CN103782367B - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN103782367B CN103782367B CN201280043147.8A CN201280043147A CN103782367B CN 103782367 B CN103782367 B CN 103782367B CN 201280043147 A CN201280043147 A CN 201280043147A CN 103782367 B CN103782367 B CN 103782367B
- Authority
- CN
- China
- Prior art keywords
- board treatment
- supported
- external surface
- substrate board
- discharge pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 63
- 238000001816 cooling Methods 0.000 claims abstract description 31
- 239000000112 cooling gas Substances 0.000 claims description 21
- 239000007789 gas Substances 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 17
- 238000010521 absorption reaction Methods 0.000 claims description 15
- 230000008676 import Effects 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 3
- 239000000057 synthetic resin Substances 0.000 claims description 3
- 230000008439 repair process Effects 0.000 abstract description 3
- 238000012423 maintenance Methods 0.000 abstract 1
- 230000008020 evaporation Effects 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110091425A KR101275496B1 (ko) | 2011-09-08 | 2011-09-08 | 기판 처리 장치 |
| KR10-2011-0091425 | 2011-09-08 | ||
| PCT/KR2012/007080 WO2013036018A2 (ko) | 2011-09-08 | 2012-09-04 | 기판 처리 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103782367A CN103782367A (zh) | 2014-05-07 |
| CN103782367B true CN103782367B (zh) | 2017-02-08 |
Family
ID=47832697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280043147.8A Active CN103782367B (zh) | 2011-09-08 | 2012-09-04 | 基板处理装置 |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101275496B1 (ko) |
| CN (1) | CN103782367B (ko) |
| TW (1) | TW201330050A (ko) |
| WO (1) | WO2013036018A2 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101512330B1 (ko) * | 2013-06-11 | 2015-04-15 | 주식회사 테라세미콘 | 기판처리장치 |
| KR102401742B1 (ko) * | 2015-09-17 | 2022-05-25 | 주성엔지니어링(주) | 활성가스라인의 온도조절이 가능한 챔버세정장치 |
| KR102423268B1 (ko) * | 2018-02-20 | 2022-07-21 | 주식회사 원익아이피에스 | 기판처리 장치 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051596A (zh) * | 2009-11-06 | 2011-05-11 | 三星移动显示器株式会社 | 加热单元和具有加热单元的基板处理装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06244095A (ja) * | 1993-02-12 | 1994-09-02 | Dainippon Screen Mfg Co Ltd | 基板冷却装置 |
| JP3912208B2 (ja) * | 2002-02-28 | 2007-05-09 | 東京エレクトロン株式会社 | 熱処理装置 |
| KR100716456B1 (ko) * | 2004-12-29 | 2007-05-10 | 주식회사 에이디피엔지니어링 | 플라즈마 처리장치 |
| JP4878830B2 (ja) * | 2005-12-12 | 2012-02-15 | 株式会社日立国際電気 | 基板処理装置 |
| JP5015847B2 (ja) * | 2008-04-07 | 2012-08-29 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法、プログラムならびに記録媒体 |
-
2011
- 2011-09-08 KR KR1020110091425A patent/KR101275496B1/ko active IP Right Grant
-
2012
- 2012-09-04 CN CN201280043147.8A patent/CN103782367B/zh active Active
- 2012-09-04 WO PCT/KR2012/007080 patent/WO2013036018A2/ko active Application Filing
- 2012-09-05 TW TW101132339A patent/TW201330050A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102051596A (zh) * | 2009-11-06 | 2011-05-11 | 三星移动显示器株式会社 | 加热单元和具有加热单元的基板处理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013036018A3 (ko) | 2013-05-02 |
| WO2013036018A2 (ko) | 2013-03-14 |
| KR20130027902A (ko) | 2013-03-18 |
| KR101275496B1 (ko) | 2013-06-17 |
| TW201330050A (zh) | 2013-07-16 |
| CN103782367A (zh) | 2014-05-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Gyeonggi Do, South Korea Patentee after: (yuan) iron and steel thermal semiconductor Address before: Gyeonggi Do, South Korea Patentee before: Terra Semiconductor Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190328 Address after: South Korea Gyeonggi Do Ping Ze Zhenwei Zhenwei group produced 75 road surface Patentee after: Yuanyi IPS Corp. Address before: Gyeonggi Do, South Korea Patentee before: (yuan) iron and steel thermal semiconductor |
|
| TR01 | Transfer of patent right |