JP6510837B2 - ボンディング装置及びボンディング方法 - Google Patents

ボンディング装置及びボンディング方法 Download PDF

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Publication number
JP6510837B2
JP6510837B2 JP2015048168A JP2015048168A JP6510837B2 JP 6510837 B2 JP6510837 B2 JP 6510837B2 JP 2015048168 A JP2015048168 A JP 2015048168A JP 2015048168 A JP2015048168 A JP 2015048168A JP 6510837 B2 JP6510837 B2 JP 6510837B2
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Japan
Prior art keywords
die
collet
bonding
imaging
head
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JP2015048168A
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English (en)
Japanese (ja)
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JP2016171106A5 (enExample
JP2016171106A (ja
Inventor
牧　浩
浩 牧
和男 中野
和男 中野
谷　由貴夫
由貴夫 谷
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Fasford Technology Co Ltd
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Fasford Technology Co Ltd
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Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Priority to JP2015048168A priority Critical patent/JP6510837B2/ja
Priority to TW104140754A priority patent/TWI593046B/zh
Priority to KR1020150176798A priority patent/KR101807369B1/ko
Priority to CN201510929210.3A priority patent/CN105977183B/zh
Publication of JP2016171106A publication Critical patent/JP2016171106A/ja
Priority to KR1020170139319A priority patent/KR101874756B1/ko
Publication of JP2016171106A5 publication Critical patent/JP2016171106A5/ja
Application granted granted Critical
Publication of JP6510837B2 publication Critical patent/JP6510837B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015048168A 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法 Active JP6510837B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015048168A JP6510837B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法
TW104140754A TWI593046B (zh) 2015-03-11 2015-12-04 Bonding device and bonding method
KR1020150176798A KR101807369B1 (ko) 2015-03-11 2015-12-11 본딩 장치 및 본딩 방법
CN201510929210.3A CN105977183B (zh) 2015-03-11 2015-12-14 贴装装置及贴装方法
KR1020170139319A KR101874756B1 (ko) 2015-03-11 2017-10-25 본딩 장치 및 본딩 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015048168A JP6510837B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法

Publications (3)

Publication Number Publication Date
JP2016171106A JP2016171106A (ja) 2016-09-23
JP2016171106A5 JP2016171106A5 (enExample) 2018-02-22
JP6510837B2 true JP6510837B2 (ja) 2019-05-08

Family

ID=56984111

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JP2015048168A Active JP6510837B2 (ja) 2015-03-11 2015-03-11 ボンディング装置及びボンディング方法

Country Status (4)

Country Link
JP (1) JP6510837B2 (enExample)
KR (2) KR101807369B1 (enExample)
CN (1) CN105977183B (enExample)
TW (1) TWI593046B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6643197B2 (ja) * 2016-07-13 2020-02-12 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
CN108511364B (zh) 2017-02-28 2020-01-24 上海微电子装备（集团）股份有限公司 一种芯片键合装置
JP7164314B2 (ja) 2017-04-28 2022-11-01 ベシ スウィッツァーランド エージー 部品を基板上に搭載する装置及び方法
CN107093651B (zh) * 2017-05-18 2023-08-04 江西比太科技有限公司 太阳能硅片二合一自动上下料设备
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
EP3633715A1 (en) * 2018-10-02 2020-04-08 Infineon Technologies Austria AG Multi-clip structure for die bonding
US10861819B1 (en) * 2019-07-05 2020-12-08 Asm Technology Singapore Pte Ltd High-precision bond head positioning method and apparatus
JP7352159B2 (ja) * 2019-09-30 2023-09-28 日本電気硝子株式会社 デバイスの製造方法
JP7704534B2 (ja) * 2021-01-18 2025-07-08 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
CN112802793B (zh) * 2021-02-09 2025-04-15 深圳市卓兴半导体科技有限公司 运行机构和晶片吸附装置
JP7627934B2 (ja) * 2021-02-26 2025-02-07 アスリートＦａ株式会社 半導体デバイスの実装装置及び実装方法
CN116880020A (zh) * 2023-08-01 2023-10-13 长芯盛（武汉）科技有限公司 一种光器件耦合方法
CN117080127B (zh) * 2023-10-11 2024-01-05 江苏快克芯装备科技有限公司 芯片吸取异常检测装置及检测方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140040A (ja) * 1984-07-31 1986-02-26 Oki Electric Ind Co Ltd 発光素子のダイスボンデイング位置決め方法
JP2696617B2 (ja) * 1991-06-04 1998-01-14 ローム株式会社 ダイボンディング装置
JPH05337865A (ja) * 1992-06-10 1993-12-21 Sony Corp 半導体実装装置とこれを用いた実装方法
KR100214586B1 (ko) * 1995-12-29 1999-08-02 구자홍 홀로그램 모듈 조립장치
JPH11274180A (ja) * 1998-03-24 1999-10-08 Sony Corp ダイボンド装置及びそれを用いた半導体装置の製造方法
JP2000244195A (ja) 1999-02-17 2000-09-08 Rohm Co Ltd フリップチップ装着装置のチップ位置認識装置
JP2000269240A (ja) * 1999-03-16 2000-09-29 Hitachi Cable Ltd 光モジュールの製造方法及び光素子搭載装置
JP3851468B2 (ja) * 1999-07-09 2006-11-29 富士写真フイルム株式会社 発光部品のボンディング方法および装置
JP4425609B2 (ja) * 2003-02-19 2010-03-03 キヤノンマシナリー株式会社 チップマウント方法および装置
JP4156460B2 (ja) * 2003-07-09 2008-09-24 Ｔｄｋ株式会社 ワークのピックアップ方法及びその装置、実装機
JP3808465B2 (ja) * 2003-12-24 2006-08-09 エルピーダメモリ株式会社 マウント方法及び装置
JP2006261209A (ja) * 2005-03-15 2006-09-28 Seiko Epson Corp 部品の吸着治具
JP2006032987A (ja) * 2005-09-27 2006-02-02 Renesas Technology Corp ボンディング装置および半導体集積回路装置の製造方法
JP4593429B2 (ja) 2005-10-04 2010-12-08 キヤノンマシナリー株式会社 ダイボンダ
JP2009212456A (ja) * 2008-03-06 2009-09-17 Sharp Corp ボンディング装置
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Also Published As

Publication number Publication date
CN105977183A (zh) 2016-09-28
CN105977183B (zh) 2019-10-25
TWI593046B (zh) 2017-07-21
TW201633441A (zh) 2016-09-16
JP2016171106A (ja) 2016-09-23
KR20170121133A (ko) 2017-11-01
KR101874756B1 (ko) 2018-07-04
KR101807369B1 (ko) 2017-12-08
KR20160110058A (ko) 2016-09-21

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