JP6397045B2 - モバイル端末 - Google Patents
モバイル端末 Download PDFInfo
- Publication number
- JP6397045B2 JP6397045B2 JP2016557014A JP2016557014A JP6397045B2 JP 6397045 B2 JP6397045 B2 JP 6397045B2 JP 2016557014 A JP2016557014 A JP 2016557014A JP 2016557014 A JP2016557014 A JP 2016557014A JP 6397045 B2 JP6397045 B2 JP 6397045B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- holder
- mobile terminal
- region
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (11)
- 熱放出要素と、
ホルダと、
前記ホルダを囲むサイドフレームと、
を備え、
前記ホルダは、熱伝導領域および断熱領域を備え、
前記断熱領域は、前記熱伝導領域と前記ホルダの端部との間に設けられ、前記断熱領域は前記熱伝導領域に隣接し、
前記熱放出要素が前記熱伝導領域に近接し、
前記断熱領域は、少なくとも1つの断熱キャビティを有する、モバイル端末。 - 前記断熱領域は前記熱放出要素を前記サイドフレームから分離する、請求項1に記載のモバイル端末。
- 前記断熱キャビティは真空であるか、または空気で充填されている、請求項1または2に記載のモバイル端末。
- 前記断熱キャビティは低熱伝導材料を有し、
前記低熱伝導材料は、0〜0.026W/m・Kの熱伝導率の範囲を有する、請求項1から3のいずれか1項に記載のモバイル端末。 - 前記断熱キャビティは、少なくとも1つのストリップ形状の穴または少なくとも1つの楕円状の穴である、請求項3または4に記載のモバイル端末。
- 前記断熱キャビティの領域は、前記断熱領域の少なくとも50%の領域を占める、請求項3または4に記載のモバイル端末。
- 前記断熱領域は、低熱伝導材料から形成され、前記低熱伝導材料は、0〜0.026W/m・Kの熱伝導率の範囲を有する、請求項1から6のいずれか1項に記載のモバイル端末。
- 前記ホルダの材料は、熱伝導材料である、請求項1から7のいずれか1項に記載のモバイル端末。
- 前記ホルダは、ディスプレイスクリーンホルダである、請求項1から8のいずれか一項に記載のモバイル端末。
- 前記断熱領域が前記ホルダの前記端部に沿って延びるサイズは、前記熱伝導領域のサイズよりも大きい、請求項1から9のいずれか一項に記載のモバイル端末。
- 前記断熱領域は、前記断熱領域の端部に設けられる少なくとも1つの溝を有する、請求項1から10のいずれか一項に記載のモバイル端末。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2014/073815 WO2015139285A1 (zh) | 2014-03-21 | 2014-03-21 | 支架和移动终端 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018161782A Division JP6591013B2 (ja) | 2018-08-30 | 2018-08-30 | モバイル端末 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017511643A JP2017511643A (ja) | 2017-04-20 |
JP6397045B2 true JP6397045B2 (ja) | 2018-09-26 |
Family
ID=54143701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016557014A Active JP6397045B2 (ja) | 2014-03-21 | 2014-03-21 | モバイル端末 |
Country Status (6)
Country | Link |
---|---|
US (2) | US9910468B2 (ja) |
EP (2) | EP3107362B1 (ja) |
JP (1) | JP6397045B2 (ja) |
KR (2) | KR101953333B1 (ja) |
CN (2) | CN105611984B (ja) |
WO (1) | WO2015139285A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102483238B1 (ko) * | 2016-08-01 | 2022-12-30 | 삼성전자 주식회사 | 방열 장치 및 이를 구비하는 전자 장치 |
KR20180081272A (ko) * | 2017-01-06 | 2018-07-16 | 삼성전자주식회사 | 방열 구조 및 그를 포함하는 전자 장치 |
CN106879226A (zh) * | 2017-01-20 | 2017-06-20 | 努比亚技术有限公司 | 一种控制壳体温度的装置和电子设备 |
US10831249B2 (en) * | 2017-03-02 | 2020-11-10 | Huawei Technologies Co., Ltd. | Heat conduction component and mobile terminal |
CN107592763A (zh) * | 2017-09-29 | 2018-01-16 | 深圳传音制造有限公司 | 一种隔热结构、移动终端以及隔热方法 |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2997273B2 (ja) | 1989-05-29 | 2000-01-11 | 西部電機株式会社 | ステージ可動支持装置 |
JPH0498030U (ja) * | 1991-01-12 | 1992-08-25 | ||
US5581443A (en) | 1994-09-14 | 1996-12-03 | Kabushiki Kaisha Toshiba | Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure |
JP3876491B2 (ja) * | 1997-02-27 | 2007-01-31 | 三菱電機株式会社 | 真空断熱パネル及びその製造方法並びにそれを用いた冷蔵庫 |
JPH11143584A (ja) * | 1997-11-07 | 1999-05-28 | Pfu Ltd | 携帯端末装置の放熱構造 |
JP3601282B2 (ja) | 1998-01-20 | 2004-12-15 | 株式会社日立製作所 | ノート形コンピュータ |
JP3366244B2 (ja) * | 1998-02-04 | 2003-01-14 | 富士通株式会社 | 電子機器 |
US6414844B1 (en) | 1999-09-03 | 2002-07-02 | Matsushita Electric Industrial Co., Ltd. | Portable information processing apparatus |
