MX2015017027A - Preparacion de objetivo. - Google Patents

Preparacion de objetivo.

Info

Publication number
MX2015017027A
MX2015017027A MX2015017027A MX2015017027A MX2015017027A MX 2015017027 A MX2015017027 A MX 2015017027A MX 2015017027 A MX2015017027 A MX 2015017027A MX 2015017027 A MX2015017027 A MX 2015017027A MX 2015017027 A MX2015017027 A MX 2015017027A
Authority
MX
Mexico
Prior art keywords
target
coating
substrates
coated
workpieces
Prior art date
Application number
MX2015017027A
Other languages
English (en)
Inventor
Krassnitzer Siegfried
Kurapov Denis
Original Assignee
Oerlikon Surface Solutions Ag Pfäffikon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oerlikon Surface Solutions Ag Pfäffikon filed Critical Oerlikon Surface Solutions Ag Pfäffikon
Publication of MX2015017027A publication Critical patent/MX2015017027A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

La presente invención se refiere a un método para recubrir piezas de trabajo, que comprende los siguientes paso: -cargar una cámara de recubrimiento con las piezas de trabajo que van a ser recubiertas; - cerrar y evacuar la cámara de recubrimiento a una presión de proceso predeterminada; - iniciar una fuente de recubrimiento, la cual comprende un objetivo como una fuente de material, con lo cual las partículas son aceleradas desde la superficie del objetivo en la dirección de los sustratos, caracterizado porque es proporcionado un escudo entre la superficie objetivo y el sustrato, hasta que el objetivo es acondicionado, los sustratos que van a ser recubiertos son al menos parcialmente sometidos a un pretratamiento intermedio.
MX2015017027A 2013-07-03 2014-06-30 Preparacion de objetivo. MX2015017027A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013011072.6A DE102013011072A1 (de) 2013-07-03 2013-07-03 Targetpräparation
PCT/EP2014/001783 WO2015000578A1 (de) 2013-07-03 2014-06-30 Targetpräparation

Publications (1)

Publication Number Publication Date
MX2015017027A true MX2015017027A (es) 2016-10-26

Family

ID=51162686

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015017027A MX2015017027A (es) 2013-07-03 2014-06-30 Preparacion de objetivo.

Country Status (16)

Country Link
US (1) US10053769B2 (es)
EP (1) EP3017081B1 (es)
JP (1) JP6441329B2 (es)
KR (1) KR102233346B1 (es)
CN (1) CN105392912B (es)
BR (1) BR112015032167B1 (es)
CA (1) CA2916773C (es)
DE (1) DE102013011072A1 (es)
HK (1) HK1219515A1 (es)
IL (1) IL243139B (es)
MX (1) MX2015017027A (es)
MY (1) MY178779A (es)
PH (1) PH12015502752A1 (es)
RU (1) RU2016103225A (es)
SG (1) SG11201510361YA (es)
WO (1) WO2015000578A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110573275A (zh) * 2017-02-13 2019-12-13 欧瑞康表面处理解决方案股份公司普费菲孔 通过增材制造途径合成原位金属基质纳米复合物

Family Cites Families (30)

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JPS54149338A (en) * 1978-05-15 1979-11-22 Anelva Corp Thin film forming method by sputtering
JPS6335774A (ja) * 1986-07-31 1988-02-16 Mitsubishi Heavy Ind Ltd 窒化ボロン皮膜のコ−テイング方法
JPH01225772A (ja) * 1988-03-04 1989-09-08 Nippon Telegr & Teleph Corp <Ntt> イオンビームスパッタ装置
JPH04236767A (ja) * 1991-01-16 1992-08-25 Toshiba Corp 薄膜形成装置
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JP4403617B2 (ja) * 1999-12-08 2010-01-27 株式会社島津製作所 スパッタリング装置
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JP4540830B2 (ja) * 2000-10-31 2010-09-08 キヤノンアネルバ株式会社 基板加熱機構付シャッタを有する成膜装置及び成膜方法
JP4436987B2 (ja) * 2001-02-22 2010-03-24 パナソニック株式会社 成膜方法及び装置
DE10312658A1 (de) * 2003-03-21 2004-09-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Beschichtung flexibler Substrate mit Aluminium
JP4541045B2 (ja) * 2004-06-24 2010-09-08 日立ツール株式会社 皮膜形成方法及びその皮膜形成方法を用いた被覆部材
US20060042930A1 (en) * 2004-08-26 2006-03-02 Daniele Mauri Method for reactive sputter deposition of a magnesium oxide (MgO) tunnel barrier in a magnetic tunnel junction
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EP2050837B1 (de) * 2006-07-26 2011-12-14 Naco Technologies, SIA Verfahren zur ionenplasmaapplikation von filmbeschichtungen und vorrichtung zur durchführung des verfahrens
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Also Published As

Publication number Publication date
MY178779A (en) 2020-10-20
EP3017081B1 (de) 2020-01-08
BR112015032167A2 (pt) 2017-07-25
CA2916773A1 (en) 2015-01-08
KR20160029814A (ko) 2016-03-15
WO2015000578A1 (de) 2015-01-08
IL243139B (en) 2019-11-28
KR102233346B1 (ko) 2021-03-30
RU2016103225A (ru) 2017-08-08
US10053769B2 (en) 2018-08-21
DE102013011072A1 (de) 2015-01-08
CA2916773C (en) 2021-06-01
JP2016526605A (ja) 2016-09-05
HK1219515A1 (zh) 2017-04-07
CN105392912A (zh) 2016-03-09
EP3017081A1 (de) 2016-05-11
CN105392912B (zh) 2019-01-11
SG11201510361YA (en) 2016-01-28
US20160186310A1 (en) 2016-06-30
JP6441329B2 (ja) 2018-12-19
BR112015032167B1 (pt) 2022-02-01
PH12015502752A1 (en) 2016-03-14

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