構成および方法
US7462784B2 (en) * 2006-05-02 2008-12-09 Ibiden Co., Ltd. Heat resistant substrate incorporated circuit wiring board
KR100836653B1 (ko) * 2006-10-25 2008-06-10 삼성전기주식회사 회로기판 및 그 제조방법
JP5561460B2 (ja) * 2009-06-03 2014-07-30 新光電気工業株式会社 配線基板および配線基板の製造方法
JP5711472B2 (ja) * 2010-06-09 2015-04-30 新光電気工業株式会社 配線基板及びその製造方法並びに半導体装置
JP2013038374A (ja) * 2011-01-20 2013-02-21 Ibiden Co Ltd 配線板及びその製造方法
US8745860B2 (en) * 2011-03-11 2014-06-10 Ibiden Co., Ltd. Method for manufacturing printed wiring board
JP2012216575A (ja) * 2011-03-31 2012-11-08 Nec Toppan Circuit Solutions Inc 部品内蔵印刷配線板及びその製造方法
JP5820673B2 (ja) * 2011-09-15 2015-11-24 新光電気工業株式会社 半導体装置及びその製造方法
JP6057641B2 (ja) * 2012-09-20 2017-01-11 新光電気工業株式会社 配線基板及びその製造方法
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
JP2016197639A (ja) * 2015-04-02 2016-11-24 イビデン株式会社 プリント配線板およびその製造方法

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Publication number Publication date
JP2016207959A (ja) 2016-12-08
US20160322289A1 (en) 2016-11-03
US9852970B2 (en) 2017-12-26

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