JP3656822B2 (ja) | 1999-09-03 | 2005-06-08 | 松下電器産業株式会社 | 携帯型情報処理装置 |
TW470837B (en) * | 2000-04-21 | 2002-01-01 | Matsushita Refrigeration | Vacuum heat insulator |
JP2001308137A (ja) | 2000-04-26 | 2001-11-02 | Matsushita Electric Works Ltd | 半導体装置及びその製造方法 |
US6859364B2 (en) * | 2000-06-06 | 2005-02-22 | Matsushita Refrigeration Company | Portable information appliance |
US6570086B1 (en) | 2000-06-06 | 2003-05-27 | Mitsubishi Denki Kabushiki Kaisha | Cooling structure of communication device |
JP2003188323A (ja) * | 2001-12-19 | 2003-07-04 | Sony Corp | グラファイトシート及びその製造方法 |
US20030161132A1 (en) | 2002-02-05 | 2003-08-28 | Mitsubishi Denki Kabushiki Kaisha | Communication device |
JP3559035B2 (ja) * | 2002-12-05 | 2004-08-25 | 松下冷機株式会社 | 真空断熱材およびその製造方法、並びに真空断熱材を使用した防寒具およびパーソナルコンピューター |
US7188484B2 (en) * | 2003-06-09 | 2007-03-13 | Lg Electronics Inc. | Heat dissipating structure for mobile device |
US7292441B2 (en) | 2003-11-25 | 2007-11-06 | Advanced Energy Technology Inc. | Thermal solution for portable electronic devices |
JP2005277163A (ja) | 2004-03-25 | 2005-10-06 | Kyocera Corp | 配線基板 |
JP2006165154A (ja) * | 2004-12-06 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 熱伝導部材 |
CN100543353C (zh) * | 2004-12-07 | 2009-09-23 | 松下电器产业株式会社 | 真空隔热件及其制造方法、及使用其的隔热箱体 |
JP4487799B2 (ja) * | 2005-02-25 | 2010-06-23 | 株式会社日立製作所 | 恒温輸送容器 |
US7603205B2 (en) * | 2006-08-22 | 2009-10-13 | Brilliant Telecommmunications, Inc. | Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing |
JP5179746B2 (ja) | 2006-11-22 | 2013-04-10 | 京セラ株式会社 | 携帯端末装置 |
US7486517B2 (en) * | 2006-12-20 | 2009-02-03 | Nokia Corporation | Hand-held portable electronic device having a heat spreader |
CN201115242Y (zh) | 2007-09-20 | 2008-09-10 | 深圳华为通信技术有限公司 | 基于用户满意度的电子产品散热装置 |
CN201114231Y (zh) | 2007-07-02 | 2008-09-10 | 华为技术有限公司 | 一种防止用户敏感面温升的移动终端 |
WO2009003411A1 (fr) * | 2007-07-02 | 2009-01-08 | Huawei Technologies Co., Ltd. | Terminal mobile empêchant une élévation de température de surface sensible par l'utilisateur |
CN201278544Y (zh) * | 2008-09-12 | 2009-07-22 | 中兴通讯股份有限公司 | 无线通讯终端模块 |
WO2010032484A1 (ja) | 2008-09-22 | 2010-03-25 | パナソニック株式会社 | 携帯電子機器 |
JP2010165728A (ja) | 2009-01-13 | 2010-07-29 | Kyocera Corp | 多層基板及び携帯通信機器 |
JP2010251386A (ja) * | 2009-04-10 | 2010-11-04 | Nec Corp | 熱拡散部材を備える電子機器、熱拡散部材を備える電子機器の製法及び熱拡散部材 |
JP5327024B2 (ja) * | 2009-12-03 | 2013-10-30 | 三菱エンジニアリングプラスチックス株式会社 | 放熱部付き二色成形品及び発熱体付き機器 |
CN201550395U (zh) * | 2009-12-10 | 2010-08-11 | 华为终端有限公司 | 无线终端和壳体 |
US8391010B2 (en) * | 2010-08-19 | 2013-03-05 | Apple Inc. | Internal frame optimized for stiffness and heat transfer |
JP2011042575A (ja) | 2010-11-22 | 2011-03-03 | Nichias Corp | 無機繊維質成形体及びその製造方法 |
US8537553B2 (en) | 2011-02-14 | 2013-09-17 | Futurewei Technologies, Inc. | Devices having anisotropic conductivity heatsinks, and methods of making thereof |
CN202003615U (zh) * | 2011-03-14 | 2011-10-05 | 华为终端有限公司 | 一种显示屏散热装置 |
WO2011150874A2 (zh) | 2011-06-14 | 2011-12-08 | 华为终端有限公司 | 具有隔热结构的装置 |
WO2013018553A1 (ja) | 2011-07-29 | 2013-02-07 | 日本電気株式会社 | 携帯型電子機器 |
CN102427159A (zh) * | 2011-08-12 | 2012-04-25 | 华为终端有限公司 | 无线终端及其天线架 |
