JP2017051984A5 - - Google Patents
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- Publication number
- JP2017051984A5 JP2017051984A5 JP2015178403A JP2015178403A JP2017051984A5 JP 2017051984 A5 JP2017051984 A5 JP 2017051984A5 JP 2015178403 A JP2015178403 A JP 2015178403A JP 2015178403 A JP2015178403 A JP 2015178403A JP 2017051984 A5 JP2017051984 A5 JP 2017051984A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- content
- solder alloy
- metal
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 229910052803 cobalt Inorganic materials 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- 230000004907 flux Effects 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015178403A JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017051984A JP2017051984A (ja) | 2017-03-16 |
| JP2017051984A5 true JP2017051984A5 (zh) | 2018-07-05 |
| JP6548537B2 JP6548537B2 (ja) | 2019-07-24 |
Family
ID=58320268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015178403A Active JP6548537B2 (ja) | 2015-09-10 | 2015-09-10 | はんだ合金及びはんだ組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6548537B2 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106216872B (zh) * | 2016-08-11 | 2019-03-12 | 北京康普锡威科技有限公司 | 一种SnBiSb系低温无铅焊料及其制备方法 |
| JP6477965B1 (ja) * | 2018-03-08 | 2019-03-06 | 千住金属工業株式会社 | はんだ合金、はんだペースト、はんだボール、やに入りはんだおよびはんだ継手 |
| JP7262695B1 (ja) * | 2023-01-24 | 2023-04-21 | 株式会社タムラ製作所 | はんだ合金、接合部、接合材、ソルダペースト、接合構造体および電子制御装置 |
| JP7406052B1 (ja) | 2023-09-14 | 2023-12-26 | 株式会社タムラ製作所 | はんだ合金、ソルダペースト、接合部、接合構造体および電子制御装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5569433A (en) * | 1994-11-08 | 1996-10-29 | Lucent Technologies Inc. | Lead-free low melting solder with improved mechanical properties |
| DE4443459C2 (de) * | 1994-12-07 | 1996-11-21 | Wieland Werke Ag | Bleifreies Weichlot und seine Verwendung |
| JP3347512B2 (ja) * | 1995-03-17 | 2002-11-20 | 富士通株式会社 | 低温接合用はんだ合金、これを用いた電子機器およびその製造方法 |
| US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
| JP3592054B2 (ja) * | 1997-12-15 | 2004-11-24 | 富士通株式会社 | 電子回路及びその製造方法 |
| JP2001334386A (ja) * | 2000-05-19 | 2001-12-04 | Hitachi Ltd | 電子機器用Ｓｎ−Ａｇ−Ｂｉ系はんだ |
| JP2004034134A (ja) * | 2002-07-08 | 2004-02-05 | Hitachi Ltd | 線はんだおよび電子機器の製造方法 |
| US20050069725A1 (en) * | 2003-07-03 | 2005-03-31 | Boaz Premakaran T. | Lead-free solder composition for substrates |
| JP2007090407A (ja) * | 2005-09-30 | 2007-04-12 | Toshiba Corp | 電子部品の接合材料、プリント回路配線基板、及び電子機器 |
| EA027655B1 (ru) * | 2011-07-04 | 2017-08-31 | Сэн-Гобэн Гласс Франс | Способ изготовления оконного стекла с электрическим присоединительным элементом |
| EP3907037A1 (en) * | 2011-08-02 | 2021-11-10 | Alpha Assembly Solutions Inc. | High impact toughness solder alloy |
-
2015
- 2015-09-10 JP JP2015178403A patent/JP6548537B2/ja active Active
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