JP6506552B2 - チップ電子部品検査選別装置 - Google Patents
チップ電子部品検査選別装置 Download PDFInfo
- Publication number
- JP6506552B2 JP6506552B2 JP2014264642A JP2014264642A JP6506552B2 JP 6506552 B2 JP6506552 B2 JP 6506552B2 JP 2014264642 A JP2014264642 A JP 2014264642A JP 2014264642 A JP2014264642 A JP 2014264642A JP 6506552 B2 JP6506552 B2 JP 6506552B2
- Authority
- JP
- Japan
- Prior art keywords
- chip electronic
- electronic component
- inspection
- electrode terminal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 title claims description 104
- 238000012546 transfer Methods 0.000 claims description 48
- 238000012360 testing method Methods 0.000 claims description 29
- 230000004308 accommodation Effects 0.000 claims 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 28
- 229910052753 mercury Inorganic materials 0.000 description 28
- 239000003990 capacitor Substances 0.000 description 22
- 238000005259 measurement Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005192 partition Methods 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
- G01R31/013—Testing passive components
- G01R31/016—Testing of capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Environmental & Geological Engineering (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Sorting Of Articles (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014264642A JP6506552B2 (ja) | 2014-12-26 | 2014-12-26 | チップ電子部品検査選別装置 |
TW104138777A TWI680304B (zh) | 2014-12-26 | 2015-11-23 | 晶片電子零件檢查篩選裝置 |
KR1020150185183A KR102391849B1 (ko) | 2014-12-26 | 2015-12-23 | 칩 전자 부품 검사 선별 장치 |
CN201510982119.8A CN105738746B (zh) | 2014-12-26 | 2015-12-24 | 芯片电子部件检查分选装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014264642A JP6506552B2 (ja) | 2014-12-26 | 2014-12-26 | チップ電子部品検査選別装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016125847A JP2016125847A (ja) | 2016-07-11 |
JP6506552B2 true JP6506552B2 (ja) | 2019-04-24 |
Family
ID=56296089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014264642A Active JP6506552B2 (ja) | 2014-12-26 | 2014-12-26 | チップ電子部品検査選別装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6506552B2 (zh) |
KR (1) | KR102391849B1 (zh) |
CN (1) | CN105738746B (zh) |
TW (1) | TWI680304B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6727651B2 (ja) * | 2016-09-30 | 2020-07-22 | 株式会社ヒューモラボラトリー | チップ電子部品の電気特性の連続的な検査方法 |
CN107194283B (zh) * | 2017-05-19 | 2019-11-29 | 广州瑞特租赁服务有限公司 | 服务器数据安全加密芯片 |
CN107196757B (zh) * | 2017-05-19 | 2020-06-09 | 广州瑞特租赁服务有限公司 | 服务器通信安全加密芯片 |
CN107957541B (zh) * | 2017-11-21 | 2019-11-08 | 华北电力大学 | 一种功率半导体模块内部并联芯片筛选方法及系统 |
JP7075139B2 (ja) * | 2020-06-02 | 2022-05-25 | 株式会社ヒューモラボラトリー | チップ電子部品検査選別装置用のチップ電子部品搬送円盤 |
TWI797565B (zh) * | 2021-02-26 | 2023-04-01 | 致茂電子股份有限公司 | 晶片載台 |
JP7460164B2 (ja) * | 2021-06-28 | 2024-04-02 | 株式会社 東京ウエルズ | 電子部品の搬送システム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49133659U (zh) * | 1973-03-19 | 1974-11-16 | ||
JPS5849272U (ja) * | 1981-09-29 | 1983-04-02 | 日本電気株式会社 | チツプ状試料装着ヘツド |
JPS61187672A (ja) * | 1985-02-15 | 1986-08-21 | Nec Corp | 密着型イメ−ジセンサの欠陥検査方法および欠陥検査装置 |
JPH0529407A (ja) * | 1991-07-19 | 1993-02-05 | Fujitsu Ltd | 回路基板試験装置 |
US5673799A (en) * | 1995-06-05 | 1997-10-07 | Chip Star Inc. | Machine for testing and sorting capacitor chips and method of operating same |
JP3633532B2 (ja) * | 2001-08-30 | 2005-03-30 | 株式会社村田製作所 | チップ型電子部品の検査方法および検査装置 |
JP4293432B2 (ja) * | 2003-08-07 | 2009-07-08 | 日置電機株式会社 | 四端子法抵抗測定装置 |
JP2006138705A (ja) * | 2004-11-11 | 2006-06-01 | Yamaha Corp | プローブカード及びそれを用いた検査方法 |
JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
US7374293B2 (en) * | 2005-03-25 | 2008-05-20 | Vishay General Semiconductor Inc. | Apparatus, system and method for testing electronic elements |
JP5453011B2 (ja) * | 2009-08-07 | 2014-03-26 | 株式会社ヒューモラボラトリー | 電子部品特性検査分類装置 |
CN104487855A (zh) * | 2012-07-10 | 2015-04-01 | 慧萌高新科技有限公司 | 片状电子部件的检查方法以及检查装置 |
WO2014010720A1 (ja) * | 2012-07-12 | 2014-01-16 | 株式会社ヒューモラボラトリー | チップ電子部品の検査選別装置 |
KR101451499B1 (ko) * | 2013-02-07 | 2014-10-17 | 삼성전기주식회사 | 전자부품 검사장치 |
-
2014
- 2014-12-26 JP JP2014264642A patent/JP6506552B2/ja active Active
-
2015
- 2015-11-23 TW TW104138777A patent/TWI680304B/zh active
- 2015-12-23 KR KR1020150185183A patent/KR102391849B1/ko active IP Right Grant
- 2015-12-24 CN CN201510982119.8A patent/CN105738746B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201640129A (zh) | 2016-11-16 |
JP2016125847A (ja) | 2016-07-11 |
TWI680304B (zh) | 2019-12-21 |
KR20160079702A (ko) | 2016-07-06 |
CN105738746B (zh) | 2020-05-12 |
CN105738746A (zh) | 2016-07-06 |
KR102391849B1 (ko) | 2022-04-27 |
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