TWI642118B - 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 - Google Patents
半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 Download PDFInfo
- Publication number
- TWI642118B TWI642118B TW103103948A TW103103948A TWI642118B TW I642118 B TWI642118 B TW I642118B TW 103103948 A TW103103948 A TW 103103948A TW 103103948 A TW103103948 A TW 103103948A TW I642118 B TWI642118 B TW I642118B
- Authority
- TW
- Taiwan
- Prior art keywords
- displaceable
- semiconductor die
- force
- semiconductor
- tool
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 189
- 238000000034 method Methods 0.000 title claims abstract description 52
- 238000005538 encapsulation Methods 0.000 title description 5
- 238000003780 insertion Methods 0.000 claims abstract description 73
- 230000037431 insertion Effects 0.000 claims abstract description 73
- 238000004806 packaging method and process Methods 0.000 claims abstract description 21
- 238000011068 loading method Methods 0.000 claims abstract description 16
- 239000012530 fluid Substances 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000005022 packaging material Substances 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 8
- 238000012806 monitoring device Methods 0.000 claims description 5
- 239000012528 membrane Substances 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000007779 soft material Substances 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- 230000006378 damage Effects 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/82—Hydraulic or pneumatic circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/82—Hydraulic or pneumatic circuits
- B29C2045/822—Pneumatic circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2628—Moulds with mould parts forming holes in or through the moulded article, e.g. for bearing cages
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2010252A NL2010252C2 (en) | 2013-02-06 | 2013-02-06 | Semiconductor product processing method, including a semiconductor product encapsulation method and a semiconductor product carrier-mounting method, and corresponding semiconductor product processing apparatus. |
| ??2010252 | 2013-02-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201438117A TW201438117A (zh) | 2014-10-01 |
| TWI642118B true TWI642118B (zh) | 2018-11-21 |
Family
ID=47891868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103103948A TWI642118B (zh) | 2013-02-06 | 2014-02-06 | 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9536760B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2954550B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6420259B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102205248B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN105247671B (cg-RX-API-DMAC7.html) |
| NL (1) | NL2010252C2 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI642118B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2014123413A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9947561B2 (en) * | 2016-03-07 | 2018-04-17 | Asm Technology Singapore Pte Ltd | Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump |
| JP6079925B1 (ja) * | 2016-03-30 | 2017-02-15 | 第一精工株式会社 | 樹脂封止装置及び樹脂封止装置の異常検知方法 |
| IT201700000191A1 (it) | 2017-01-02 | 2018-07-02 | Amx Automatrix S R L | Pressa e metodo di sinterizzazione di componenti elettronici su un substrato |
| JP6304517B1 (ja) * | 2017-02-14 | 2018-04-04 | 第一精工株式会社 | 樹脂封止方法及び樹脂封止装置 |
| US11227779B2 (en) | 2017-09-12 | 2022-01-18 | Asm Technology Singapore Pte Ltd | Apparatus and method for processing a semiconductor device |
| DE102017216545A1 (de) | 2017-09-19 | 2018-11-29 | Conti Temic Microelectronic Gmbh | Vorrichtung und Verfahren zur Herstellung einer Niedertemperatur-Drucksinterverbindung für eine elektronische Baugruppe |
| CN112106452A (zh) * | 2018-05-08 | 2020-12-18 | W.L.戈尔及同仁股份有限公司 | 可拉伸和不可拉伸基材上的柔性且耐久性印刷电路 |
| NL2021137B1 (en) * | 2018-06-15 | 2019-12-20 | Boschman Tech Bv | Sintering Process Product Carrier |
