WO2013036018A3 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

Info

Publication number
WO2013036018A3
WO2013036018A3 PCT/KR2012/007080 KR2012007080W WO2013036018A3 WO 2013036018 A3 WO2013036018 A3 WO 2013036018A3 KR 2012007080 W KR2012007080 W KR 2012007080W WO 2013036018 A3 WO2013036018 A3 WO 2013036018A3
Authority
WO
WIPO (PCT)
Prior art keywords
processing apparatus
substrate processing
main body
cooling means
cooling
Prior art date
Application number
PCT/KR2012/007080
Other languages
English (en)
French (fr)
Other versions
WO2013036018A2 (ko
Inventor
허관선
설준호
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN201280043147.8A priority Critical patent/CN103782367B/zh
Publication of WO2013036018A2 publication Critical patent/WO2013036018A2/ko
Publication of WO2013036018A3 publication Critical patent/WO2013036018A3/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

기판 처리 장치가 개시된다. 본 발명에 따른 기판 처리 장치는 처리된 기판을 강제로 냉각시키는 냉각수단이 챔버를 형성하는 본체의 외면에 지지 설치된다. 따라서, 본체에 냉각수단을 용이하게 설치할 수 있고, 유지 보수가 용이한 효과가 있다.
PCT/KR2012/007080 2011-09-08 2012-09-04 기판 처리 장치 WO2013036018A2 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280043147.8A CN103782367B (zh) 2011-09-08 2012-09-04 基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0091425 2011-09-08
KR1020110091425A KR101275496B1 (ko) 2011-09-08 2011-09-08 기판 처리 장치

Publications (2)

Publication Number Publication Date
WO2013036018A2 WO2013036018A2 (ko) 2013-03-14
WO2013036018A3 true WO2013036018A3 (ko) 2013-05-02

Family

ID=47832697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/007080 WO2013036018A2 (ko) 2011-09-08 2012-09-04 기판 처리 장치

Country Status (4)

Country Link
KR (1) KR101275496B1 (ko)
CN (1) CN103782367B (ko)
TW (1) TW201330050A (ko)
WO (1) WO2013036018A2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101512330B1 (ko) * 2013-06-11 2015-04-15 주식회사 테라세미콘 기판처리장치
KR102401742B1 (ko) * 2015-09-17 2022-05-25 주성엔지니어링(주) 활성가스라인의 온도조절이 가능한 챔버세정장치
KR102423268B1 (ko) * 2018-02-20 2022-07-21 주식회사 원익아이피에스 기판처리 장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0142808B1 (ko) * 1993-02-12 1998-08-17 이시다 아키라 기판 냉각장치 및 기판 열처리장치
KR100716456B1 (ko) * 2004-12-29 2007-05-10 주식회사 에이디피엔지니어링 플라즈마 처리장치
KR20090106991A (ko) * 2008-04-07 2009-10-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 프로그램을 기록한 기록 매체

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3912208B2 (ja) * 2002-02-28 2007-05-09 東京エレクトロン株式会社 熱処理装置
JP4878830B2 (ja) * 2005-12-12 2012-02-15 株式会社日立国際電気 基板処理装置
KR101094279B1 (ko) * 2009-11-06 2011-12-19 삼성모바일디스플레이주식회사 가열 수단 및 이를 포함하는 기판 가공 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0142808B1 (ko) * 1993-02-12 1998-08-17 이시다 아키라 기판 냉각장치 및 기판 열처리장치
KR100716456B1 (ko) * 2004-12-29 2007-05-10 주식회사 에이디피엔지니어링 플라즈마 처리장치
KR20090106991A (ko) * 2008-04-07 2009-10-12 도쿄엘렉트론가부시키가이샤 기판 처리 장치, 기판 처리 방법 및 프로그램을 기록한 기록 매체

Also Published As

Publication number Publication date
CN103782367A (zh) 2014-05-07
KR20130027902A (ko) 2013-03-18
KR101275496B1 (ko) 2013-06-17
TW201330050A (zh) 2013-07-16
WO2013036018A2 (ko) 2013-03-14
CN103782367B (zh) 2017-02-08

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