JP6532750B2 - 配線基板及びその製造方法 - Google Patents

配線基板及びその製造方法 Download PDF

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Publication number
JP6532750B2
JP6532750B2 JP2015101245A JP2015101245A JP6532750B2 JP 6532750 B2 JP6532750 B2 JP 6532750B2 JP 2015101245 A JP2015101245 A JP 2015101245A JP 2015101245 A JP2015101245 A JP 2015101245A JP 6532750 B2 JP6532750 B2 JP 6532750B2
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Japan
Prior art keywords
wiring
insulating film
layer
wiring layer
insulating
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JP2015101245A
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English (en)
Japanese (ja)
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JP2016149517A5 (enExample
JP2016149517A (ja
Inventor
一宏 大島
一宏 大島
啓晴 柳沢
啓晴 柳沢
小林　和弘
和弘 小林
深瀬　克哉
克哉 深瀬
健 宮入
健 宮入
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to US14/990,978 priority Critical patent/US9961767B2/en
Publication of JP2016149517A publication Critical patent/JP2016149517A/ja
Publication of JP2016149517A5 publication Critical patent/JP2016149517A5/ja
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Publication of JP6532750B2 publication Critical patent/JP6532750B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2015101245A 2015-02-10 2015-05-18 配線基板及びその製造方法 Active JP6532750B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US14/990,978 US9961767B2 (en) 2015-02-10 2016-01-08 Circuit board and method of manufacturing circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015024770 2015-02-10
JP2015024770 2015-02-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019019117A Division JP6761064B2 (ja) 2015-02-10 2019-02-05 配線基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2016149517A JP2016149517A (ja) 2016-08-18
JP2016149517A5 JP2016149517A5 (enExample) 2018-02-08
JP6532750B2 true JP6532750B2 (ja) 2019-06-19

Family

ID=56688447

Family Applications (2)

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JP2015101245A Active JP6532750B2 (ja) 2015-02-10 2015-05-18 配線基板及びその製造方法
JP2019019117A Active JP6761064B2 (ja) 2015-02-10 2019-02-05 配線基板及びその製造方法

Family Applications After (1)

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JP2019019117A Active JP6761064B2 (ja) 2015-02-10 2019-02-05 配線基板及びその製造方法

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JP (2) JP6532750B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7069561B2 (ja) * 2017-04-10 2022-05-18 昭和電工マテリアルズ株式会社 積層板の製造方法、プリント配線板の製造方法、及び半導体パッケージの製造方法
JP2018182003A (ja) * 2017-04-10 2018-11-15 日立化成株式会社 多層プリント配線板及び半導体パッケージ
TWI644598B (zh) * 2017-04-21 2018-12-11 南亞電路板股份有限公司 電路板結構及其形成方法
JP7221601B2 (ja) * 2018-06-11 2023-02-14 新光電気工業株式会社 配線基板、配線基板の製造方法
JP7289620B2 (ja) * 2018-09-18 2023-06-12 新光電気工業株式会社 配線基板、積層型配線基板、半導体装置
JP7266454B2 (ja) 2019-04-25 2023-04-28 新光電気工業株式会社 配線基板、積層型配線基板、及び配線基板の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61133696A (ja) * 1984-12-03 1986-06-20 日立化成工業株式会社 配線板の製造法
JP2007234988A (ja) * 2006-03-02 2007-09-13 Epson Toyocom Corp 半導体素子の実装基板及び実装方法
JP2010004028A (ja) * 2008-05-23 2010-01-07 Shinko Electric Ind Co Ltd 配線基板及びその製造方法、及び半導体装置
JPWO2011016555A1 (ja) * 2009-08-07 2013-01-17 日本電気株式会社 半導体装置とその製造方法
JP6383519B2 (ja) * 2011-06-17 2018-08-29 住友ベークライト株式会社 プリント配線板および製造方法

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Publication number Publication date
JP2019083340A (ja) 2019-05-30
JP6761064B2 (ja) 2020-09-23
JP2016149517A (ja) 2016-08-18

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