| IT201800006846A1 (it) * | 2018-07-02 | 2020-01-02 | Gruppo di pressatura per una pressa di sinterizzazione di componenti elettronici su un substrato | |
| IT201800007256A1 (it) * | 2018-07-17 | 2020-01-17 | Organo pressore, gruppo di pressatura e pressa di sinterizzazione di componenti elettronici su un substrato | |
| CN113039052B (zh) | 2018-11-16 | 2023-09-05 | 惠普发展公司，有限责任合伙企业 | 引线框架装配件及引线框架的两步模制成型方法 |
| JP6667879B1 (ja) * | 2018-12-19 | 2020-03-18 | アサヒ・エンジニアリング株式会社 | 電子部品の実装装置 |
| DE102018133434B4 (de) | 2018-12-21 | 2021-03-25 | Rogers Germany Gmbh | Verfahren zum Verkapseln mindestens eines Trägersubstrats |
| DE102018133420A1 (de) | 2018-12-21 | 2020-06-25 | Rogers Germany Gmbh | Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats |
| DE102018010352B4 (de) | 2018-12-21 | 2021-05-12 | Rogers Germany Gmbh | Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats |
| DE102018133456A1 (de) | 2018-12-21 | 2020-06-25 | Rogers Germany Gmbh | Verfahren zum Verkapseln mindestens eines Trägersubstrats, Elektronikmodul und Werkzeug zum Verkapseln eines Trägersubstrats |
| JP2020119983A (ja) * | 2019-01-23 | 2020-08-06 | トヨタ自動車株式会社 | 半導体素子接合装置、及び半導体素子接合方法 |
| JP6762578B2 (ja) * | 2019-02-09 | 2020-09-30 | アサヒ・エンジニアリング株式会社 | 電子部品実装装置 |
| NL2024038B1 (en) | 2019-10-17 | 2021-06-22 | Boschman Tech B V | Component Processing Apparatus, such as a Pressure Sintering Apparatus or a Component Encapsulation Apparatus |
| KR102196397B1 (ko) * | 2020-05-13 | 2020-12-30 | 제엠제코(주) | 메탈포스트, 이를 포함하는 반도체 패키지 및 반도체 패키지 제조방법 |
| DE102020114442A1 (de) | 2020-05-29 | 2021-12-02 | Danfoss Silicon Power Gmbh | Halbleiterbauelement |
| DE102020207343A1 (de) | 2020-06-15 | 2021-12-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung optischer und/oder optoelektronischer Systeme mit verbesserter Wärmeabfuhr und verbesserter thermischer und/oder mechanischer Stabilität, sowie mittels dieses Verfahrens erhaltene optische und/oder optoelektronische Systeme |
| US11676937B2 (en) * | 2021-05-04 | 2023-06-13 | Asmpt Singapore Pte. Ltd. | Flexible sinter tool for bonding semiconductor devices |
| US12072251B2 (en) * | 2022-03-01 | 2024-08-27 | Asmpt Singapore Pte. Ltd. | Force measurement device and method for bonding or encapsulation process and apparatus incorporating the device |
| CN116631917B (zh) * | 2023-07-19 | 2023-12-19 | 江苏快克芯装备科技有限公司 | 气压膜压接装置 |
| AT527921B1 (de) | 2024-04-25 | 2025-08-15 | Smt Maschinen Und Vertriebs Gmbh & Co Kg | Zylinderplatte einer Vorrichtung zum Verbinden eines Bauelements mit einem Substrat |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030569A (en) * | 1996-06-21 | 2000-02-29 | Advanced Systems Automation Limited | Packaging process using a wedge device for linear force amplification in a press |
| US6196821B1 (en) * | 1998-01-16 | 2001-03-06 | Lily Chen | Mold assembly for injection molding flat-type heat sinks |
| TW201110303A (en) * | 2009-09-03 | 2011-03-16 | Advanced Semiconductor Eng | Semiconductor package and method of manufacturing the same |
| US20130028998A1 (en) * | 2011-07-29 | 2013-01-31 | Masanori Maekawa | Molding die set and resin molding apparatus having the same |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL193526C (nl) | 1991-02-26 | 2000-01-04 | Boschman Tech Bv | Inrichting voor het omhullen van elektronische onderdelen met een kunststof. |
| JP3026550B2 (ja) * | 1996-05-07 | 2000-03-27 | 富士通株式会社 | 半導体装置の製造方法 |
| JPH11121479A (ja) * | 1997-10-17 | 1999-04-30 | Fujitsu Ltd | 半導体部品の実装方法および実装装置 |
| EP1238775B1 (en) * | 1999-12-16 | 2006-03-08 | Dai-Ichi Seiko Co. Ltd. | Resin sealing mold |
| JP2002110744A (ja) * | 2000-09-26 | 2002-04-12 | Matsushita Electric Ind Co Ltd | 半導体実装装置、および半導体実装方法 |
| EP1220309A1 (en) * | 2000-12-28 | 2002-07-03 | STMicroelectronics S.r.l. | Manufacturing method of an electronic device package |
| JP2003133706A (ja) * | 2001-10-22 | 2003-05-09 | Matsushita Electric Ind Co Ltd | 圧着装置および圧着方法 |
| JP4017480B2 (ja) * | 2002-09-24 | 2007-12-05 | Ｔｏｗａ株式会社 | 樹脂封止金型 |
| JP2005026608A (ja) * | 2003-07-02 | 2005-01-27 | Tokyo Electron Ltd | 接合方法および接合装置 |
