JP6548537B2 - はんだ合金及びはんだ組成物 - Google Patents
はんだ合金及びはんだ組成物 Download PDFInfo
- Publication number
- JP6548537B2 JP6548537B2 JP2015178403A JP2015178403A JP6548537B2 JP 6548537 B2 JP6548537 B2 JP 6548537B2 JP 2015178403 A JP2015178403 A JP 2015178403A JP 2015178403 A JP2015178403 A JP 2015178403A JP 6548537 B2 JP6548537 B2 JP 6548537B2
- Authority
- JP
- Japan
- Prior art keywords
- mass
- solder
- content
- solder alloy
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 100
- 229910045601 alloy Inorganic materials 0.000 title claims description 78
- 239000000956 alloy Substances 0.000 title claims description 78
- 239000000203 mixture Substances 0.000 title claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 52
- 229910052797 bismuth Inorganic materials 0.000 claims description 14
- 230000004907 flux Effects 0.000 claims description 14
- 229910052718 tin Inorganic materials 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 150000002739 metals Chemical class 0.000 claims description 8
- 229910052787 antimony Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 description 18
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 229910020830 Sn-Bi Inorganic materials 0.000 description 7
- 229910018728 Sn—Bi Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 150000002367 halogens Chemical class 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000000879 optical micrograph Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020888 Sn-Cu Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910019204 Sn—Cu Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017051984A JP2017051984A (ja) | 2017-03-16 |
JP2017051984A5 JP2017051984A5 (zh) | 2018-07-05 |
JP6548537B2 true JP6548537B2 (ja) | 2019-07-24 |
Family
ID=58320268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015178403A Active JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6548537B2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11479835B2 (en) * | 2016-08-11 | 2022-10-25 | Beijing Compo Advanced Technology Co., Ltd. | SnBiSb series low-temperature lead-free solder and its preparation method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6477965B1 (ja) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
JP7262695B1 (ja) * | 2023-01-24 | 2023-04-21 | 株式会社タムラ製作所 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
JP7406052B1 (ja) | 2023-09-14 | 2023-12-26 | 株式会社タムラ製作所 | はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5569433A (en) * | 1994-11-08 | 1996-10-29 | Lucent Technologies Inc. | Lead-free low melting solder with improved mechanical properties |
DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
JP3347512B2 (ja) * | 1995-03-17 | 2002-11-20 | 富士通株式会社 | 低温接合用はんだ合金、これを用いた電子機器およびその製造方法 |
US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
JP3592054B2 (ja) * | 1997-12-15 | 2004-11-24 | 富士通株式会社 | 電子回路及びその製造方法 |
JP2001334386A (ja) * | 2000-05-19 | 2001-12-04 | Hitachi Ltd | 電子機器用Sn−Ag−Bi系はんだ |
JP2004034134A (ja) * | 2002-07-08 | 2004-02-05 | Hitachi Ltd | 線はんだおよび電子機器の製造方法 |
US20050069725A1 (en) * | 2003-07-03 | 2005-03-31 | Boaz Premakaran T. | Lead-free solder composition for substrates |
JP2007090407A (ja) * | 2005-09-30 | 2007-04-12 | Toshiba Corp | 電子部品の接合材料、プリント回路配線基板、及び電子機器 |
BR112013030696B1 (pt) * | 2011-07-04 | 2019-06-18 | Saint-Gobain Glass France | Elemento de conexão elétrica, uso de um elemento de conexão elétrica e método de produzir uma vidraça com pelo menos um elemento de conexão elétrica |
JP6072032B2 (ja) * | 2011-08-02 | 2017-02-01 | アルファ・メタルズ・インコーポレイテッドAlpha Metals, Inc. | 高い衝撃靱性のはんだ合金 |
-
2015
- 2015-09-10 JP JP2015178403A patent/JP6548537B2/ja active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11479835B2 (en) * | 2016-08-11 | 2022-10-25 | Beijing Compo Advanced Technology Co., Ltd. | SnBiSb series low-temperature lead-free solder and its preparation method |
Also Published As
Publication number | Publication date |
---|---|
JP2017051984A (ja) | 2017-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5533876B2 (ja) | ソルダペースト、それを用いた接合方法、および接合構造 | |
JP6339993B2 (ja) | 鉛フリーはんだ合金 | |
JP5287852B2 (ja) | 引け巣が抑制された鉛フリーはんだ合金 | |
TWI457192B (zh) | Solder connector | |
JP5664664B2 (ja) | 接合方法、電子装置の製造方法、および電子部品 | |
JP6548537B2 (ja) | はんだ合金及びはんだ組成物 | |
JP6828880B2 (ja) | はんだペースト、はんだ合金粉 | |
US20160368104A1 (en) | Lead-Free Solder Alloy, Solder Material and Joined Structure | |
JP2011156558A (ja) | 鉛フリーはんだ合金 | |
JP6004253B2 (ja) | ペースト用はんだ合金粉末、ペースト及びこれを用いたはんだバンプ | |
WO2020067307A1 (ja) | 鉛フリーはんだ合金 | |
JP6688417B2 (ja) | はんだ接合方法 | |
JP5773444B2 (ja) | アルミニウム接合用はんだ合金 | |
JP5051633B2 (ja) | はんだ合金 | |
JP5966449B2 (ja) | バンプ用はんだ合金粉末、バンプ用はんだペースト及びはんだバンプ | |
US10888960B2 (en) | Solder alloy and resin flux cored solder | |
JP2018144076A (ja) | はんだバンプ製造用金属粉末、はんだバンプ製造用ペーストおよびはんだバンプの製造方法 | |
JP3992107B2 (ja) | 無鉛はんだ合金 | |
JP2013248664A (ja) | 鉛フリーはんだ合金およびはんだペースト | |
JP2007038228A (ja) | はんだ合金 | |
KR100327767B1 (ko) | 납땜용 무연합금 | |
JP6221912B2 (ja) | はんだ接合用銅合金 | |
JP2005153010A (ja) | 無鉛はんだ合金 | |
JP2010005692A (ja) | 改良Sn−0.7wt%Cu無鉛はんだ | |
JP2019019371A (ja) | 銀合金 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180412 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180521 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20180521 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20180521 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20180529 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20180615 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180910 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180914 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20181029 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20181214 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20190208 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190411 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190607 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190625 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6548537 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |