JP6420259B2 - 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置 - Google Patents

半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置 Download PDF

Info

Publication number
JP6420259B2
JP6420259B2 JP2015556898A JP2015556898A JP6420259B2 JP 6420259 B2 JP6420259 B2 JP 6420259B2 JP 2015556898 A JP2015556898 A JP 2015556898A JP 2015556898 A JP2015556898 A JP 2015556898A JP 6420259 B2 JP6420259 B2 JP 6420259B2
Authority
JP
Japan
Prior art keywords
semiconductor die
movable
insertion member
tool
tool portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2015556898A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016507164A5 (cg-RX-API-DMAC7.html
JP2016507164A (ja
Inventor
ベイエル，ヨハネス コルネリス デ
ベイエル，ヨハネス コルネリス デ
ヘンドリクス アントニウス ウィルヘルムス ルッテン，ミヒール
ヘンドリクス アントニウス ウィルヘルムス ルッテン，ミヒール
ホイジング，ヘル
ルイス テオドール ホーデマーカー，マイク
ルイス テオドール ホーデマーカー，マイク
Original Assignee
ボッシュマン テクノロジーズ ビーヴイ
ボッシュマン テクノロジーズ ビーヴイ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ボッシュマン テクノロジーズ ビーヴイ, ボッシュマン テクノロジーズ ビーヴイ filed Critical ボッシュマン テクノロジーズ ビーヴイ
Publication of JP2016507164A publication Critical patent/JP2016507164A/ja
Publication of JP2016507164A5 publication Critical patent/JP2016507164A5/ja
Application granted granted Critical
Publication of JP6420259B2 publication Critical patent/JP6420259B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/82—Hydraulic or pneumatic circuits
    • B29C2045/822—Pneumatic circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015556898A 2013-02-06 2014-02-05 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置 Active JP6420259B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2010252A NL2010252C2 (en) 2013-02-06 2013-02-06 Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus.
NL2010252 2013-02-06
PCT/NL2014/050069 WO2014123413A1 (en) 2013-02-06 2014-02-05 Semiconductor die encapsulation or carrier-mounting method, and corresponding semiconductor die encapsulation or carrier-mounting apparatus

Publications (3)

Publication Number Publication Date
JP2016507164A JP2016507164A (ja) 2016-03-07
JP2016507164A5 JP2016507164A5 (cg-RX-API-DMAC7.html) 2017-01-26
JP6420259B2 true JP6420259B2 (ja) 2018-11-07

Family

ID=47891868

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015556898A Active JP6420259B2 (ja) 2013-02-06 2014-02-05 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置

Country Status (8)

