JP6506552B2 - チップ電子部品検査選別装置 - Google Patents

チップ電子部品検査選別装置 Download PDF

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Publication number
JP6506552B2
JP6506552B2 JP2014264642A JP2014264642A JP6506552B2 JP 6506552 B2 JP6506552 B2 JP 6506552B2 JP 2014264642 A JP2014264642 A JP 2014264642A JP 2014264642 A JP2014264642 A JP 2014264642A JP 6506552 B2 JP6506552 B2 JP 6506552B2
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Japan
Prior art keywords
chip electronic
electronic component
inspection
electrode terminal
chip
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JP2014264642A
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English (en)
Japanese (ja)
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JP2016125847A (ja
Inventor
清久 藤田
清久 藤田
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Humo Laboratory Ltd
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Humo Laboratory Ltd
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Publication date
Application filed by Humo Laboratory Ltd filed Critical Humo Laboratory Ltd
Priority to JP2014264642A priority Critical patent/JP6506552B2/ja
Priority to TW104138777A priority patent/TWI680304B/zh
Priority to KR1020150185183A priority patent/KR102391849B1/ko
Priority to CN201510982119.8A priority patent/CN105738746B/zh
Publication of JP2016125847A publication Critical patent/JP2016125847A/ja
Application granted granted Critical
Publication of JP6506552B2 publication Critical patent/JP6506552B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G01R31/013—Testing passive components
    • G01R31/016—Testing of capacitors

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Environmental & Geological Engineering (AREA)
  • Measurement Of Resistance Or Impedance (AREA)
  • Sorting Of Articles (AREA)
JP2014264642A 2014-12-26 2014-12-26 チップ電子部品検査選別装置 Active JP6506552B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014264642A JP6506552B2 (ja) 2014-12-26 2014-12-26 チップ電子部品検査選別装置
TW104138777A TWI680304B (zh) 2014-12-26 2015-11-23 晶片電子零件檢查篩選裝置
KR1020150185183A KR102391849B1 (ko) 2014-12-26 2015-12-23 칩 전자 부품 검사 선별 장치
CN201510982119.8A CN105738746B (zh) 2014-12-26 2015-12-24 芯片电子部件检查分选装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014264642A JP6506552B2 (ja) 2014-12-26 2014-12-26 チップ電子部品検査選別装置

Publications (2)

Publication Number Publication Date
JP2016125847A JP2016125847A (ja) 2016-07-11
JP6506552B2 true JP6506552B2 (ja) 2019-04-24

Family

ID=56296089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014264642A Active JP6506552B2 (ja) 2014-12-26 2014-12-26 チップ電子部品検査選別装置

Country Status (4)

Country Link
JP (1) JP6506552B2 (zh)
KR (1) KR102391849B1 (zh)
CN (1) CN105738746B (zh)
TW (1) TWI680304B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6727651B2 (ja) * 2016-09-30 2020-07-22 株式会社ヒューモラボラトリー チップ電子部品の電気特性の連続的な検査方法
CN107194283B (zh) * 2017-05-19 2019-11-29 广州瑞特租赁服务有限公司 服务器数据安全加密芯片
CN107196757B (zh) * 2017-05-19 2020-06-09 广州瑞特租赁服务有限公司 服务器通信安全加密芯片
CN107957541B (zh) * 2017-11-21 2019-11-08 华北电力大学 一种功率半导体模块内部并联芯片筛选方法及系统
JP7075139B2 (ja) * 2020-06-02 2022-05-25 株式会社ヒューモラボラトリー チップ電子部品検査選別装置用のチップ電子部品搬送円盤
TWI797565B (zh) * 2021-02-26 2023-04-01 致茂電子股份有限公司 晶片載台
JP7460164B2 (ja) * 2021-06-28 2024-04-02 株式会社 東京ウエルズ 電子部品の搬送システム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133659U (zh) * 1973-03-19 1974-11-16
JPS5849272U (ja) * 1981-09-29 1983-04-02 日本電気株式会社 チツプ状試料装着ヘツド
JPS61187672A (ja) * 1985-02-15 1986-08-21 Nec Corp 密着型イメ−ジセンサの欠陥検査方法および欠陥検査装置
JPH0529407A (ja) * 1991-07-19 1993-02-05 Fujitsu Ltd 回路基板試験装置
US5673799A (en) * 1995-06-05 1997-10-07 Chip Star Inc. Machine for testing and sorting capacitor chips and method of operating same
JP3633532B2 (ja) * 2001-08-30 2005-03-30 株式会社村田製作所 チップ型電子部品の検査方法および検査装置
JP4293432B2 (ja) * 2003-08-07 2009-07-08 日置電機株式会社 四端子法抵抗測定装置
JP2006138705A (ja) * 2004-11-11 2006-06-01 Yamaha Corp プローブカード及びそれを用いた検査方法
JP2006194831A (ja) * 2005-01-17 2006-07-27 Humo Laboratory Ltd チップ形電子部品特性検査分類装置
US7374293B2 (en) * 2005-03-25 2008-05-20 Vishay General Semiconductor Inc. Apparatus, system and method for testing electronic elements
JP5453011B2 (ja) * 2009-08-07 2014-03-26 株式会社ヒューモラボラトリー 電子部品特性検査分類装置
CN104487855A (zh) * 2012-07-10 2015-04-01 慧萌高新科技有限公司 片状电子部件的检查方法以及检查装置
WO2014010720A1 (ja) * 2012-07-12 2014-01-16 株式会社ヒューモラボラトリー チップ電子部品の検査選別装置
KR101451499B1 (ko) * 2013-02-07 2014-10-17 삼성전기주식회사 전자부품 검사장치

Also Published As

Publication number Publication date
TW201640129A (zh) 2016-11-16
JP2016125847A (ja) 2016-07-11
TWI680304B (zh) 2019-12-21
KR20160079702A (ko) 2016-07-06
CN105738746B (zh) 2020-05-12
CN105738746A (zh) 2016-07-06
KR102391849B1 (ko) 2022-04-27

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