JP6441329B2 - ターゲット作製 - Google Patents
ターゲット作製 Download PDFInfo
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- JP6441329B2 JP6441329B2 JP2016522329A JP2016522329A JP6441329B2 JP 6441329 B2 JP6441329 B2 JP 6441329B2 JP 2016522329 A JP2016522329 A JP 2016522329A JP 2016522329 A JP2016522329 A JP 2016522329A JP 6441329 B2 JP6441329 B2 JP 6441329B2
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- 238000004519 manufacturing process Methods 0.000 title description 3
- 238000000576 coating method Methods 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 35
- 239000011248 coating agent Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 27
- 230000003750 conditioning effect Effects 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000001143 conditioned effect Effects 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 5
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 5
- 238000002203 pretreatment Methods 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 238000010891 electric arc Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 238000005259 measurement Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000005121 nitriding Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 238000002485 combustion reaction Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3447—Collimators, shutters, apertures
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
特に本発明は、真空下でガス相から析出物を作製する方法に関し、ターゲットが材料源として用いられ、その表面からの粒子が基板に飛んで、該基板上に析出する。反応性ガスがしばしば用いられ、その原子及び/又は分子が粒子と反応して、対応する化合物が基板上に析出する。そして、これは、反応性のコーティングプロセスと称せられる。
本発明の目的は、この必要性に基づいている。
−コーティングされる基板をコーティングチャンバーに入れること;
−該コーティングチャンバーを閉じて所定のプロセス圧力に減圧すること;
−材料源としてターゲットを有するコーティング源を始動して、ターゲットの表面から基板の方向に粒子を加速すること;
を備えて構成される方法において、ターゲットがコンディショニングされるまで、ターゲット表面と基板の間にシールドを設けて、その間にコーティングされる基板が少なくとも部分的に前処理されることによって特徴づけられる。
更なる実施形態によれば、前処理は方法ステップとして基板表面の窒化処理を含むことができる。例えば窒素、アルゴン及び水素の混合ガスを、この目的のために、チャンバーに導入可能である。
コーティングチャンバーは、ハイパワー出力を有するDC発電機に、重複する時間間隔で連続的、周期的に接続された多数のマグネトロンスパッタリング源を含むことができ、その結果、0.2A/cm2より大きな断続する電流密度がターゲット表面上に周期的に生じる。
Claims (7)
- ― コーティングされる工作物である基板をコーティングチャンバーに入れること、
― 該コーティングチャンバーを閉じて所定のプロセス圧力に減圧すること、
― 材料源としてターゲットを有するコーティング源を始動して、前記ターゲットの表面から前記基板の方向に粒子を加速すること、
― 前記ターゲットがコンディショニングされるまで、前記ターゲットの表面と前記基板の間にシールドを設けて、その間にコーティングされる前記基板が少なくとも部分的に前処理されること、
の各ステップを有する、工作物をコーティングするための方法であって、
前記前処理が、基板を窒化する方法ステップを含み、窒化のために、窒素、アルゴン及び水素の元素を含む混合ガスを、前記チャンバーに導入することを特徴とする方法。 - 基板の前処理がエッチングプロセスを含むことを特徴とする請求項1に記載の方法。
- 粒子によって発せられた光学信号が本質的に変わらないままである場合に、ターゲットのコンディショニングを終了することを特徴とする請求項1又は2に記載の方法。
- 光学信号がOES計測によって測定されることを特徴とする請求項3に記載の方法。
- コーティング源がマグネトロンスパッタリング源であることを特徴とする請求項1〜4のいずれか一項に記載の方法。
- コーティングチャンバーが、ハイパワー出力を有するDC発電機に重複する時間間隔で連続的、周期的に接続された複数のマグネトロンスパッタリング源を含んで、0.2A/cm2より大きな断続する電流密度がターゲット表面上に周期的に生じることを特徴とする請求項5に記載の方法。
- コーティング源が電気アーク蒸着源であることを特徴とする請求項1〜4のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013011072.6 | 2013-07-03 | ||
DE102013011072.6A DE102013011072A1 (de) | 2013-07-03 | 2013-07-03 | Targetpräparation |
PCT/EP2014/001783 WO2015000578A1 (de) | 2013-07-03 | 2014-06-30 | Targetpräparation |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016526605A JP2016526605A (ja) | 2016-09-05 |
JP6441329B2 true JP6441329B2 (ja) | 2018-12-19 |
Family
ID=51162686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016522329A Active JP6441329B2 (ja) | 2013-07-03 | 2014-06-30 | ターゲット作製 |
Country Status (16)
Country | Link |
---|---|
US (1) | US10053769B2 (ja) |
EP (1) | EP3017081B1 (ja) |
JP (1) | JP6441329B2 (ja) |
KR (1) | KR102233346B1 (ja) |
CN (1) | CN105392912B (ja) |
BR (1) | BR112015032167B1 (ja) |
CA (1) | CA2916773C (ja) |
DE (1) | DE102013011072A1 (ja) |
HK (1) | HK1219515A1 (ja) |
IL (1) | IL243139B (ja) |
MX (1) | MX2015017027A (ja) |
MY (1) | MY178779A (ja) |
PH (1) | PH12015502752A1 (ja) |
RU (1) | RU2016103225A (ja) |
SG (1) | SG11201510361YA (ja) |
