JP6461260B1 - 塗布機構及び塗布装置 - Google Patents
塗布機構及び塗布装置 Download PDFInfo
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- JP6461260B1 JP6461260B1 JP2017149884A JP2017149884A JP6461260B1 JP 6461260 B1 JP6461260 B1 JP 6461260B1 JP 2017149884 A JP2017149884 A JP 2017149884A JP 2017149884 A JP2017149884 A JP 2017149884A JP 6461260 B1 JP6461260 B1 JP 6461260B1
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- 230000007246 mechanism Effects 0.000 title claims abstract description 123
- 239000011248 coating agent Substances 0.000 title claims description 97
- 238000000576 coating method Methods 0.000 title claims description 97
- 239000000758 substrate Substances 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000008859 change Effects 0.000 claims abstract description 7
- 230000003287 optical effect Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1034—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves specially designed for conducting intermittent application of small quantities, e.g. drops, of coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
- B05C1/02—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
Abstract
Description
以下に、実施形態に係る塗布機構10の構成を説明する。図1は、実施形態に係る塗布機構10の正面図である。図1に示すように、塗布機構10は、サーボモータ1と、カム2と、軸受3と、カム連結板4と、可動部5と、塗布針ホルダ6と、塗布材料容器7とを有している。塗布機構10は、基板SUB上に塗布材料を塗布するための機構である。なお、基板SUBには、例えばPET(ポリエチレンテレフタレート)フィルム等が用いられる。
以下に、実施形態に係る塗布機構10の動作を説明する。サーボモータ1の回転軸が中心軸周りに回転することにより、カム2がサーボモータ1の回転軸の中心軸周りに回転する。カム面(フランジ部に位置する第1面2a)は、フランジ部の周方向に沿って第2面2bとの距離が変動している。そのため、カム2の回転に伴い、カム面と接触している軸受3のZ方向における位置が、変動する。
以下に、実施形態に係る塗布機構10の効果を説明する。上記のとおり、塗布機構10においては、位置保持機構65は、図4の時刻tAから時刻tBの間(塗布針63の先端が基板SUBに接触する直前までの間)及び時刻tCから時刻tDの間(塗布針63の先端が基板SUBから離間した後)において、電磁石65bに通電が行われるため、塗布針固定部材62のスライド機構64に対する相対的な位置が保持されている。一方で、図4における時刻tBから時刻tCの間(塗布針63の先端が基板SUBに接触する直前から基板SUBから離間するまでの間)において、電磁石65bに通電が行われないため、塗布針固定部材62とスライド機構64との間の相対的な位置の変化を許容している。
以下に、実施形態に係る塗布装置100の構成を説明する。図5は、塗布装置100の模式図である。図5に示すように、塗布装置100は、塗布機構10と、X軸テーブル20と、Y軸テーブル21と、Z軸テーブル30と、観察光学系40と、CCDカメラ50と、制御用コンピュータ60と、モニタ70と、操作パネル80とを有している。
Claims (5)
- 塗布針を用いて基板上に塗布材料を塗布する塗布機構であって、
前記塗布機構は、
ホルダベースと、
前記ホルダベースの内部に取り付けられるスライド機構と、
前記塗布針が取り付けられ、かつ前記スライド機構によって前記塗布針の延在方向に沿ってスライド自在に支持される塗布針固定部材と、
前記塗布針固定部材の前記スライド機構に対する相対的な位置を保持する位置保持機構とを備え、
前記位置保持機構は、前記塗布針の先端が前記基板と接触する直前までの間において、前記塗布針固定部材の前記スライド機構に対する相対的な位置を保持し、前記塗布針の前記先端が前記基板と接触する直前から前記基板から離間するまでの間において、前記塗布針固定部材の前記スライド機構に対する相対的な位置の変化を許容する、塗布機構。 - 前記位置保持機構は、磁性部材と、前記磁性部材と対向するように配置される電磁石とにより構成される、請求項1に記載の塗布機構。
- 前記磁性部材は、永久磁石である、請求項2に記載の塗布機構。
- 前記磁性部材は、前記塗布針固定部材に取り付けられ、
前記電磁石は、前記ホルダベースに取り付けられる、請求項2又は請求項3に記載の塗布機構。 - 請求項1〜請求項4のいずれか1項に記載の前記塗布機構を備える、塗布装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017149884A JP6461260B1 (ja) | 2017-08-02 | 2017-08-02 | 塗布機構及び塗布装置 |
PCT/JP2018/026914 WO2019026624A1 (ja) | 2017-08-02 | 2018-07-18 | 塗布機構及び塗布装置 |
CN201880049958.6A CN110997157A (zh) | 2017-08-02 | 2018-07-18 | 涂布机构和涂布装置 |
EP18841077.3A EP3663005A4 (en) | 2017-08-02 | 2018-07-18 | APPLICATION MECHANISM AND APPLICATION DEVICE |
US16/635,519 US11511311B2 (en) | 2017-08-02 | 2018-07-18 | Application mechanism and application apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017149884A JP6461260B1 (ja) | 2017-08-02 | 2017-08-02 | 塗布機構及び塗布装置 |
Publications (2)