| JP2006156796A (ja) * | 2004-11-30 | 2006-06-15 | Towa Corp | 半導体チップの樹脂封止成形方法、及び、装置 |
| US7520052B2 (en) * | 2005-06-27 | 2009-04-21 | Texas Instruments Incorporated | Method of manufacturing a semiconductor device |
| EP1939926B1 (en) * | 2005-10-12 | 2012-03-21 | Murata Manufacturing Co. Ltd. | Bonding apparatus |
| JP2007317738A (ja) * | 2006-05-23 | 2007-12-06 | Matsushita Electric Ind Co Ltd | 部品圧着実装機の加重測定方法と装置、それらを用いた部品圧着実装機 |
| US7948034B2 (en) * | 2006-06-22 | 2011-05-24 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor bonding |
| JP2008192725A (ja) * | 2007-02-02 | 2008-08-21 | Spansion Llc | 半導体装置及びその製造方法並びに半導体装置の製造装置 |
| JP5070896B2 (ja) * | 2007-03-19 | 2012-11-14 | 富士通セミコンダクター株式会社 | 電子部品の樹脂封止方法、樹脂封止用金型及び半導体装置の製造方法 |
| CN100576478C (zh) * | 2007-09-29 | 2009-12-30 | 南茂科技股份有限公司 | 晶粒重新配置的封装方法 |
| WO2009119096A1 (ja) * | 2008-03-27 | 2009-10-01 | 株式会社ニコン | 接合装置および接合方法 |
| JP5777660B2 (ja) * | 2013-05-17 | 2015-09-09 | アサヒ・エンジニアリング株式会社 | 樹脂成形装置及び半導体装置の製造方法 |
-
2013
- 2013-02-06 NL NL2010252A patent/NL2010252C2/en not_active IP Right Cessation
-
2014
- 2014-02-05 US US14/766,161 patent/US9536760B2/en active Active
- 2014-02-05 CN CN201480015287.3A patent/CN105247671B/zh active Active
- 2014-02-05 JP JP2015556898A patent/JP6420259B2/ja active Active
- 2014-02-05 EP EP14703936.6A patent/EP2954550B1/en active Active
- 2014-02-05 KR KR1020157024180A patent/KR102205248B1/ko active Active
- 2014-02-05 WO PCT/NL2014/050069 patent/WO2014123413A1/en not_active Ceased
- 2014-02-06 TW TW103103948A patent/TWI642118B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6030569A (en) * | 1996-06-21 | 2000-02-29 | Advanced Systems Automation Limited | Packaging process using a wedge device for linear force amplification in a press |
| US6196821B1 (en) * | 1998-01-16 | 2001-03-06 | Lily Chen | Mold assembly for injection molding flat-type heat sinks |
| TW201110303A (en) * | 2009-09-03 | 2011-03-16 | Advanced Semiconductor Eng | Semiconductor package and method of manufacturing the same |
| US20130028998A1 (en) * | 2011-07-29 | 2013-01-31 | Masanori Maekawa | Molding die set and resin molding apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| US9536760B2 (en) | 2017-01-03 |
| EP2954550B1 (en) | 2017-06-28 |
| KR20150136476A (ko) | 2015-12-07 |
| WO2014123413A1 (en) | 2014-08-14 |
| EP2954550A1 (en) | 2015-12-16 |
| TW201438117A (zh) | 2014-10-01 |
| NL2010252C2 (en) | 2014-08-07 |
| US20150371880A1 (en) | 2015-12-24 |
| JP6420259B2 (ja) | 2018-11-07 |
| CN105247671B (zh) | 2017-12-22 |
| JP2016507164A (ja) | 2016-03-07 |
| CN105247671A (zh) | 2016-01-13 |
| KR102205248B1 (ko) | 2021-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI642118B (zh) | 半導體晶粒封裝或載體裝載方法與相應的半導體晶粒封裝或載體裝載設備 | |
| US12224208B2 (en) | Method of separating electronic devices having a back layer and apparatus | |
| KR102332745B1 (ko) | 열압착 본딩 시스템 및 열압착 본딩 시스템 작동 방법 | |
| JP6861609B2 (ja) | 樹脂成形装置及び樹脂成形品の製造方法 | |
| KR102522168B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
| US20030194833A1 (en) | Method and apparatus for underfilling semiconductor devices | |
| JP6525805B2 (ja) | モールド金型及びモールド装置 | |
| CN104103530A (zh) | 电子元件的压缩树脂封装方法及压缩树脂封装装置 | |
| US10096502B2 (en) | Method and apparatus for assembling and testing a multi-integrated circuit package | |
| KR102527948B1 (ko) | 수지 성형 장치 및 수지 성형품의 제조 방법 | |
| US7352039B2 (en) | Methods and apparatuses for microelectronic assembly having a material with a variable viscosity around a MEMS device | |
| JP2010214595A (ja) | 樹脂封止装置 | |
| JP2018202737A (ja) | 樹脂モールド金型及び樹脂モールド装置 | |
| WO2018100807A1 (ja) | 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法 | |
| WO2018100808A1 (ja) | 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法 | |
| TWI743241B (zh) | 助焊系統、包括助焊系統的接合機及其操作方法 | |
| TWI360187B (en) | Method and device for encapsulating electronic com | |
| KR20090066593A (ko) | 플립칩 본딩장치 및 플립칩 본딩방법 | |
| CN120527245A (zh) | 激光辅助键合装置和将半导体裸片键合到衬底上的方法 | |
| KR20110026151A (ko) | 솔더 범프 형성 장치 |