Country Link
US (1) US9536760B2 (cg-RX-API-DMAC7.html)
EP (1) EP2954550B1 (cg-RX-API-DMAC7.html)
JP (1) JP6420259B2 (cg-RX-API-DMAC7.html)
KR (1) KR102205248B1 (cg-RX-API-DMAC7.html)
CN (1) CN105247671B (cg-RX-API-DMAC7.html)
NL (1) NL2010252C2 (cg-RX-API-DMAC7.html)
TW (1) TWI642118B (cg-RX-API-DMAC7.html)
WO (1) WO2014123413A1 (cg-RX-API-DMAC7.html)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9947561B2 (en) * 2016-03-07 2018-04-17 Asm Technology Singapore Pte Ltd Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump
JP6079925B1 (ja) * 2016-03-30 2017-02-15 第一精工株式会社 樹脂封止装置及び樹脂封止装置の異常検知方法
IT201700000191A1 (it) 2017-01-02 2018-07-02 Amx Automatrix S R L Pressa e metodo di sinterizzazione di componenti elettronici su un substrato
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
US11227779B2 (en) 2017-09-12 2022-01-18 Asm Technology Singapore Pte Ltd Apparatus and method for processing a semiconductor device
DE102017216545A1 (de) 2017-09-19 2018-11-29 Conti Temic Microelectronic Gmbh Vorrichtung und Verfahren zur Herstellung einer Niedertemperatur-Drucksinterverbindung für eine elektronische Baugruppe
CN112106452A (zh) * 2018-05-08 2020-12-18 W.L.戈尔及同仁股份有限公司 可拉伸和不可拉伸基材上的柔性且耐久性印刷电路
NL2021137B1 (en) * 2018-06-15 2019-12-20 Boschman Tech Bv Sintering Process Product Carrier
IT201800006846A1 (it) * 2018-07-02 2020-01-02 Gruppo di pressatura per una pressa di sinterizzazione di componenti elettronici su un substrato
IT201800007256A1 (it) * 2018-07-17 2020-01-17 Organo pressore, gruppo di pressatura e pressa di sinterizzazione di componenti elettronici su un substrato
CN113039052B (zh) 2018-11-16 2023-09-05 惠普发展公司，有限责任合伙企业 引线框架装配件及引线框架的两步模制成型方法
JP6667879B1 (ja) * 2018-12-19 2020-03-18 アサヒ・エンジニアリング株式会社 電子部品の実装装置
DE102018133434B4 (de) 2018-12-21 2021-03-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats
DE102018133420A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018010352B4 (de) 2018-12-21 2021-05-12 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
DE102018133456A1 (de) 2018-12-21 2020-06-25 Rogers Germany Gmbh Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats
JP2020119983A (ja) * 2019-01-23 2020-08-06 トヨタ自動車株式会社 半導体素子接合装置、及び半導体素子接合方法
JP6762578B2 (ja) * 2019-02-09 2020-09-30 アサヒ・エンジニアリング株式会社 電子部品実装装置
NL2024038B1 (en) 2019-10-17 2021-06-22 Boschman Tech B V Component Processing Apparatus, such as a Pressure Sintering Apparatus or a Component Encapsulation Apparatus
KR102196397B1 (ko) * 2020-05-13 2020-12-30 제엠제코(주) 메탈포스트, 이를 포함하는 반도체 패키지 및 반도체 패키지 제조방법
DE102020114442A1 (de) 2020-05-29 2021-12-02 Danfoss Silicon Power Gmbh Halbleiterbauelement
DE102020207343A1 (de) 2020-06-15 2021-12-16 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung optischer und/oder optoelektronischer Systeme mit verbesserter Wärmeabfuhr und verbesserter thermischer und/oder mechanischer Stabilität, sowie mittels dieses Verfahrens erhaltene optische und/oder optoelektronische Systeme
US11676937B2 (en) * 2021-05-04 2023-06-13 Asmpt Singapore Pte. Ltd. Flexible sinter tool for bonding semiconductor devices
US12072251B2 (en) * 2022-03-01 2024-08-27 Asmpt Singapore Pte. Ltd. Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device
CN116631917B (zh) * 2023-07-19 2023-12-19 江苏快克芯装备科技有限公司 气压膜压接装置
AT527921B1 (de) 2024-04-25 2025-08-15 Smt Maschinen Und Vertriebs Gmbh & Co Kg Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL193526C (nl) 1991-02-26 2000-01-04 Boschman Tech Bv Inrichting voor het omhullen van elektronische onderdelen met een kunststof.
JP3026550B2 (ja) * 1996-05-07 2000-03-27 富士通株式会社 半導体装置の製造方法
SG64937A1 (en) * 1996-06-21 2000-08-22 Advanced Systems Automation Wedge device for linear force amplification in a press
JPH11121479A (ja) * 1997-10-17 1999-04-30 Fujitsu Ltd 半導体部品の実装方法および実装装置
TW341171U (en) * 1998-01-16 1998-09-21 Li-Li Chen A platform radial dissipation forming mold
EP1238775B1 (en) * 1999-12-16 2006-03-08 Dai-Ichi Seiko Co. Ltd. Resin sealing mold
JP2002110744A (ja) * 2000-09-26 2002-04-12 Matsushita Electric Ind Co Ltd 半導体実装装置、および半導体実装方法
EP1220309A1 (en) * 2000-12-28 2002-07-03 STMicroelectronics S.r.l. Manufacturing method of an electronic device package
JP2003133706A (ja) * 2001-10-22 2003-05-09 Matsushita Electric Ind Co Ltd 圧着装置および圧着方法
JP4017480B2 (ja) * 2002-09-24 2007-12-05 Ｔｏｗａ株式会社 樹脂封止金型
JP2005026608A (ja) * 2003-07-02 2005-01-27 Tokyo Electron Ltd 接合方法および接合装置
JP2006156796A (ja) * 2004-11-30 2006-06-15 Towa Corp 半導体チップの樹脂封止成形方法、及び、装置
US7520052B2 (en) * 2005-06-27 2009-04-21 Texas Instruments Incorporated Method of manufacturing a semiconductor device
EP1939926B1 (en) * 2005-10-12 2012-03-21 Murata Manufacturing Co. Ltd. Bonding apparatus
JP2007317738A (ja) * 2006-05-23 2007-12-06 Matsushita Electric Ind Co Ltd 部品圧着実装機の加重測定方法と装置、それらを用いた部品圧着実装機
US7948034B2 (en) * 2006-06-22 2011-05-24 Suss Microtec Lithography, Gmbh Apparatus and method for semiconductor bonding
JP2008192725A (ja) * 2007-02-02 2008-08-21 Spansion Llc 半導体装置及びその製造方法並びに半導体装置の製造装置
JP5070896B2 (ja) * 2007-03-19 2012-11-14 富士通セミコンダクター株式会社 電子部品の樹脂封止方法、樹脂封止用金型及び半導体装置の製造方法
CN100576478C (zh) * 2007-09-29 2009-12-30 南茂科技股份有限公司 晶粒重新配置的封装方法
WO2009119096A1 (ja) * 2008-03-27 2009-10-01 株式会社ニコン 接合装置および接合方法
US8125061B2 (en) * 2009-09-03 2012-02-28 Advanced Semiconductor Engineering, Inc. Semiconductor package and method of manufacturing the same
JP5906528B2 (ja) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 モールド金型及びこれを用いた樹脂モールド装置
JP5777660B2 (ja) * 2013-05-17 2015-09-09 アサヒ・エンジニアリング株式会社 樹脂成形装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
US9536760B2 (en) 2017-01-03
EP2954550B1 (en) 2017-06-28
KR20150136476A (ko) 2015-12-07
WO2014123413A1 (en) 2014-08-14
TWI642118B (zh) 2018-11-21
EP2954550A1 (en) 2015-12-16
TW201438117A (zh) 2014-10-01
NL2010252C2 (en) 2014-08-07
US20150371880A1 (en) 2015-12-24
CN105247671B (zh) 2017-12-22
JP2016507164A (ja) 2016-03-07
CN105247671A (zh) 2016-01-13
KR102205248B1 (ko) 2021-01-21