WO (1) | WO2015000578A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110573275A (zh) * | 2017-02-13 | 2019-12-13 | 欧瑞康表面处理解决方案股份公司普费菲孔 | 通过增材制造途径合成原位金属基质纳米复合物 |
Family Cites Families (30)
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JPH01225772A (ja) * | 1988-03-04 | 1989-09-08 | Nippon Telegr & Teleph Corp <Ntt> | イオンビームスパッタ装置 |
JPH04236767A (ja) * | 1991-01-16 | 1992-08-25 | Toshiba Corp | 薄膜形成装置 |
DE4125365C1 (ja) * | 1991-07-31 | 1992-05-21 | Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De | |
DE19609804C1 (de) * | 1996-03-13 | 1997-07-31 | Bosch Gmbh Robert | Einrichtung, ihre Verwendung und ihr Betrieb zum Vakuumbeschichten von Schüttgut |
US5945214C1 (en) * | 1996-08-28 | 2002-04-23 | Premark Rwp Holdings Inc | Diboride coated pressing surfaces for abrasion resistant laminate and making pressing surfaces |
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JP4540830B2 (ja) * | 2000-10-31 | 2010-09-08 | キヤノンアネルバ株式会社 | 基板加熱機構付シャッタを有する成膜装置及び成膜方法 |
JP4436987B2 (ja) * | 2001-02-22 | 2010-03-24 | パナソニック株式会社 | 成膜方法及び装置 |
DE10312658A1 (de) * | 2003-03-21 | 2004-09-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Beschichtung flexibler Substrate mit Aluminium |
JP4541045B2 (ja) * | 2004-06-24 | 2010-09-08 | 日立ツール株式会社 | 皮膜形成方法及びその皮膜形成方法を用いた被覆部材 |
US20060042930A1 (en) * | 2004-08-26 | 2006-03-02 | Daniele Mauri | Method for reactive sputter deposition of a magnesium oxide (MgO) tunnel barrier in a magnetic tunnel junction |
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EP2050837B1 (de) * | 2006-07-26 | 2011-12-14 | Naco Technologies, SIA | Verfahren zur ionenplasmaapplikation von filmbeschichtungen und vorrichtung zur durchführung des verfahrens |
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2013
- 2013-07-03 DE DE102013011072.6A patent/DE102013011072A1/de not_active Withdrawn
-
2014
- 2014-06-30 CN CN201480038031.4A patent/CN105392912B/zh active Active
- 2014-06-30 JP JP2016522329A patent/JP6441329B2/ja active Active
- 2014-06-30 KR KR1020167002706A patent/KR102233346B1/ko active IP Right Grant
- 2014-06-30 RU RU2016103225A patent/RU2016103225A/ru not_active Application Discontinuation
- 2014-06-30 MY MYPI2015704822A patent/MY178779A/en unknown
- 2014-06-30 WO PCT/EP2014/001783 patent/WO2015000578A1/de active Application Filing
- 2014-06-30 CA CA2916773A patent/CA2916773C/en active Active
- 2014-06-30 SG SG11201510361YA patent/SG11201510361YA/en unknown
- 2014-06-30 MX MX2015017027A patent/MX2015017027A/es unknown
- 2014-06-30 EP EP14736626.4A patent/EP3017081B1/de active Active
- 2014-06-30 US US14/902,581 patent/US10053769B2/en active Active
- 2014-06-30 BR BR112015032167-4A patent/BR112015032167B1/pt active IP Right Grant
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2015
- 2015-12-09 PH PH12015502752A patent/PH12015502752A1/en unknown
- 2015-12-15 IL IL24313915A patent/IL243139B/en active IP Right Grant
-
2016
- 2016-06-29 HK HK16107561.6A patent/HK1219515A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
MY178779A (en) | 2020-10-20 |
EP3017081B1 (de) | 2020-01-08 |
BR112015032167A2 (pt) | 2017-07-25 |
CA2916773A1 (en) | 2015-01-08 |
KR20160029814A (ko) | 2016-03-15 |
WO2015000578A1 (de) | 2015-01-08 |
IL243139B (en) | 2019-11-28 |
MX2015017027A (es) | 2016-10-26 |
KR102233346B1 (ko) | 2021-03-30 |
RU2016103225A (ru) | 2017-08-08 |
US10053769B2 (en) | 2018-08-21 |
DE102013011072A1 (de) | 2015-01-08 |
CA2916773C (en) | 2021-06-01 |
JP2016526605A (ja) | 2016-09-05 |
HK1219515A1 (zh) | 2017-04-07 |
CN105392912A (zh) | 2016-03-09 |
EP3017081A1 (de) | 2016-05-11 |
CN105392912B (zh) | 2019-01-11 |
SG11201510361YA (en) | 2016-01-28 |
US20160186310A1 (en) | 2016-06-30 |
BR112015032167B1 (pt) | 2022-02-01 |
PH12015502752A1 (en) | 2016-03-14 |
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