Publication Number | Publication Date |
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JP6461260B1 true JP6461260B1 (ja) | 2019-01-30 |
JP2019025450A JP2019025450A (ja) | 2019-02-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017149884A Active JP6461260B1 (ja) | 2017-08-02 | 2017-08-02 | 塗布機構及び塗布装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11511311B2 (ja) |
EP (1) | EP3663005A4 (ja) |
JP (1) | JP6461260B1 (ja) |
CN (1) | CN110997157A (ja) |
WO (1) | WO2019026624A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112718387A (zh) * | 2020-12-23 | 2021-04-30 | 昂纳信息技术(深圳)有限公司 | 一种点胶装置 |
CN113510045A (zh) * | 2021-05-10 | 2021-10-19 | 江苏玺泽祥智能科技有限公司 | Ro膜自动卷膜机的自动灌胶机构 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006276188A (ja) * | 2005-03-28 | 2006-10-12 | Ntn Corp | パターン修正装置およびパターン修正方法 |
JP2006310266A (ja) * | 2005-03-28 | 2006-11-09 | Ntn Corp | 塗布ユニットおよびパターン修正装置 |
JP2008178775A (ja) * | 2007-01-23 | 2008-08-07 | Shibaura Mechatronics Corp | 流体塗布装置および塗布距離測定方法 |
JP2008296148A (ja) * | 2007-05-31 | 2008-12-11 | Ntn Corp | 液状材料塗布機構およびそれを用いた欠陥修正装置 |
JP2013109315A (ja) * | 2011-10-24 | 2013-06-06 | Ntn Corp | 液状材料塗布装置およびそれを含む欠陥修正装置 |
WO2015087898A1 (ja) * | 2013-12-13 | 2015-06-18 | Ntn株式会社 | 塗布部材、塗布装置および塗布方法 |
Family Cites Families (7)
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US5186982A (en) * | 1990-09-18 | 1993-02-16 | Minnesota Mining And Manufacturing Company | Pin transfer applicator and method |
US6915928B2 (en) * | 2001-01-29 | 2005-07-12 | Pemstar, Inc. | Fluid dispenser |
JP4802027B2 (ja) | 2006-03-30 | 2011-10-26 | Ntn株式会社 | パターン修正装置およびその塗布ユニット |
JP6189102B2 (ja) * | 2013-06-25 | 2017-08-30 | Ntn株式会社 | 塗布装置および高さ検出方法 |
US9153305B2 (en) | 2013-08-30 | 2015-10-06 | Micron Technology, Inc. | Independently addressable memory array address spaces |
JP6381902B2 (ja) | 2013-12-13 | 2018-08-29 | Ntn株式会社 | 塗布針ホルダ |
JP6749814B2 (ja) * | 2015-11-12 | 2020-09-02 | Ntn株式会社 | 高さ検出装置およびそれを搭載した塗布装置 |
-
2017
- 2017-08-02 JP JP2017149884A patent/JP6461260B1/ja active Active
-
2018
- 2018-07-18 CN CN201880049958.6A patent/CN110997157A/zh active Pending
- 2018-07-18 WO PCT/JP2018/026914 patent/WO2019026624A1/ja unknown
- 2018-07-18 US US16/635,519 patent/US11511311B2/en active Active
- 2018-07-18 EP EP18841077.3A patent/EP3663005A4/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006276188A (ja) * | 2005-03-28 | 2006-10-12 | Ntn Corp | パターン修正装置およびパターン修正方法 |
JP2006310266A (ja) * | 2005-03-28 | 2006-11-09 | Ntn Corp | 塗布ユニットおよびパターン修正装置 |
JP2008178775A (ja) * | 2007-01-23 | 2008-08-07 | Shibaura Mechatronics Corp | 流体塗布装置および塗布距離測定方法 |
JP2008296148A (ja) * | 2007-05-31 | 2008-12-11 | Ntn Corp | 液状材料塗布機構およびそれを用いた欠陥修正装置 |
JP2013109315A (ja) * | 2011-10-24 | 2013-06-06 | Ntn Corp | 液状材料塗布装置およびそれを含む欠陥修正装置 |
WO2015087898A1 (ja) * | 2013-12-13 | 2015-06-18 | Ntn株式会社 | 塗布部材、塗布装置および塗布方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3663005A1 (en) | 2020-06-10 |
WO2019026624A1 (ja) | 2019-02-07 |
EP3663005A4 (en) | 2021-04-21 |
US11511311B2 (en) | 2022-11-29 |
JP2019025450A (ja) | 2019-02-21 |
US20200254477A1 (en) | 2020-08-13 |
CN110997157A (zh) | 2020-04-10 |
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