Similar Documents

Publication Publication Date Title
JP6420259B2 (ja) 半導体ダイ封入又は実装方法及び対応する半導体ダイ封入又は実装装置
US7915089B2 (en) Encapsulation method
KR102332745B1 (ko) 열압착 본딩 시스템 및 열압착 본딩 시스템 작동 방법
TWI682512B (zh) 熱壓結合器及其操作方法，以及用於細間距覆晶組裝的互連方法
JP6861609B2 (ja) 樹脂成形装置及び樹脂成形品の製造方法
CN102403238B (zh) 用于制造半导体芯片面板的方法
KR102527948B1 (ko) 수지 성형 장치 및 수지 성형품의 제조 방법
US7352039B2 (en) Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device
JP2005303251A (ja) 集積回路のパッケージ方法
CN103367171A (zh) 分配工具、工具包以及制造半导体器件的方法
US11049839B2 (en) Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
WO2022029916A1 (ja) 実装装置及び実装方法
JP2001024011A (ja) 半導体装置の製造方法およびそれに使用されるポッティング装置
TWI900462B (zh) 接合工具及接合機
TWI360187B (en) Method and device for encapsulating electronic com
TWI581379B (zh) 用於至少部份地封裝具有電子零件之閉合平坦載體的裝置及方法
CN120527245A (zh) 激光辅助键合装置和将半导体裸片键合到衬底上的方法
TW201817526A (zh) 助焊系統、包括助焊系統的接合機及其操作方法
TW201019425A (en) Encapsulating mold and encapsulating method
TW202541204A (zh) 鐳射輔助鍵合裝置和將半導體裸片鍵合到襯底上的方法
KR20150118792A (ko) 와이어 본딩 장치
KR20090066593A (ko) 플립칩 본딩장치 및 플립칩 본딩방법
JPH03190199A (ja) アウターリードのボンディングヘッド及びボンディング方法
WO2009072861A2 (en) Packaging method for micromechanical device

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161209

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161209

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171006

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171128

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180427

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180911

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20181011

R150 Certificate of patent or registration of utility model

Ref document number: 6420259

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250