JP5067497B2 (ja) | 2011-09-28 | 2012-11-07 | 富士通株式会社 | 表示装置、ディスプレイパネルユニット、および情報処理装置 |
CN202335181U (zh) | 2011-10-11 | 2012-07-11 | 捷开通讯科技(上海)有限公司 | 电子装置的散热结构及电子装置 |
DE102011117490A1 (de) * | 2011-10-27 | 2013-05-02 | Asia Vital Components Co., Ltd. | Vapor-Chamber-Kühler und Verfahren zu dessen Herstellung |
EP2806418A4 (en) | 2012-01-16 | 2015-12-16 | Nec Corp | MOBILE TERMINAL DEVICE |
WO2013108312A1 (ja) * | 2012-01-16 | 2013-07-25 | Necカシオモバイルコミュニケーションズ株式会社 | 携帯端末装置 |
JP2013150067A (ja) | 2012-01-17 | 2013-08-01 | Kyocera Corp | 携帯端末カバー |
JP2013214868A (ja) * | 2012-04-02 | 2013-10-17 | Sharp Corp | 携帯情報端末 |
CN102711416B (zh) | 2012-05-24 | 2015-10-21 | 中兴通讯股份有限公司 | 散热处理装置及移动终端 |
KR102003453B1 (ko) * | 2012-06-20 | 2019-07-24 | 엘지전자 주식회사 | 단말기 |
CN203086894U (zh) | 2012-12-31 | 2013-07-24 | 青岛海信移动通信技术股份有限公司 | 隔热金属机壳及便携式移动终端 |
CN103151318A (zh) | 2013-03-07 | 2013-06-12 | 北京中石伟业科技股份有限公司 | 电子设备中发热芯片与壳体之间的散热管理系统及方法 |
CN103209574B (zh) * | 2013-04-24 | 2017-04-12 | 惠州Tcl移动通信有限公司 | 一种移动终端的散热装置、方法及移动终端 |
CN203327471U (zh) | 2013-07-23 | 2013-12-04 | 奇鋐科技股份有限公司 | 散热结构及具有该散热结构的手持式电子装置 |
CN105830548B (zh) * | 2013-10-31 | 2017-12-01 | 阿莫绿色技术有限公司 | 散热部件及具有其的便携式终端 |
US9578791B1 (en) * | 2015-08-17 | 2017-02-21 | Asia Vital Components Co., Ltd. | Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure |
US10019046B2 (en) * | 2015-08-17 | 2018-07-10 | Asia Vital Components Co., Ltd. | Internal frame structure with heat insulation effect and electronic apparatus with the internal frame structure |
US9690341B2 (en) * | 2015-09-04 | 2017-06-27 | Asia Vital Components Co., Ltd. | Heat insulation structure for hand-held device and hand-held device with same |
KR102483238B1 (ko) * | 2016-08-01 | 2022-12-30 | 삼성전자 주식회사 | 방열 장치 및 이를 구비하는 전자 장치 |
-
2014
- 2014-03-21 EP EP14886101.6A patent/EP3107362B1/en active Active
- 2014-03-21 CN CN201480005568.0A patent/CN105611984B/zh active Active
- 2014-03-21 EP EP18182424.4A patent/EP3461248B1/en active Active
- 2014-03-21 CN CN201810011916.5A patent/CN108055815B/zh active Active
- 2014-03-21 KR KR1020187025285A patent/KR101953333B1/ko active IP Right Grant
- 2014-03-21 WO PCT/CN2014/073815 patent/WO2015139285A1/zh active Application Filing
- 2014-03-21 KR KR1020167027927A patent/KR102089472B1/ko active IP Right Grant
- 2014-03-21 US US15/127,705 patent/US9910468B2/en active Active
- 2014-03-21 JP JP2016557014A patent/JP6397045B2/ja active Active
-
2018
- 2018-01-23 US US15/878,017 patent/US10481654B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3107362A1 (en) | 2016-12-21 |
CN108055815B (zh) | 2020-04-21 |
CN105611984B (zh) | 2018-01-16 |
US10481654B2 (en) | 2019-11-19 |
KR101953333B1 (ko) | 2019-02-28 |
CN105611984A (zh) | 2016-05-25 |
US9910468B2 (en) | 2018-03-06 |
CN108055815A (zh) | 2018-05-18 |
KR20180100274A (ko) | 2018-09-07 |
WO2015139285A1 (zh) | 2015-09-24 |
EP3107362A4 (en) | 2016-12-28 |
US20170139452A1 (en) | 2017-05-18 |
US20180150115A1 (en) | 2018-05-31 |
JP2017511643A (ja) | 2017-04-20 |
EP3107362B1 (en) | 2018-09-19 |
EP3461248A1 (en) | 2019-03-27 |
KR20160130845A (ko) | 2016-11-14 |
EP3461248B1 (en) | 2022-07-06 |
KR102089472B1 (ko) | 2020-03-16 |
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